Patents by Inventor Frank Piersanti

Frank Piersanti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6829513
    Abstract: The present invention provides an application which is used to program building systems such as fire safety systems. It is an object of the invention to provide a method for creating one or more configuration files for the control panel of a fire safety system to allow the control panel to more efficiently control the fire safety system. The present provides a method for creating one or more system configurations. The configuration file may be comprised of one or more user created views.
    Type: Grant
    Filed: July 19, 2002
    Date of Patent: December 7, 2004
    Assignee: Siemens Building Technologies, Inc.
    Inventors: Frank Piersanti, Tien Nguyen, Reto Hug
  • Publication number: 20030050713
    Abstract: The present invention provides an application which is used to program building systems such as fire safety systems. It is an object of the invention to provide a method for creating one or more configuration files for the control panel of a fire safety system to allow the control panel to more efficiently control the fire safety system. The present provides a method for creating one or more system configurations. The configuration file may be comprised of one or more user created views.
    Type: Application
    Filed: July 19, 2002
    Publication date: March 13, 2003
    Inventors: Frank Piersanti, Tien Nguyen, Reto Hug
  • Patent number: 4907128
    Abstract: A process for bonding electrical terminals of an integrated circuit chip to conductive regions of a multilayered circuit board is disclosed, along with the resulting multilayer module. The process comprises forming a plurality of circuit board layers and stacking them to define a well area therein. The well area having a base defined by one of the circuit board layers and sidewalls defined by vertical edge portions of a plurality of the remaining circuit board layers, the conductive patterns having conductive termination regions formed adjacent to the vertical edge portions. Conductive vertical vias are formed along vertical edge portions of a plurality of circuit board layers in electrical communication with the conductive termination regions. Flexible conductive strips are applied to the integrated circuit in electrical communication with the integrated circuit terminals.
    Type: Grant
    Filed: December 15, 1988
    Date of Patent: March 6, 1990
    Assignee: Grumman Aerospace Corporation
    Inventors: Allen L. Solomon, Sus Mayemura, Frank Piersanti