Abstract: The device has a package with a base plate, and at least two terminal pins perpendicularly protruding from the base plate of the package. At least one of the terminal pins is a high-frequency terminal pin that transmits a high-frequency signal. The device has a flexible conductor arrangement with a plurality of interconnects. The conductor arrangement provides an electrical connection between the terminal pins of the package and electrical contacts of a printed circuit board. The conductor arrangement has contact regions for electrically connecting the interconnects to a terminal pin and to a contact of a printed circuit board. At least the region of the conductor arrangement that provides a connection to high-frequency terminal pin lies in a plane aligned substantially perpendicular to the plane of the base plate.

Abstract: The arrangement has at least two electrooptic transducers (1, 2) with in each case one optically active zone (1a, 2a). Optical connections (12, 14) which are assigned to the transducers are adjacent at a spacing (a). Optical coupling paths (8, 9) run via a coupling device (6) between the connections (12, 14) and the respectively assigned optically active zones (1a, 2a) In order in the case of a very tight spacing (a) to permit a favorable crosstalk response and a cost effective design, the coupling paths (8, 9) run in such a way that the spacing (A) between two optically active zones (1a, 2a) is greater than the spacing (a).

Abstract: A module has on a front side a coupling socket for holding an optical fiber end, and at a rear side has a holding region for an electro optical component. The component is firstly prefixed in a position of maximum optical coupling by optical irradiation of an adhesive that can be cured both by light and by heat. After the prefixing, a permanent connection is made by thermal curing the adhesive in a temporally and/or spatially separate subsequent production step.

Abstract: On a front side, a module has a coupling socket for holding an optical fiber end, and at a rear side the module has a holding region in which an electrooptical component is fixed. A joint gap, filled with an adhesive, between the component and the holding region extends in a plane which is oriented perpendicular to the longitudinal axis of the coupling socket. The component and/or the holding region is provided with openings, which lead to the joint gap and taper toward the joint gap, and are introduced into the adhesive.

Abstract: The electro-optical module has a substrate with a mounting surface that is free from depressions. A surface-mounted component unit is disosed on the mounting surface. The component unit contains as integral components an electro-optical component and a lens which are aligned directly with one another. The surface serves, furthermore, as a reference plane for assembling a receptacle for an optical fiber plug.