Patents by Inventor Frank Mucklich

Frank Mucklich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11239593
    Abstract: An electrically conductive contact element for an electrical connector comprises a contact surface having a plurality of caverns arranged under the contact surface in a microstructure and an auxiliary material filled in the plurality of caverns.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: February 1, 2022
    Assignees: TE Connectivity Germany GmbH, Steinbeiss-Forschungszentrum
    Inventors: Michael Leidner, Frank Mucklich, Leander Reinert, Herr Kim Eric Trinh Quoc, Helge Schmidt, Stefan Thoss
  • Patent number: 10774437
    Abstract: For improving the current transfer during the electrolytic metallization of workpieces, a method is proposed: (a) providing a metal depositing apparatus 17, in which the workpiece, at least one anode 40, 41 and a metal deposition electrolyte AE are arranged and which has a device for electric current generation 60 and at least one current feeding device 31 with in each case at least one electrical contact element 34, 35 for making electrical contact with the workpiece; (b) bringing the at least one electrical contact element 34, 35 into contact with the workpiece; and (c) feeding electric current to the workpiece via the at least one electrical contact element 34, 35 in order that the deposition metal deposits on the workpiece. Before method step (b), in a further method step (d), deposition metal is deposited on the at least one electrical contact element 34, 35.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: September 15, 2020
    Assignee: Atotech Deutschland GmbH
    Inventors: Dominik Britz, Bernd Schmitt, Bernd Böse, Frank Mücklich, Christian Selzner
  • Publication number: 20190173214
    Abstract: An electrically conductive contact element for an electrical connector comprises a contact surface having a plurality of caverns arranged under the contact surface in a microstructure and an auxiliary material filled in the plurality of caverns.
    Type: Application
    Filed: February 8, 2019
    Publication date: June 6, 2019
    Applicants: TE Connectivity Germany GmbH, Steinbeiss-Forschungszentrum
    Inventors: Michael Leidner, Frank Mucklich, Leander Reinert, Herr Kim Eric Trinh Quoc, Helge Schmidt, Stefan Thoss
  • Publication number: 20170335485
    Abstract: For improving the current transfer during the electrolytic metallization of workpieces, a method is proposed: (a) providing a metal depositing apparatus 17, in which the workpiece, at least one anode 40, 41 and a metal deposition electrolyte AE are arranged and which has a device for electric current generation 60 and at least one current feeding device 31 with in each case at least one electrical contact element 34, 35 for making electrical contact with the workpiece; (b) bringing the at least one electrical contact element 34, 35 into contact with the workpiece; and (c) feeding electric current to the workpiece via the at least one electrical contact element 34, 35 in order that the deposition metal deposits on the workpiece. Before method step (b), in a further method step (d), deposition metal is deposited on the at least one electrical contact element 34, 35.
    Type: Application
    Filed: August 7, 2017
    Publication date: November 23, 2017
    Applicant: Atotech Deutschland GmbH
    Inventors: Dominik Britz, Bernd Schmitt, Bernd Böse, Frank Mücklich, Christian Selzner
  • Patent number: 9745665
    Abstract: For improving the current transfer during the electrolytic metallization of workpieces, a method is proposed: (a) providing a metal depositing apparatus 17, in which the workpiece, at least one anode 40, 41 and a metal deposition electrolyte AE are arranged and which has a device for electric current generation 60 and at least one current feeding device 31 with in each case at least one electrical contact element 34, 35 for making electrical contact with the workpiece; (b) bringing the at least one electrical contact element 34, 35 into contact with the workpiece; and (c) feeding electric current to the workpiece via the at least one electrical contact element 34, 35 in order that the deposition metal deposits on the workpiece. Before method step (b), in a further method step (d), deposition metal is deposited on the at least one electrical contact element 34, 35.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: August 29, 2017
    Assignee: ATOTECH DEUTSCHLAND GmbH
    Inventors: Dominik Britz, Bernd Schmitt, Bernd Böse, Frank Mücklich, Christian Selzner
  • Publication number: 20150096895
    Abstract: For improving the current transfer during the electrolytic metallization of workpieces, a method is proposed: (a) providing a metal depositing apparatus 17, in which the workpiece, at least one anode 40, 41 and a metal deposition electrolyte AE are arranged and which has a device for electric current generation 60 and at least one current feeding device 31 with in each case at least one electrical contact element 34, 35 for making electrical contact with the workpiece; (b) bringing the at least one electrical contact element 34, 35 into contact with the workpiece; and (c) feeding electric current to the workpiece via the at least one electrical contact element 34, 35 in order that the deposition metal deposits on the workpiece. Before method step (b), in a further method step (d), deposition metal is deposited on the at least one electrical contact element 34, 35.
    Type: Application
    Filed: April 16, 2013
    Publication date: April 9, 2015
    Applicant: Atotech Deutschland GmbH
    Inventors: Dominik Britz, Bernd Schmitt, Bernd Böse, Frank Mücklich, Christian Selzner
  • Patent number: 7063896
    Abstract: A method is proposed for preparing a structured metallic surface of a body or for the structuring close to the surface or the generation of metallic structures, first of all on a first metal layer or on a first intermetallic layer a second metal layer or a second intermetallic layer, the second layers differing from the first layers, being generated; and thereafter at least the second metal layer or the second intermetallic layer being heated up region by region in such a way that, in that location, there is formed an intermetallic compound using the material of the first intermetallic layer or the first metal layer and the material of the second metal layer or the second intermetallic layer, into which surface regions are embedded, which are at least essentially made of the material of the second metal layer or the second intermetallic layer.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: June 20, 2006
    Assignee: Robert Bosch GmbH
    Inventors: Frank Mücklich, Harald Schorr, Peter Rehbein
  • Publication number: 20050048308
    Abstract: A method is proposed for preparing a structured metallic surface of a body or for the structuring close to the surface or the generation of metallic structures, first of all on a first metal layer or on a first intermetallic layer a second metal layer or a second intermetallic layer, the second layers differing from the first layers, being generated; and thereafter at least the second metal layer or the second intermetallic layer being heated up region by region in such a way that, in that location, there is formed an intermetallic compound using the material of the first intermetallic layer or the first metal layer and the material of the second metal layer or the second intermetallic layer, into which surface regions are embedded, which are at least essentially made of the material of the second metal layer or the second intermetallic layer.
    Type: Application
    Filed: February 19, 2002
    Publication date: March 3, 2005
    Inventors: Frank Mucklich, Harald Schorr, Peter Rehbein