Patents by Inventor Frank Puschner
Frank Puschner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240078406Abstract: A chip arrangement including a chip module which includes a chip, a contact-based interface in accordance with ISO 7816 which is electrically conductively connected to the chip, and an antenna structure which is electrically conductively connected to the chip and provides a contactless interface, and a carrier which comprises a chip module receptacle and a booster antenna structure which, when the chip module is arranged in the chip module receptacle of the carrier, inductively couples to the antenna structure of the chip module, wherein the chip module is arranged releasably in the chip module receptacle.Type: ApplicationFiled: August 21, 2023Publication date: March 7, 2024Inventors: Jens Pohl, Michael Huber, Frank Püschner, Thomas Spöttl
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Publication number: 20230361076Abstract: A chip arrangement including a carrier, a chip having at least one chip pad, and a bonding agent to fasten the chip pad on the carrier, the bonding agent having solder material and an anisotropic conductive adhesive.Type: ApplicationFiled: April 19, 2023Publication date: November 9, 2023Inventors: Hermann Bechert, Andreas Beer, Frank Püschner
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Publication number: 20230298989Abstract: A chip-interconnect arrangement including a substrate having a cavity, a chip having at least one chip contact and one chip contact surface, the chip being arranged in the cavity, an interconnect having an interconnect surface, the interconnect being applied on a surface of the substrate, and an electrically conductive adhesion medium, which electrically connects the at least one chip contact to the interconnect, wherein the interconnect surface is planar.Type: ApplicationFiled: March 13, 2023Publication date: September 21, 2023Inventors: Jens Pohl, Frank Püschner, Thomas Spöttl, Uwe Wagner
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Publication number: 20230289554Abstract: A smart card module including a contact region with at least one electrical smart card module contact, and a verification code display unit configured to display a verification code, the verification code display unit being arranged in the smart card module, wherein the verification code display unit is configured as a dynamic permanent display unit, the controlled display of which continues to be displayed after deenergization of the verification code display unit.Type: ApplicationFiled: March 13, 2023Publication date: September 14, 2023Inventors: Jens Pohl, Frank Püschner, Thomas Spöttl, Peter Stampka
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Publication number: 20230187328Abstract: A package including an electronic leadless module having a top side, a bottom side and side faces between the top side and the bottom side, the electronic leadless module having an electronic circuit, a plurality of electrical contact pads at the bottom side of the electronic leadless module which are electrically conductively coupled to the electronic circuit, and encapsulation material which partially encapsulates the electronic circuit, wherein the electrical contact pads are at least partially free from encapsulation material and the electronic leadless module have an anchoring region on at least one side face. The package may also include a carrier frame which carries the electronic leadless module, with the side face extending further in the direction of the carrier frame below the anchoring region than in the anchoring region, and filler material in the anchoring region for fastening the electronic leadless module to the carrier frame.Type: ApplicationFiled: December 6, 2022Publication date: June 15, 2023Inventors: Jens Pohl, Frank Püschner
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Patent number: 9324642Abstract: A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to the die paddles. A molding compound covers the unit lead frames, including the semiconductor dies. Prior to testing or other processing of the lead frame strip, a gap is etched into a region of the leads which are shared by adjacent ones of the unit lead frames. The gap extends at least mostly through the shared leads. A partial cut is made in the molding compound around the periphery of the unit lead frames prior to the subsequent processing, including below the gap in the shared leads, to electrically isolate the leads of the unit lead frames.Type: GrantFiled: November 12, 2013Date of Patent: April 26, 2016Assignee: Infineon Technologies AGInventors: Frank Püschner, Bernhard Schätzler, Teck Sim Lee, Franz Gabler, Pei Pei Kong, Boon Huat Lim
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Publication number: 20150130037Abstract: A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to the die paddles. A molding compound covers the unit lead frames, including the semiconductor dies. Prior to testing or other processing of the lead frame strip, a gap is etched into a region of the leads which are shared by adjacent ones of the unit lead frames. The gap extends at least mostly through the shared leads. A partial cut is made in the molding compound around the periphery of the unit lead frames prior to the subsequent processing, including below the gap in the shared leads, to electrically isolate the leads of the unit lead frames.Type: ApplicationFiled: November 12, 2013Publication date: May 14, 2015Inventors: Frank Püschner, Bernhard Schätzler, Teck Sim Lee, Franz Gabler, Pei Pei Kong, Boon Huat Lim
