Patents by Inventor Frank Morsink

Frank Morsink has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10519031
    Abstract: A MEMS sensor including a housing defining an interior and an inlet in fluid communication with an environment for sensing, a sensing die coupled to the housing for generating a signal based on the environment, an encapsulant is applied to the sensing die to protect the sensing die without interfering with the operation of the sensing die, characterized in that the encapsulant is a composition of a non-crosslinked substance having an organic backbone, and a silica thickener.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: December 31, 2019
    Assignee: Sensata Technologies, Inc.
    Inventors: Frank Morsink, Rijk Lorenzo
  • Publication number: 20180134545
    Abstract: A MEMS sensor including a housing defining an interior and an inlet in fluid communication with an environment for sensing, a sensing die coupled to the housing for generating a signal based on the environment, an encapsulant is applied to the sensing die to protect the sensing die without interfering with the operation of the sensing die, characterized in that the encapsulant is a composition of a non-crosslinked substance having an organic backbone, and a silica thickener.
    Type: Application
    Filed: November 10, 2017
    Publication date: May 17, 2018
    Inventors: Frank Morsink, Rijk Lorenzo
  • Patent number: 7992441
    Abstract: A pressure sensor module is disclosed. The pressure sensor module comprises a sensing element (1) mounted on a front side (3) of a support member (5). The support member (5) comprises a hole (7) through the support member (5) from the front side (3) to a back side (9). The sensing element (1) covers the hole (7) at the front side (3). A back side barrier (6) provided at the back side (9) of the support member (5) surrounds a surface of the back side (9) of the support member (5) and forms an enclosed area (8), wherein the enclosed area (8) and the hole (7) form a pressure channel (10). A back side protective member (2) fills the hole (7) and at least partially the enclosed area (8). The support member (5), back side barrier (6) and back side protective member (2) form a module that can be placed during production of the pressure sensor in a housing of the pressure sensor.
    Type: Grant
    Filed: July 16, 2009
    Date of Patent: August 9, 2011
    Assignee: Sensata Technologies, Inc.
    Inventors: Sean P. Mulligan, Frank Morsink, Jun Bae, Gerald Spijksma, Tom te Boekhorst
  • Publication number: 20100024563
    Abstract: A pressure sensor module is disclosed. The pressure sensor module comprises a sensing element (1) mounted on a front side (3) of a support member (5). The support member (5) comprises a hole (7) through the support member (5) from the front side (3) to a back side (9). The sensing element (1) covers the hole (7) at the front side (3). A back side barrier (6) provided at the back side (9) of the support member (5) surrounds a surface of the back side (9) of the support member (5) and forms an enclosed area (8), wherein the enclosed area (8) and the hole (7) form a pressure channel (10). A back side protective member (2) fills the hole (7) and at least partially the enclosed area (8). The support member (5), back side barrier (6) and back side protective member (2) form a module that can be placed during production of the pressure sensor in a housing of the pressure sensor.
    Type: Application
    Filed: July 16, 2009
    Publication date: February 4, 2010
    Inventors: Sean P. Mulligan, Frank Morsink, Jun Bae, Gerald Spijksma, Tom te Boekhorst