Abstract: Devices and methods for detecting the presence and/or monitoring a movement of an analyte contained in a medium. More specifically, a microcapacitive sensing system is provided that includes a planar micro-capacitive sensor array for detecting the presence of an analyte in a sample media. The sensor structure for sensing recognizing or tracking material movement includes a top planar substrate having a first array non-contacting planar conductive electrodes and a bottom planar substrate having a second array of non-contacting planar conductive electrodes overlapping corresponding aligned electrodes in the first array. The overlapping conducting electrodes are triangular shaped to maximize perimeter-to-area ratio. The first and second planar substrates are parallel and sealed to define a volume therebetween for receiving a medium including the analyte to be detected or monitored.

Abstract: An electrode probing structure includes a first array of electrodes arranged to be radially spaced apart about a spatial point. A second array of electrodes is arranged parallel to the first array of electrodes, creating a space between the first array and the second array. An inlet is disposed adjacent the first or the second array of electrodes to introduce a fluid containing particles into the space between the first and the second array of electrodes. One or more outlets are disposed adjacent the first or the second array of electrodes to remove the particles from the space between the first and second array of electrodes. Each pair of parallel electrodes of the first array of electrodes and the second array of electrodes, when provided with an electric potential, generates signals corresponding to at least one characteristic of the particles present in the space between the electrodes.

Abstract: A structure for sensing material movement includes a set of first conductive electrodes in a top substrate and a set of second conductive electrodes in a bottom substrate positioned adjacent to and spaced apart from the set of first conductive electrodes in a top substrate. A microfluidic chamber is defined within a space between the top substrate and the bottom substrate. A first set of through vias in the top substrate connect the set of first conductive electrodes to a set of first signal lines on a top side of the top substrate. A second set of through vias in the bottom substrate connect the set of second conductive electrodes to a set of second signal lines on the bottom side of the bottom substrate.

Abstract: An impedance sensing structure is provided and includes a dielectric layer, a spiral electrode pair forming a dual spiral channel on the dielectric layer and having an inlet portion at a central region of the dual spiral channel and an outlet portion at an end of the dual spiral channel, inlet and outlet elements and sensing circuitry. The inlet and outlet elements are coupled with the inlet and outlet portions, respectively, for directing fluid or gas to flow through the dual spiral channel. The sensing circuitry is electrically connected with the spiral electrode pair and configured to sense the particles in the fluid or gas in accordance with an impedance of the spiral electrode pair and the fluid or gas flowing through the dual spiral channel.

Abstract: A sensing structure is provided and includes a tubular element through which a fluid is flowable along a single path, an array of sensors disposed along a length of the tubular element whereby the fluid is flowable through each of the sensors and sensing circuitry electrically connected with each of the sensors and configured to measure a reactance of each of the sensors and to determine whether any reactance is indicative of a presence of a biological cell in the fluid flowing through the corresponding sensors.

Abstract: A 2D microfluidic structure for capacitance sensing of analyte is provided. The structure includes a first substrate located above at least one microfluidic channel, and a second substrate located below the at least one microfluidic channel. The first substrate includes at least one first group of three isolated electrodes and the second substrate includes at least one second group of three isolated electrodes, where each group of isolated electrodes includes a ground electrode and two probe electrodes.

Abstract: A sensing structure is provided and includes a tubular element through which a fluid is flowable along a single path, an array of sensors disposed along a length of the tubular element whereby the fluid is flowable through each of the sensors and sensing circuitry electrically connected with each of the sensors and configured to measure a reactance of each of the sensors and to determine whether any reactance is indicative of a presence of a biological cell in the fluid flowing through the corresponding sensors.

Abstract: A linear microfluidic device for sensing, e.g., capacitance sensing, of one or more substances of interest (i.e., one or more analytes) is provided. The linear microfluidic device has a linear microfluidic channel that includes at least one microfluidic sensing cell located along the linear microfluidic channel. The at least one microfluidic sensing cell includes an upper electrode portion that is vertically spaced apart from a lower electrode portion, and each of the upper electrode portion and the lower electrode portion includes at least one electrically isolated probe electrode.

Abstract: Alignment and etch bias structures are provided that accomplish (I) a single alignment/monitor pattern for multiple layers, (II) the functions of precision alignment marks, course alignment marks, and characterization alignment/monitoring marks, (III) in-situ post fabrication characterization by at least two methods, optical and electrical (e.g., capacitance) with one pattern, and (IV) detects not only alignment/misalignment quality, but also layer over-etch precision, intra-wafer intra printed circuit board (PCB) distortion, and intra-layer dielectric characteristics.

Abstract: A 2D microfluidic structure for capacitance sensing of analyte is provided. The structure includes a first substrate located above at least one microfluidic channel, and a second substrate located below the at least one microfluidic channel. The first substrate includes at least one first group of three isolated electrodes and the second substrate includes at least one second group of three isolated electrodes, where each group of isolated electrodes includes a ground electrode and two probe electrodes.

