Patents by Inventor Frank Ren

Frank Ren has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED backlight driver system and associated method of operation
    Patent number: 9215769
    Abstract: The embodiments of the present circuit and method disclose a light-emitting diode (LED) driver system. The LED driver system may comprise an isolated converter and a DC/DC converter. The isolated converter may be coupled to a first input signal, and may provide a LED current and a bus voltage. The isolated converter may be configured to regulate the LED current and the bus voltage separately in accordance with a dimming signal. The DC/DC converter may comprise an input coupled to the bus voltage.
    Type: Grant
    Filed: January 25, 2012
    Date of Patent: December 15, 2015
    Assignee: Chengdu Monolithic Power Systems Co., Ltd.
    Inventors: Frank Ren, Naixing Kuang, Bairen Liu, Licheng Sheng
  • LED BACKLIGHT DRIVER SYSTEM AND ASSOCIATED METHOD OF OPERATION
    Publication number: 20120194078
    Abstract: The embodiments of the present circuit and method disclose a light-emitting diode (LED) driver system. The LED driver system may comprise an isolated converter and a DC/DC converter. The isolated converter may be coupled to a first input signal, and may provide a LED current and a bus voltage. The isolated converter may be configured to regulate the LED current and the bus voltage separately in accordance with a dimming signal. The DC/DC converter may comprise an input coupled to the bus voltage.
    Type: Application
    Filed: January 25, 2012
    Publication date: August 2, 2012
    Inventors: Frank Ren, Naixing Kuang, Bairen Liu, Licheng Sheng
  • MULTI-DIE PACKAGE WITH IMPROVED HEAT DISSIPATION
    Publication number: 20100252918
    Abstract: The present invention discloses a multi-die package which facilitates heat dissipation for a high power consumption die. In the package, part of the lead frame is bent so as to be exposed at the surface of the package. On the opposite side of the exposed surface, a high power consumption die is attached. The other die with lower power consumption is not at the surface of the multi-die package.
    Type: Application
    Filed: April 6, 2009
    Publication date: October 7, 2010
    Inventors: Hunt H. Jiang, Eric Yang, Michael R. Hsing, Frank Ren