Patents by Inventor Frank Sardina

Frank Sardina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060219854
    Abstract: A gauge bracket assembly coupled to a motorcycle having handlebars. The gauge bracket assembly including an upper handlebar clamp and a gauge bracket. The upper handlebar clamp is coupled to the motorcycle to at least partially secure the handlebars to the motorcycle. The handlebar clamp includes a first connection interface. The gauge bracket includes at least one mounting section for mounting gauges and a second connection interface. The first connection interface includes one of a protruding portion and a receiving portion, and the second connection interface includes the other of the protruding portion and the receiving portion. The first connection interface is coupled to the second connection interface such that the protruding portion is received within the receiving portion.
    Type: Application
    Filed: March 8, 2005
    Publication date: October 5, 2006
    Applicant: Harley-Davidson Motor Company Group, Inc.
    Inventors: Frank Sardina, Todd Wilson
  • Patent number: 5456942
    Abstract: An improved method for fabricating a circuit element through a substrate permits fabrication of large geometry vias between substrate sides. The improved method includes disposing a substrate (327) between two compressible layers (317, 339). Each of the layers (317, 339) has at least one aperture (345, 321) disposed therethrough. The substrate (327), has at least one via (333) aligned between the apertures (345, 321) where the via has an area smaller than an area of the apertures (345, 321). Next, a coating, preferably a liquid circuit element material (351) is disposed into one of the apertures (321) of one of the two compressible layers (339). A pressure (405) is applied between the two compressible layers (317, 339) causing the liquid circuit element material (351) to flow between the two compressible layers (317, 339), thereby coating the at least one via (333) of the substrate (327), thus providing an interconnect (609, 611) of the coating through the substrate (327).
    Type: Grant
    Filed: September 29, 1993
    Date of Patent: October 10, 1995
    Assignee: Motorola, Inc.
    Inventors: James E. Bebak, Loren E. Saar, Frank A. Sardina, Joseph J. Vinci