Abstract: Devices and methods for detecting the presence and/or monitoring a movement of an analyte contained in a medium. More specifically, a microcapacitive sensing system is provided that includes a planar micro-capacitive sensor array for detecting the presence of an analyte in a sample media. The sensor structure for sensing recognizing or tracking material movement includes a top planar substrate having a first array non-contacting planar conductive electrodes and a bottom planar substrate having a second array of non-contacting planar conductive electrodes overlapping corresponding aligned electrodes in the first array. The overlapping conducting electrodes are triangular shaped to maximize perimeter-to-area ratio. The first and second planar substrates are parallel and sealed to define a volume therebetween for receiving a medium including the analyte to be detected or monitored.

Abstract: An impedance sensing structure is provided and includes a dielectric layer, a spiral electrode pair forming a dual spiral channel on the dielectric layer and having an inlet portion at a central region of the dual spiral channel and an outlet portion at an end of the dual spiral channel, inlet and outlet elements and sensing circuitry. The inlet and outlet elements are coupled with the inlet and outlet portions, respectively, for directing fluid or gas to flow through the dual spiral channel. The sensing circuitry is electrically connected with the spiral electrode pair and configured to sense the particles in the fluid or gas in accordance with an impedance of the spiral electrode pair and the fluid or gas flowing through the dual spiral channel.

Abstract: Compound semiconductor and silicon-based structures are epitaxially formed on semiconductor substrates and transferred to a carrier substrate. The transferred structures can be used to form discrete photovoltaic and light-emitting devices on the carrier substrate. Silicon-containing layers grown on doped donor semiconductor substrates and compound semiconductor layers grown on off-cut semiconductor substrates form elements of the devices. The carrier substrates may be electrically insulating substrates or include electrically insulating layers to which photovoltaic and/or light-emitting structures are bonded.

Abstract: A chip and cooler assembly includes an active or passive interposer that has a front side and a back side. Integrated circuit chips are mounted onto the back side of the interposer. Each of the chips has a front side that is attached to the interposer and a back side that faces away from the interposer. Gaps separate the chips. The assembly also includes a frame that is fitted into the gaps between the chips. The frame is CTE-matched to the chips. The frame and the chips define a back side surface. A cooler module is attached to the back side surface. The cooler module is CTE-matched to the chips. The cooler module includes a microchannel cooler that is disposed directly against the back sides of the chips and a manifold that is attached to the microchannel cooler opposite the chips. The manifold is CTE-matched to the microchannel cooler.

Abstract: Techniques are provided for intra-bonding multiple semiconductor integrated circuit chips to form multi-chip package structures. For example, a device comprises a first semiconductor die and a second semiconductor die. The first semiconductor die comprises a first overlap region which comprises a first array of metallic contacts. The second semiconductor die comprises a second overlap region which comprises a second array of metallic contacts. The first overlap region and the second overlap region are overlapped and bonded together with the first array of metallic contacts aligned to the second array of metallic contacts, and with the first semiconductor die and the second semiconductor die disposed laterally adjacent to each other.

Abstract: A capacitive probe structure is presented including two or more microfluidic channels defined within a plurality of dielectric layers disposed over a substrate, and a plurality of probes extending through the plurality of dielectric layers such that several probes of the plurality of probes extend to the two or more microfluidic channels to measure at least particle concentrations and particle flow within the two or more microfluidic channels. The plurality of probes are physically and electrically isolated from each other by the plurality of dielectric layers. The plurality of probes further measure a dielectric constant change for conducting and non-conducting liquids and gasses within the two or more microfluidic channels.

Abstract: A device and associated method include using an optical element (OE) for electrical and optical communications on the device. A substrate includes a wiring layer with an optically transparent path which allows optical signals to pass therethrough. An optical coupling layer is coupled to the wiring layer, and the optical coupling layer includes at least one micro-lens for focusing or collimating the optical signals through the transparent path. An OE is coupled to the wiring layer, and the OE is positioned in optical alignment with the optically transparent path for communicating optical signals. One or more semiconductor chips can be communicatively coupled to an OE for controlling the OE.

Abstract: A bridge chip of an IC packaging structure includes E/O and O/E converters and a first wiring pattern interconnecting the converters to host chips and a second wiring pattern electrically connected to the host chips. An optical interface outputs the optical signals from a backside surface of the bridge chip. The optical interface receives optical signals through the backside surface. Electrical through links connected to the second wiring pattern output electrical signals generated by the host chips through the backside surface of the bridge chip. The packaging structure includes substrate with a trench provided in the top surface of the substrate and the bridge chip disposed in the trench. The host chips are directly connected to the top surface of the bridge chip and the top surface of the substrate. Optical signals are output from the packaging structure through an opening in the bottom surface of the substrate.

Abstract: Compound semiconductor and silicon-based structures are epitaxially formed on semiconductor substrates and transferred to a carrier substrate. The transferred structures can be used to form discrete photovoltaic and light-emitting devices on the carrier substrate. Silicon-containing layers grown on doped donor semiconductor substrates and compound semiconductor layers grown on off-cut semiconductor substrates form elements of the devices. The carrier substrates may be electrically insulating substrates or include electrically insulating layers to which photovoltaic and/or light-emitting structures are bonded.

Abstract: An interconnect for a semiconductor device includes: a carrier; a UV programmable chip mounted on the carrier using a first array of solder connections; a UV light source mounted on the carrier using a second array of solder connections, the UV light source being in optical communication with the UV programmable chip; and a plurality of transmission lines extending on or through the carrier and providing electrical communication between the UV programmable chip and the UV light source.