Patents by Inventor Frank Shi

Frank Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11950358
    Abstract: A semiconductor device system comprises an integrated circuit (IC) die. The IC die is configured to operate in a first operating mode during a first period, and a second operating mode during a second period. The first period is associated with enabling an element of the IC die and a first amount of voltage droop. The second period occurs after the first period and is associated with a second amount of voltage droop. The second amount of voltage droop is less than the first amount of voltage droop.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: April 2, 2024
    Assignee: XILINX, INC.
    Inventors: Frank Peter Lambrecht, Brian D. Philofsky, Hong Shi, Prasun Raha
  • Patent number: 11936032
    Abstract: A lead-acid battery is disclosed. The lead-acid battery has a container with a cover and includes one or more compartments. One or more cell elements are provided in the one or more compartments. The one or more cell elements comprise a positive electrode, the positive electrode having a positive substrate and a positive electrochemically active material on the positive substrate; a negative electrode, the negative electrode having a negative substrate and a negative active mass on the negative substrate, wherein the negative active mass comprises a leady oxide, a synthetic organic expander, a very fine particle barium sulfate, and plurality of conductive carbons; and an absorbent glass mat separator between the positive plate and the negative plate. Electrolyte is provided within the container. One or more terminal posts extend from the container or the cover and are electrically coupled to the one or more cell elements.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: March 19, 2024
    Assignees: CPS Technology Holdings LLC, Clarios Germany Gmbh & Co. KG
    Inventors: Frank-Thomas Johns, Uwe Bitomsky, Andreas Dudenbostel, Matthew A. Spence, Kavi G. Loganathan, Qingfang Shi, Cornelia Brendel
  • Publication number: 20240071958
    Abstract: A chip package and method for fabricating the same are provided that includes embedded off-die inductors coupled in series. One of the off-die inductors is disposed in a redistribution layer formed on a bottom surface of an integrated circuit (IC) die. The other of the series connected off-die inductors is disposed in a substrate of the chip package. The substrate may be either an interposer or a package substrate.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Inventors: Hong SHI, Li-Sheng WENG, Frank Peter LAMBRECHT, Jing JING, Shuxian WU
  • Patent number: 8536113
    Abstract: Short oligopeptides are provided which are capable of binding to the epidermal growth factor receptor on the surface of human tumor cells. Methods for using the peptides as targeting moieties in more complex compositions, such as conjugates of cytoxins, and/or structures, such as liposomal structures, for the purposes of drug delivery are also provided.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: September 17, 2013
    Assignee: Janssen Biotech, Inc.
    Inventors: Mohit Trikha, Wang Bryan, Frank Shi, John Kehoe
  • Patent number: 8436391
    Abstract: An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the invention is a PPA supported package house for LED packaging with metal base, four identical metal electrodes, and PPA plastic to fix the metal electrodes and the heat dissipation base together, four ring-alike structures with a sharp edge and with a tilted inner surface, and three ring-alike grooves formed between sharp edge ring-alike structures.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: May 7, 2013
    Assignee: Nepes Led Corporation
    Inventors: Nguyen The Tran, Yongzhi He, Frank Shi
  • Patent number: 8350453
    Abstract: A lamp cover containing phosphor for providing white light emission is disclosed. The lamp cover is comprised of a light-partial-reflective cap structure providing the outer surface of the lamp cover, wherein the light-partial-reflective cap structure is composed of a plurality of light transparent layers and a plurality of vacuum layers that are stacked in an alternating manner from outside to inside, a supporting transparent cap structure providing the inner surface of the lamp cover, and a phosphor mixed structure mechanically supported by the outer surface of the supporting transparent cap structure, wherein the outer surface of the phosphor mixed structure is adjacent to the most inner vacuum layer of the light-partial-reflective cap structure. Once the lamp cover is combined with a phosphor exciting light source, the light-partial-reflective cap structure partially prevents phosphor exciting light from escaping from the lamp cover by using Fresnel reflection.
