Patents by Inventor Frank Pompeo
Frank Pompeo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20080076690Abstract: A depolymerization cleaning solution, and method of using such solution, for removing undesirable thermoset polymer sealants residing on electronic components to provide such components with a clean seal surface for a subsequent rework process. The depolymerization cleaning solution includes a premixed metal hydroxide or amino onium salt saturated solution having a surfactant. It is particularly useful for the localized deposition and removal of thermoset polymer sealants, such as polysiloxanes, within sealband areas of the components, which have been applied on such components with different levels of chemical inertness. The material set and method disclosed in the present invention are the basis for a low cost electronic package adhesive rework process.Type: ApplicationFiled: October 2, 2007Publication date: March 27, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Patrick Coico, James Covell, Brenda Peterson, Frank Pompeo, Deborah Sylvester, Tsong-Lin Tai, Jaimal Williamson, Jiali Wu
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Publication number: 20080000988Abstract: A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier, one or more integrated circuit chips attached to the chip carrier, and a cap structure attached to the chip carrier, covering the one or more integrated circuit chips. A conductive grid structure is formed in the chip carrier and cap structure, the conductive structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction. The conductive grid structure is configured so as to detect an attempt to penetrate the IC module.Type: ApplicationFiled: June 26, 2007Publication date: January 3, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Mukta Farooq, Benjamin Fasano, Jason Frankel, Harvey Hamel, Suresh Kadakia, David Long, Frank Pompeo, Sudipta Ray
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Publication number: 20070271775Abstract: Disclosed is an apparatus for separating interconnects between, for example, a card and a substrate. The apparatus includes one or more rotationally biased (e.g., spring-loaded, etc.) partial-circle structures (e.g., blades, squeegee, plow, etc.) and one or more temperature-sensitive releases connected to the partial-circle structures. The partial-circle structures are positioned to rotate and separate the interconnects when released by the temperature-sensitive releases. The invention can also include solder reservoirs positioned to receive solder from the interconnects separated by the partial-circle structures.Type: ApplicationFiled: August 15, 2007Publication date: November 29, 2007Inventors: Mukta Farooq, Ray Jackson, David Linnell, Frank Pompeo
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Publication number: 20070252288Abstract: Under the present invention, a semiconductor chip is electrically connected to a substrate (e.g., organic, ceramic, etc.) by an interposer structure. The interposer structure comprises an elastomeric, compliant material that includes metallurgic through connections having a predetermined shape. In a typical embodiment, the metallurgical through connections electrically connect an under bump metallization of the semiconductor chip to a top surface metallization of the substrate. By utilizing the interposer structure in accordance with the present invention, the problems associated with previous semiconductor module designs are alleviated.Type: ApplicationFiled: July 3, 2007Publication date: November 1, 2007Inventors: MUKTA FAROOQ, John Knickerbocker, Frank Pompeo, Subhash Shinde
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Publication number: 20060231633Abstract: A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier, one or more integrated circuit chips attached to the chip carrier, and a cap structure attached to the chip carrier, covering the one or more integrated circuit chips. A conductive grid structure is formed in the chip carrier and cap structure, the conductive structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction. The conductive grid structure is configured so as to detect an attempt to penetrate the IC module.Type: ApplicationFiled: April 14, 2005Publication date: October 19, 2006Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Mukta Farooq, Benjamin Fasano, Jason Frankel, Harvey Hamel, Suresh Kadakia, David Long, Frank Pompeo, Sudipta Ray
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Publication number: 20060182397Abstract: An optoelectronic assembly for an electronic system includes a thermally conductive, metallized transparent substrate having a first surface and an opposite second surface. A support chip set is bonded to the second surface of the transparent substrate. A first substrate is in communication with the transparent substrate via the metallized second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support chip set, and an optical signaling medium having one end with an optical fiber array aligned with the transducer is substantially normal to the first surface of the transparent substrate. The support chip set and the transducer share a common thermal path for cooling.Type: ApplicationFiled: April 11, 2006Publication date: August 17, 2006Applicant: International Business Machines CorporationInventors: Alan Benner, How Lin, Frank Pompeo, Subhash Shinde
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Publication number: 20060104031Abstract: A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the electronic component. The spray manifold is sealed over the opening to define a spray area over a back surface of the electronic component. The spray manifold sprays a cooling fluid on the back surface. The sealing member seals the annular region so that input/output connectors on the component carrier are isolated from the cooling fluid.Type: ApplicationFiled: November 16, 2004Publication date: May 18, 2006Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Evan Colgan, Frank Pompeo, Glenn Daves, Hilton Toy, Bruce Furman, David Edwards, Michael Gaynes, Mukta Farooq, Sung Kang, Steven Ostrander, Jaimal Williamson, Da-Yuan Shih, Donald Henderson