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Patent number: 7633149Abstract: An integrated circuit arrangement including a nonplanar substrate on which an integrated circuit is formed on at least one side, wherein the side of the substrate which has the integrated circuit is arranged on a carrier and the carrier is produced from a chemically resistant material.Type: GrantFiled: February 14, 2005Date of Patent: December 15, 2009Assignee: Infineon Technologies AGInventors: Jurgen Fischer, Manfred Mengel, Frank Puschner
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Patent number: 7605453Abstract: A chip module and to a chip card with a chip module which can be bent in such a way that a cross-sectional area runs along the greatest curvature of the bending line and parallel to one side of the chip module or the chip card. The module comprises contact areas within a surrounding line which are arranged in a plane perpendicular to the cross-sectional area, the surrounding line comprising a first line portion, which is adjacent the cross-sectional area, and a second line portion, which is opposite the first line portion. Furthermore, the module comprises a component, which is positioned in such a way that a first distance between the component and the first line portion is greater than a second distance between the component and the second line portion.Type: GrantFiled: August 11, 2006Date of Patent: October 20, 2009Assignee: Infineon Technologies AGInventors: Peter Stampka, Frank Puschner, Erik Heinemann, Birgit Binder
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Patent number: 7579679Abstract: A chip card with a chip module having an integrated circuit and, for external contacting, has on a main face a contact zone with a number of contact areas which are spaced apart from one another and are electrically connected to the integrated circuit. At least one contact area is made up of first functional regions with first surfaces and of second functional regions with second surfaces, and the first surfaces of the first functional regions lie higher with respect to the main face than the second surfaces of the second functional regions.Type: GrantFiled: March 29, 2006Date of Patent: August 25, 2009Assignee: Infineon Technologies AGInventors: Frank Püschner, Wolfgang Schindler, Ewald Simmerlein-Erlbacher, Peter Stampka
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Patent number: 7451936Abstract: Module for contactless chip cards or identification systems having a first antenna contact strip and a second antenna contact strip, which each have a first surface and a second surface facing away from the first surface, a semiconductor chip with at least two contacts, at least one contact contact-connecting the first surface of the first antenna contact strip and at least one further contact contact-connecting the first surface of the second antenna contact strip, and at least one adhesive film strip, which at least partially covers the first surface of both the first antenna contact strip and the second antenna contact strip, the at least one adhesive film strip being arranged outside a region of the first and second antenna contact strips that is covered by the semiconductor chip.Type: GrantFiled: June 30, 2006Date of Patent: November 18, 2008Assignee: Infineon Technologies AGInventors: Frank Puschner, Andreas Muller-Hipper, Andreas Karl
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Publication number: 20080237837Abstract: An integrated circuit arrangement including a nonplanar substrate on which an integrated circuit is formed on at least one side, wherein the side of the substrate a which has the integrated circuit is arranged on a carrier and the carrier is produced from a chemically resistant material.Type: ApplicationFiled: February 14, 2005Publication date: October 2, 2008Inventors: Jurgen Fischer, Manfred Mengel, Frank Puschner
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Patent number: 7397140Abstract: A chip module having a chip which is mounted by means of chip adhesive on a mount and is electrically connected via bonding wires to contact pads, and an encapsulation compound which surrounds the chip and the bonding wires and is bounded by a subarea of the mount. The encapsulation compound is radiation-hardened and heat-hardened in a combined form and has radiation-impermeable pigments.Type: GrantFiled: August 16, 2005Date of Patent: July 8, 2008Assignees: Infineon Technologies AG, Delo Industire Klebstoffe GmbH + Co. KGInventors: Frank Puschner, Dietmar Dengler, Wolfgang Schindler, Thomas Spottl
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Patent number: 7337967Abstract: A chip card module having a carrier with contact areas. Arranged on the carrier lying opposite the contact areas is a semiconductor chip, which has an integrated circuit which has on a surface of the chip terminal contacts which are connected in an electrically conducting manner to assigned contact areas. The contact areas have a first conducting layer and a second conducting layer, with cluster elements embedded in the second conducting layer.Type: GrantFiled: November 28, 2005Date of Patent: March 4, 2008Assignee: Infineon Technologies AGInventors: Bettina Latka, Frank Puschner, Wolfgang Schindler, Peter Stampka
