Patents by Inventor Frank Mucklich

Frank Mucklich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical contact element for an electrical connector having microstructured caverns under the contact surface
    Patent number: 11239593
    Abstract: An electrically conductive contact element for an electrical connector comprises a contact surface having a plurality of caverns arranged under the contact surface in a microstructure and an auxiliary material filled in the plurality of caverns.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: February 1, 2022
    Assignees: TE Connectivity Germany GmbH, Steinbeiss-Forschungszentrum
    Inventors: Michael Leidner, Frank Mucklich, Leander Reinert, Herr Kim Eric Trinh Quoc, Helge Schmidt, Stefan Thoss
  • Electrical Contact Element For An Electrical Connector Having Microstructured Caverns Under The Contact Surface
    Publication number: 20190173214
    Abstract: An electrically conductive contact element for an electrical connector comprises a contact surface having a plurality of caverns arranged under the contact surface in a microstructure and an auxiliary material filled in the plurality of caverns.
    Type: Application
    Filed: February 8, 2019
    Publication date: June 6, 2019
    Applicants: TE Connectivity Germany GmbH, Steinbeiss-Forschungszentrum
    Inventors: Michael Leidner, Frank Mucklich, Leander Reinert, Herr Kim Eric Trinh Quoc, Helge Schmidt, Stefan Thoss
  • Metallic surface of a body, method for producing a structured metallic surface of a body and the use thereof
    Publication number: 20050048308
    Abstract: A method is proposed for preparing a structured metallic surface of a body or for the structuring close to the surface or the generation of metallic structures, first of all on a first metal layer or on a first intermetallic layer a second metal layer or a second intermetallic layer, the second layers differing from the first layers, being generated; and thereafter at least the second metal layer or the second intermetallic layer being heated up region by region in such a way that, in that location, there is formed an intermetallic compound using the material of the first intermetallic layer or the first metal layer and the material of the second metal layer or the second intermetallic layer, into which surface regions are embedded, which are at least essentially made of the material of the second metal layer or the second intermetallic layer.
    Type: Application
    Filed: February 19, 2002
    Publication date: March 3, 2005
    Inventors: Frank Mucklich, Harald Schorr, Peter Rehbein