Abstract: A component includes a glass or glass ceramic having a thickness and a plurality of predamages. Each predamage of the plurality of predamages has a longitudinal axis and passes continuously through the thickness of the glass or the glass ceramic. The component also includes a material compaction of the glass or glass ceramic that is at least 1% relative to an actual material density in a radius of 3 ?m about the longitudinal axis of each predamage so that the glass or the glass ceramic has a relative weight loss per predamage that is less than 10%.

Abstract: The invention relates to a method for controlling a piezoelectric drive unit (81). For this purpose, a first control signal is applied to a first electrode (90a) of the first piezo element (95) of the piezoelectric drive unit (81). Additionally, a second control signal is applied to a second electrode (90b) of the first piezo element (95) of the piezoelectric drive unit (81). The first control signal is configured as a continuous positive first voltage signal. The second control signal is configured as a constant second voltage signal. The first control signal is always greater than the second control signal.

Abstract: A micromechanical component. The micromechanical component includes: a mount; a displaceable part; and a first serpentine spring and a second serpentine spring which is embodied mirror-symmetrically with respect to the first serpentine spring in terms of a first plane of symmetry; a first actuator device and a second actuator device being embodied in such a way that by way of the first actuator device and the second actuator device, periodic deformations, mirror-symmetrical in terms of the first plane of symmetry, of the first serpentine spring and of the second serpentine spring are excitable; the micromechanical component also encompassing a first torsion spring and a second torsion spring that each extend along a rotation axis; and the displaceable part being displaceable, at least by way of the periodic and mirror-symmetrical deformations of the first serpentine spring and of the second serpentine spring, around the rotation axis with respect to the mount.

Abstract: An apparatus and a method for monitoring a semiconductor component. A leakage current which flows through a first electrode and a second electrode of the semiconductor component is detected during operation of the semiconductor component, wherein the leakage current is compared, during a comparison, with a first limit value for the leakage current and an output is determined on the basis of a result of the comparison and/or wherein a time is determined at which an extreme point, in particular a maximum, of the leakage current occurs and an output is determined on the basis of the time, wherein the output comprises a state of the semiconductor component, and the output is output.

Abstract: A device and method for producing a semiconductor component. The method includes: arranging a dielectric layer between a first electrode and a second electrode of the semiconductor component, there being defects of a first defect type in the dielectric layer; determining a time period for movement of defects of the first defect type into a target position in the dielectric layer; determining a first voltage for the movement of said defects in the dielectric layer; applying the first voltage between the first electrode and the second electrode in the time period.

Abstract: A micromechanical vibration system. The system includes a micromechanical vibrating body with at least one micromirror. The micromirror extends in a first main extension plane and has a face reflective to incident light. The system further includes an electromagnetic drive unit comprising a coil body and at least two magnets. The coil body is arranged in a second main extension plane parallel to the first main extension plane. The coil body is arranged laterally and/or on a side opposite the reflective face of the micromirror and/or on a side facing the reflective face of the micromirror. The at least two magnets extend in a third main extension plane of the coil body parallel to the first and second main extension plane and are arranged on the side opposite the reflective face of the micromirror. A single first magnetic flux plate is arranged in an intermediate space between the magnets.

Abstract: A magnetoelastic torque sensor having an evaluation unit and at least three magnetic field sensors. The evaluation unit acquires at least one measurement signal of a first magnetic field sensor, at least one measurement signal of a second magnetic field sensor and at least one third measurement signal of a third magnetic field sensor of the magnetoelastic torque sensor, and to determine a torque exerted on the shaft using the at least one measurement signal of the first magnetic field sensor, the at least one measurement signal of the second magnetic field sensor, the at least one measurement signal of the fourth magnetic field sensor, and a ratio of a distance between the second magnetic field sensor and the third magnetic field sensor in an axial direction to a distance between the first magnetic field sensor and the second magnetic field sensor in the axial direction.

Abstract: A micromechanical component comprising a bracket and an adjustable portion arranged in an adjustable manner on the bracket. The micromechanical component includes a first bender actuator and a first support structure for the first bender actuator. The first bender actuator is arranged in or on the first support structure and is configured to bend the first support structure at least in the area of the first bender actuator arranged in or on the first support structure, such that the adjustable portion is displaceable relative to the bracket about a first rotational axis. The first support structure is directly connected to the adjustable portion. The micromechanical component additionally includes a first spring configured to suspend the first support structure for the first bender actuator and the adjustable portion from the bracket.

Abstract: A micromechanical device, in particular a micromirror device. The device has at least one first micromechanical component and one second micromechanical component. The first component and the second component are directly or indirectly joined to one another. The first micromechanical component has a first sub-body and at least one second sub-body. The first sub-body extends in a first plane and the second sub-body in a second plane different from the first plane. The first plane and the second plane extend parallel to one another and the first plane extends above the second plane. The second sub-body is arranged in a transitional region to the second micromechanical component. A second extent of the second sub-body in the longitudinal direction is greater than a first extent of the first sub-body in the longitudinal direction.