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Patent number: 7240847Abstract: A contactless chip card and a method for producing a contactless chip card in which a plastic carrier having clearances is provided, on which an antenna coil is arranged on an upper side of the plastic carrier and a device having an integrated circuit is arranged on a rear side of the plastic carrier that is opposite from the upper side, an electrical connection is produced between the coil and the device, the plastic carrier is introduced into an injection mold and a card body is molded onto the rear side of the plastic carrier by the injection-molding process.Type: GrantFiled: March 10, 2005Date of Patent: July 10, 2007Assignees: Infineon Technologies AG, Circle Smart Card AGInventors: Frank Püschner, Reinhard Proske, Peter Stampka, Andreas Müller-Hipper
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Publication number: 20070034999Abstract: A chip module and to a chip card with a chip module which can be bent in such a way that a cross-sectional area runs along the greatest curvature of the bending line and parallel to one side of the chip module or the chip card. The module comprises contact areas within a surrounding line which are arranged in a plane perpendicular to the cross-sectional area, the surrounding line comprising a first line portion, which is adjacent the cross-sectional area, and a second line portion, which is opposite the first line portion. Furthermore, the module comprises a component, which is positioned in such a way that a first distance between the component and the first line portion is greater than a second distance between the component and the second line portion.Type: ApplicationFiled: August 11, 2006Publication date: February 15, 2007Applicant: INFINEON TECHNOLOGIES AGInventors: Peter Stampka, Frank Puschner, Erik Heinemann, Birgit Binder
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Patent number: 7159786Abstract: Data carrier card having a card body of a flat form and having a recess, a carrier, a chip arranged on the carrier and inserted in the recess of the card body, external contact elements arranged on the carrier and electrically connected to the chip via conductor runs, and a cover covering the recess in operative connection with the carrier such that the carrier is held along the bottom in the recess, wherein the external contact elements and the chip are arranged on a same side of the carrier.Type: GrantFiled: August 23, 2004Date of Patent: January 9, 2007Assignee: Infineon Technologies AGInventors: Jurgen Fischer, Herbert Palm, Frank Puschner, Josef Willer
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Publication number: 20060246628Abstract: A chip card with a chip module having an integrated circuit and, for external contacting, has on a main face a contact zone with a number of contact areas which are spaced apart from one another and are electrically connected to the integrated circuit. At least one contact area is made up of first functional regions with first surfaces and of second functional regions with second surfaces, and the first surfaces of the first functional regions lie higher with respect to the main face than the second surfaces of the second functional regions.Type: ApplicationFiled: March 29, 2006Publication date: November 2, 2006Inventors: Frank Puschner, Wolfgang Schindler, Ewald Simmerlein-Erlbacher, Peter Stampka
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Publication number: 20060243812Abstract: Module for contactless chip cards or identification systems having a first antenna contact strip and a second antenna contact strip, which each have a first surface and a second surface facing away from the first surface, a semiconductor chip with at least two contacts, at least one contact contact-connecting the first surface of the first antenna contact strip and at least one further contact contact-connecting the first surface of the second antenna contact strip, and at least one adhesive film strip, which at least partially covers the first surface of both the first antenna contact strip and the second antenna contact strip, the at least one adhesive film strip being arranged outside a region of the first and second antenna contact strips that is covered by the semiconductor chip.Type: ApplicationFiled: June 30, 2006Publication date: November 2, 2006Applicant: INFINEON TECHNOLOGIES AGInventors: Frank Puschner, Andreas Muller-Hipper, Andreas Karl
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Patent number: 7100836Abstract: Module for contactless chip cards or identification systems having a first antenna contact strip and a second antenna contact strip, which each have a first surface and a second surface facing away from the first surface, a semiconductor chip with at least two contacts, at least one contact contact-connecting the first surface of the first antenna contact strip and at least one further contact contact-connecting the first surface of the second antenna contact strip, and at least one adhesive film strip, which at least partially covers the first surface of both the first antenna contact strip and the second antenna contact strip, the at least one adhesive film strip being arranged outside a region of the first and second antenna contact strips that is covered by the semiconductor chip.Type: GrantFiled: December 1, 2004Date of Patent: September 5, 2006Assignee: Infineon Technologies AGInventors: Frank Puschner, Andreas Muller-Hipper, Andreas Karl