Abstract: A heat spreader comprising a sheet of transparent diamond with an aperture therein that accommodates a solid-immersion lens (SIL). The heat spreader may be mounted within a clamp which allows the heat spreader to move freely across the Device Under Test (DUT) while maintaining a very high degree of planarity and contact between the diamond and the silicon substrate of the DUT. The DUT is secured to its electrical interface with a low profile clamp, the DUT may be held within the clamp by a mechanism that applies a pressure to the sides of the DUT package.

Abstract: A heat spreader comprising a sheet of transparent diamond with an aperture therein that accommodates a solid-immersion lens (SIL). The heat spreader may be mounted within a clamp which allows the heat spreader to move freely across the Device Under Test (DUT) whilst maintaining a very high degree of planarity and contact between the diamond and the silicon substrate of the DUT. The DUT is secured to its electrical interface with a low profile clamp, the DUT may be held within the clamp by a mechanism that applies a pressure to the sides of the DUT package.

Abstract: A heat spreader comprising a sheet of transparent diamond with an aperture therein that accommodates a solid-immersion lens (SIL). The heat spreader may be mounted within a clamp which allows the heat spreader to move freely across the Device Under Test (DUT) whilst maintaining a very high degree of planarity and contact between the diamond and the silicon substrate of the DUT. The DUT is secured to its electrical interface with a low profile clamp, the DUT may be held within the clamp by a mechanism that applies a pressure to the sides of the DUT package.

Abstract: A package optimized for thinning of an attached semiconductor die. The package comprises an extension ring attached to a bottom surface of the package, and a die carrier plate attached to the extension ring for receiving a semiconductor die. The die carrier plate may be attached to the extension ring by an adhesive that permits removal of the carrier plate from the semiconductor die and extension ring by a small applied force after encapsulation of the semiconductor die. The encapsulant may include a filler material for modifying properties such as hardness, thermal coefficient of expansion, thermal conductivity. The materials used for the extension ring and encapsulant may be selected for compatibility with the die lapping operation.