Abstract: The invention relates to a system for torque measurement, in particular at a drive of an e-bike, including at least one shaft which is rotatable about an axis, is magnetized in at least one axial partial section, and onto which a torque to be measured can be applied, at least one TMR sensor, which is situated outside the shaft and is designed for at least two-dimensionally, in particular three-dimensionally, measuring a magnetic field and which is arranged in relation to the at least one partial section in such a way that, when the shaft rotates about the axis, the at least one sensor measures a change of the magnetic field due to the magnetostrictive effect in the magnetized partial section when the torque acts on the shaft, and an evaluation unit, which is connected to the at least one TMR sensor and is designed for determining a torque acting on the shaft based on the measured values of the magnetic field.

Abstract: A method for producing a microelectronic device, in particular a MEMS chip device, comprising at least one carrier substrate. At least one electrodynamic actuator made of a metal conductor formed at least largely of copper is applied to the carrier substrate in at least one method step. At least one piezoelectric actuator is applied to the carrier substrate in at least one further method step.

Abstract: A crank spindle set-up for a vehicle. The set-up includes a crank spindle for receiving a force/torque from pedaling using crank arms attached to ends of the crank spindle; an output shaft for receiving a force and/or a torque from the crank spindle; a mechanical coupling having a tap between the ends of the crank spindle, for transmitting force/torque from the crank spindle to the output shaft; a first magnetic region on/in the output shaft for generating and outputting a first magnetic field that is a function of the state of mechanical stress of the output shaft; a second magnetic region on/in the crank spindle at an axial distance from the tap, for generating and outputting a second magnetic field that is a function of the state of mechanical stress of the crank spindle; and a sensor set-up for detecting a magnetic field outputted by the crank spindle set-up.

Abstract: An ultrasound transducer of a vehicle system, comprising a membrane configured to vibrate to generate an ultrasound when voltage is applied and further configured to vibrate in an out-of-plane movement, wherein the membrane includes a first piezoelectric film at a center of the membrane, a supporting member including a second piezoelectric film, the supporting member supporting and surrounding the membrane, wherein in response to a translation of motion or actuation from the membrane, the supporting member mode does not move when there is the out-of-plane movement from the membrane.

Abstract: A micromechanical oscillation system that is designed as a micromirror system. The micromechanical oscillation system includes a micromechanical oscillating body that includes at least one micromirror. The micromechanical oscillating body is designed to oscillate about an oscillation axis, in particular at a resonant frequency of the oscillating body. The micromechanical oscillating body has a total mass made up of mass elements. The mass elements are distributed as a function of a lateral horizontal spacing of the mass elements from the oscillation axis.

Abstract: A semiconductor component that includes at least one dielectric layer and at least one first electrode and one second electrode. A first defect type and a second defect type, which is different from the first defect type, are also present in dielectric layer. The at least two different defect types accumulate at one of the two electrodes as a function of a main operating voltage applied between the first electrode and the second electrode, and of a main operating temperature that is present at characteristic times ?1 and ?2, and generate the maximum changes in barrier height ??1 and ??2 at the electrodes. ?1 and ??1 are associated with the first defect type, and ?2 and ??2 are associated with the second defect type. ?1<?2 and ??1<??2 apply.

Abstract: A semiconductor component that includes at least one dielectric layer and at least one first electrode and one second electrode. In addition, at least two defect types different from one another are present in the dielectric layer. These at least two defect types different from one another move along localized defect states, each at an average effective distance, in the direction of one of the two electrodes as a function of an operating voltage that is applied between the first electrode and the second electrode, and an operating temperature that is present. The average effective distance is greater than 3.2 nm.

Abstract: Device and method for using a semiconductor component in which a dielectric layer is situated between a first electrode and a second electrode of the semiconductor component, defects of a first defect type being present in the dielectric layer. The method includes: operating the semiconductor component using a first voltage having a first polarity between the first electrode and the second electrode, determining whether or not a condition is met for switching over from operating the semiconductor component using the first voltage to operating the semiconductor component using a second voltage, which has a second polarity opposite the first polarity, continuing the operation of the semiconductor component using the first voltage if the condition is not met, and otherwise ending the operation of the semiconductor component using the first voltage, and operating the semiconductor component using the second voltage between the first electrode and the second electrode.

Abstract: A micromechanical oscillation system. The micromechanical oscillation system has a micromechanical oscillating body having at least one micromirror. In addition, the micromechanical oscillation system includes an electromagnetic drive unit which has a coil body and at least one magnet. The coil body essentially extends laterally to the micromirror. The at least one magnet extends underneath the coil body.

Abstract: A MEMS device and a corresponding operating method. The MEMS device is equipped with an oscillatory micromechanical system, which is excitable in a plurality of useful modes, the oscillatory micromechanical system including at least one system component, which is excitable in at least one parasitic spurious mode by a superposition of the useful modes. An adjusting device is provided, which is configured in such a way that it counteracts the parasitic spurious mode by application of an electromagnetic interaction to the system component.

Abstract: A method for activating a drive unit of a deflection unit of a two-dimensional microscanner device. First and second control signals for activating the drive unit of the deflection unit are initially generated using a processing unit. The first and second control signals are subsequently transferred to the drive unit. A sinusoidal first movement of the deflection unit about a first axis and a sinusoidal second movement of the deflection unit about a second axis are carried out at a first point in time based on the transferred control signals. The first control signals are then adapted so that a periodic third movement is superimposed on the first movement at a second point in time following the first point in time. Alternatively, the second control signals are adapted so that a periodic fourth movement is superimposed on the second movement at the second point in time following the first.