Abstract: A coupling unit for coupling an optical transmitting and/or receiving module to an optical fiber connector. The coupling unit has a connecting region, which can be connected to a transmitting and/or receiving module, a receiving region, which receives an optical fiber connector, and a glass component, via which light is coupled directly between an optical fiber inserted into the receiving region and a coupled-on transmitting and/or receiving module. In this case, the coupling unit is formed as a plastic part apart from the glass component. The glass component is introduced into a bore in the plastic part.

Abstract: A coupling unit for coupling an optical transmitting and/or receiving module to an optical fiber connector. The coupling unit has a connecting region, which can be connected to a transmitting and/or receiving module, a receiving region, which receives an optical fiber connector, and a glass component, via which light is coupled directly between an optical fiber inserted into the receiving region and a coupled-on transmitting and/or receiving module. In this case, the coupling unit is formed as a plastic part apart from the glass component. The glass component is introduced into a bore in the plastic part.

Abstract: The device has a package with a base plate, and at least two terminal pins perpendicularly protruding from the base plate of the package. At least one of the terminal pins is a high-frequency terminal pin that transmits a high-frequency signal. The device has a flexible conductor arrangement with a plurality of interconnects. The conductor arrangement provides an electrical connection between the terminal pins of the package and electrical contacts of a printed circuit board. The conductor arrangement has contact regions for electrically connecting the interconnects to a terminal pin and to a contact of a printed circuit board. At least the region of the conductor arrangement that provides a connection to high-frequency terminal pin lies in a plane aligned substantially perpendicular to the plane of the base plate.

Abstract: The invention relates to a device for connecting the terminal pins of a package for an optical transmitting and/or receiving device to a printed circuit board, having: a package with a base plate; at least two terminal pins, which respectively protrude perpendicularly from the base plate of the package, at least one of the terminal pins being a high-frequency terminal pin which transmits a high-frequency signal; a flexible conductor arrangement with a plurality of interconnects, the conductor arrangement providing an electrical connection between the terminal pins of the package and electrical contacts of a printed circuit board; and contact regions of the conductor arrangement for the electrical connection of the interconnects respectively on the one hand to a terminal pin and on the other hand to a contact of a printed circuit board, at least that region of the conductor arrangement which provides a connection to the at least one high-frequency terminal pin lying in a plane which is aligned substantially pe

Abstract: A connecting system for detachably mechanically connecting an electronic component to a support is described. The connecting system has fixed rails that are configured on the longitudinal sides of the support. When the connecting system is assembled, at least two grips on each longitudinal side of the electronic component grip under the fixing rails. Each fixing rail has at least one hole allowing the grips to be introduced vertically in relation to the support, in a direction Y, with the grips advancing in direction Z. The holes are configured in such a way that the advancing grips can pass through them during assembly without leaving the support.

Abstract: A transducer module for transmitting and/or receiving light has at least one optical semiconductor which is electrically connected to contacts which are provided on a bottom side of a baseplate. The at least one optical semiconductor is provided such that the light can be transmitted in a transmitting direction away from a top side of the baseplate, and that the light can be received in a receiving direction toward the top side of the baseplate. The contacts are provided through the use of conductor tracks which are electrically insulated from the baseplate and are constructed on a printed circuit board substrate. A method for producing a transducer module is also provided.

Abstract: A module has on a front side a coupling socket for holding an optical fiber end, and at a rear side has a holding region for an electro optical component. The component is firstly prefixed in a position of maximum optical coupling by optical irradiation of an adhesive that can be cured both by light and by heat. After the prefixing, a permanent connection is made by thermal curing the adhesive in a temporally and/or spatially separate subsequent production step.

Abstract: On a front side, a module has a coupling socket for holding an optical fiber end, and at a rear side the module has a holding region in which an electrooptical component is fixed. A joint gap, filled with an adhesive, between the component and the holding region extends in a plane which is oriented perpendicular to the longitudinal axis of the coupling socket. The component and/or the holding region is provided with openings, which lead to the joint gap and taper toward the joint gap, and are introduced into the adhesive.

Abstract: An optical module includes a holding body for an optical component. The holding body is accommodated in a housing and provided with a flange. A plastic U-shaped latching device is held on the holding body and includes a base part having tongues with catches. In order to provide the module with a high reverse bending strength with reference to the tongues, the latching device is held on the flange with the aid of nose-like attachments of the housing in a transition region between the respective tongue and the base part.

Abstract: The electro-optical module has a substrate with a mounting surface that is free from depressions. A surface-mounted component unit is disosed on the mounting surface. The component unit contains as integral components an electro-optical component and a lens which are aligned directly with one another. The surface serves, furthermore, as a reference plane for assembling a receptacle for an optical fiber plug.

Abstract: The electro-optical module has a substrate with a mounting surface that is free from depressions. A surface-mounted component unit is disosed on the mounting surface. The component unit contains as integral components an electro-optical component and a lens which are aligned directly with one another. The surface serves, furthermore, as a reference plane for assembling a receptacle for an optical fiber plug.