    Type: Grant
    Filed: May 25, 2010
    Date of Patent: January 8, 2013
    Assignee: Nepes LED Corporation
    Inventors: Nguyen The Tran, Yongzhi He, Frank Shi
  • Patent number: 8278415
    Abstract: Polypeptides comprising EGFR extracellular domains I-III capable of forming dimeric EGF-binding proteins are provided. The dimeric construct of the invention is useful in applications where high affinity EGF binding is desired and can be used to select agents capable of binding to native EGFR in the presence of EGF.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: October 2, 2012
    Assignee: Centocor, Inc.
    Inventors: Wang Bryan, Frank Shi, Juliane Mills
  • Patent number: 8257827
    Abstract: A silicone composition having anti-microbial properties contains well distributed silica and nanoparticles of a noble metal. Silica and nanoparticles of a noble metal are added to liquid vinyl-terminated polydimethylsiloxane. A coupling agent is then added to the mixture and heated, the coupling agent comprising trialkoxysilane having a formula R1Si(OR2)3, wherein R1 is vinyl or allyl, and R2 is an alkyl radical having from 1 to 3 carbon atoms. In one embodiment, trimethylsiloxy terminated polymethylhydrosiloxane is then added to the mixture and heated in the presence of a catalyst so as to cross-link and cure the same into a silicone elastomer. In another embodiment, in place of the trimethylsiloxy terminated polymethylhydrosiloxane, a peroxide is added to mixture and heated to form the silicone. In this later example, no catalyst is needed.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: September 4, 2012
    Assignee: The Regents of the University of California
    Inventors: Frank Shi, Ralph Clayman, Michael K. Louie, Yeong-Her Lin, Yuan-Chang Lin
  • Publication number: 20110291548
    Abstract: A lamp cover containing phosphor for providing white light emission is disclosed. The lamp cover is comprised of a light-partial-reflective cap structure providing the outer surface of the lamp cover, wherein the light-partial-reflective cap structure is composed of a plurality of light transparent layers and a plurality of vacuum layers that are alternatively stacked from outside to inside, a supporting transparent cap structure providing the inner surface of the lamp cover, and a phosphor mixed structure mechanically supported by the outer surface of the supporting transparent cap structure, wherein the outer surface of the phosphor mixed structure is adjacent to the most inner vacuum layer of the light-partial-reflective cap structure. Once the lamp cover is combined with a phosphor exciting light source, the light-partial-reflective cap structure partially prevents phosphor exciting light from escaping from the lamp cover by using Fresnel reflection.
    Type: Application
    Filed: May 25, 2010
    Publication date: December 1, 2011
    Applicant: NEPES LED CORPORATION
    Inventors: Tran NGUYEN THE, Yongzhi He, Frank Shi
  • Patent number: 8058667
    Abstract: An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the invention is a PPA supported package house for LED packaging with metal base, four identical metal electrodes, and PPA plastic to fix the metal electrodes and the heat dissipation base together, four ring-alike structures with a sharp edge and with a tilted inner surface, and three ring-alike grooves formed between sharp edge ring-alike structures.
    Type: Grant
    Filed: March 10, 2009
    Date of Patent: November 15, 2011
    Assignee: Nepes LED Corporation
    Inventors: Nguyen The Tran, Yongzhi He, Frank Shi
  • Patent number: 8039862
    Abstract: A white light emitting diode (LED) package with multilayered encapsulation structure and the packaging methods are disclosed. The white LED package structure includes metal electrodes, a heat dissipation base, a PPA plastic for fixing the electrodes and the heat dissipation base together, at least one LED die, a die attaching material, gold wires for electrically connecting the LED die to the electrodes, a first type of silicone encapsulant, a second type of silicone encapsulant, and a phosphor containing layer. The invention utilizes a low-refractive index silicone (the second type of silicone encapsulant) to separate the phosphor containing layer away from the first type of silicone, which covers the LED die, to prevent/reduce emitted light going backward and hitting the LED die.
    Type: Grant
    Filed: March 10, 2009
    Date of Patent: October 18, 2011
    Assignee: Nepes LED Corporation
    Inventors: Nguyen The Tran, Yungzhi He, Frank Shi
  • Patent number: 7972023
    Abstract: An LED lamp cover structure containing luminescent material and its fabrication methods are described. The LED lamp cover is comprised of a first lens cap providing the outer surface of the lamp cover, a second lens cap providing the inner surface of the lamp cover, and an encapsulating layer sandwiched between the lens cap providing the outer surface of the lamp cover and the lens cap providing the inner surface of the lamp cover, which is mixed with luminescent material for wavelength conversion.