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Publication number: 20060060636Abstract: A method for assembling, and the resultant electronic module, includes attaching a chip to a substrate using a first solder interconnection array, and attaching a board to the substrate using a second solder interconnection array, which may be a single-melt or a dual-melt solder array. The second solder interconnection array resides entirely within a space defined between the board and substrate. A creep resistant structure is provided within this space for maintaining the defined space and optimizing integrity of the second solder interconnection array. The creep resistant structure may include an underfill material, balls, brackets, frames, collars or combinations thereof. Wherein the creep resistant structure is an underfill material, it is crucial that the substrate be attached to the board before either entirely encapsulating the second interconnection array with underfill material, or partially encapsulating the second solder interconnection array at discrete locations with underfill material.Type: ApplicationFiled: September 22, 2004Publication date: March 23, 2006Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Glenn Daves, David Edwards, Mukta Farooq, Frank Pompeo
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Publication number: 20050156310Abstract: An optoelectronic assembly for an electronic system includes a transparent substrate having a first surface and an opposite second surface, the transparent substrate being thermally conductive and being metallized on the surface. A support electronic chip set is configured for at least one of providing multiplexing, demultiplexing, coding, decoding and optoelectronic transducer driving and receive functions and is bonded to the second surface of the transparent substrate. A first substrate having a first surface and an opposite second surface, is in communication with the transparent substrate via the metallized second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips.Type: ApplicationFiled: January 14, 2004Publication date: July 21, 2005Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Alan Benner, How Lin, Frank Pompeo, Subhash Shinde
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Publication number: 20050110160Abstract: Under the present invention, a semiconductor chip is electrically connected to a substrate (e.g., organic, ceramic, etc.) by an interposer structure. The interposer structure comprises an elastomeric, compliant material that includes metallurgic through connections having a predetermined shape. In a typical embodiment, the metallurgical through connections electrically connect an under bump metallization of the semiconductor chip to a top surface metallization of the substrate. By utilizing the interposer structure in accordance with the present invention, the problems associated with previous semiconductor module designs are alleviated.Type: ApplicationFiled: November 25, 2003Publication date: May 26, 2005Applicant: International Business Machines CorporationInventors: Mukta Faroog, John Knickerbocker, Frank Pompeo, Subhash Shinde
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Publication number: 20050071993Abstract: Disclosed is an apparatus for separating interconnects between, for example, a card and a substrate. The apparatus includes one or more rotationally biased (e.g., spring-loaded, etc.) partial-circle structures (e.g., blades, squeegee, plow, etc.) and one or more temperature-sensitive releases connected to the partial-circle structures. The partial-circle structures are positioned to rotate and separate the interconnects when released by the temperature-sensitive releases. The invention can also include solder reservoirs positioned to receive solder from the interconnects separated by the partial-circle structures.Type: ApplicationFiled: October 7, 2003Publication date: April 7, 2005Inventors: Mukta Farooq, Ray Jackson, David Linnell, Frank Pompeo
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Publication number: 20050066995Abstract: A depolymerization cleaning solution, and method of using such solution, for removing undesirable thermoset polymer sealants residing on electronic components to provide such components with a clean seal surface for a subsequent rework process. The depolymerization cleaning solution includes a premixed metal hydroxide or amino onium salt saturated solution having a surfactant. It is particularly useful for the localized deposition and removal of thermoset polymer sealants, such as polysiloxanes, within sealband areas of the components, which have been applied on such components with different levels of chemical inertness. The material set and method disclosed in the present invention are the basis for a low cost electronic package adhesive rework process.Type: ApplicationFiled: September 30, 2003Publication date: March 31, 2005Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Patrick Coico, James Covell, Brenda Peterson, Frank. Pompeo, Deborah Sylvester, Tsong-Lin Tai, Jaimal Williamson, Jiali Wu
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Publication number: 20050025434Abstract: An optoelectronic assembly for a computer system includes an electronic chip(s), a substrate, an electrical signaling medium, an optoelectronic transducer, and an optical coupling guide. The electronic chip(s) is in communication with the substrate, which is in communication with a first end of the electrical signaling medium. A second end of the electrical signaling medium is in communication with the optoelectronic transducer, and includes the optical coupling guide for aligning an optical signaling medium with the optoelectronic transducer. An electrical signal from the electronic chip is communicated to the optoelectronic transducer via the substrate and the electrical signaling medium. The optical transducer and electronic chip(s) share a common heat spreader, and communication to other groups of electronic chip(s) is done without the need for communication via a second level electrical package.Type: ApplicationFiled: July 31, 2003Publication date: February 3, 2005Applicant: International Business Machines CorporationInventors: Alan Benner, Evan Colgan, How Lin, John Magerlein, Frank Pompeo, Subhash Shinde, Daniel Stigliani