    Type: Grant
    Filed: March 10, 2009
    Date of Patent: July 5, 2011
    Assignee: Nepes LED Corporation
    Inventors: Nguyen The Tran, Yongzhi He, Frank Shi
  • Patent number: 7828453
    Abstract: An LED lamp cover structure containing luminescent material, its fabrication methods, and an LED package using the LED lamp cover are disclosed. The LED lamp cover is comprised of a first lens cap providing the outer surface of the lamp cover, a second lens cap providing the inner surface of the lamp cover, and an encapsulating layer sandwiched between the first and second lens caps. The lamp cover of the invention covering a color LED package such as blue color can provide white light output.
    Type: Grant
    Filed: August 3, 2009
    Date of Patent: November 9, 2010
    Assignee: Nepes LED Corporation
    Inventors: Nguyen The Tran, Yongzhi He, Frank Shi
  • Publication number: 20100232133
    Abstract: An LED lamp cover structure containing luminescent material and its fabrication methods are described. The LED lamp cover is comprised of a first lens cap providing the outer surface of the lamp cover, a second lens cap providing the inner surface of the lamp cover, and an encapsulating layer sandwiched between the lens cap providing the outer surface of the lamp cover and the lens cap providing the inner surface of the lamp cover, which is mixed with luminescent material for wavelength conversion.
    Type: Application
    Filed: March 10, 2009
    Publication date: September 16, 2010
    Applicant: NEPES LED, INC.
    Inventors: Nguyen The Tran, Yongzhi He, Frank Shi
  • Publication number: 20100230791
    Abstract: An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the invention is a PPA supported package house for LED packaging with metal base, four identical metal electrodes, and PPA plastic to fix the metal electrodes and the heat dissipation base together, four ring-alike structures with a sharp edge and with a tilted inner surface, and three ring-alike grooves formed between sharp edge ring-alike structures.
    Type: Application
    Filed: April 28, 2010
    Publication date: September 16, 2010
    Applicant: NEPES LED CORPORATION
    Inventors: Nguyen The Tran, Yongzhi He, Frank Shi
  • Publication number: 20100151003
    Abstract: Short oligopeptides are provided which are capable of binding to the epidermal growth factor receptor on the surface of human tumor cells. Methods for using the peptides as targeting moieties in more complex compositions, such as conjugates of cytoxins, and/or structures, such as liposomal structures, for the purposes of drug delivery are also provided.
    Type: Application
    Filed: December 20, 2007
    Publication date: June 17, 2010
    Inventors: Mohit Trikha, Wang Bryan, Frank Shi, John Kehoe
  • Publication number: 20100098681
    Abstract: Polypeptides comprising EGFR extracellular domains I-III capable of forming dimeric EGF-binding proteins are provided. The dimeric construct of the invention is useful in applications where high affinity EGF binding is desired and can be used to select agents capable of binding to native EGFR in the presence of EGF.
    Type: Application
    Filed: December 20, 2007
    Publication date: April 22, 2010
    Inventors: Bryan Wang, Frank Shi, Juliane Mills
  • Patent number: 5628813
    Abstract: The present invention provides for controlled release chemical compositions having improved controlled release properties wherein core substrate particles comprising a water soluble chemical compound, such as a fertilizer or oil well chemical, which are surrounded and encapsulated by a controlled release coating which is slowly permeable to water, such as a thin layer of polymeric material, are further overcoated with one or more coating layers comprising a finely divided filler preferably talc, dispersed in a metal or ammonium lignosulfonate binder. The outer coating serves to protect the underlying, thin film, controlled release coating from abrasion and impact damage occasioned by packaging, blending and dispensing equipment, thereby preserving the water permeating properties designed into such coating.
    Type: Grant
    Filed: December 21, 1992
    Date of Patent: May 13, 1997
    Assignee: Exxon Chemical Patents Inc.
    Inventors: Frank Shi-Chow Chen, Albert J. Geiger