Patents by Inventor Frank Sigmund

Frank Sigmund has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package including embedded thin-film battery
    Patent number: 9012264
    Abstract: An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: April 21, 2015
    Assignee: STMicroelectronics, Inc.
    Inventors: Michael J. Hundt, Haibin Du, Krishnan Kelappan, Frank Sigmund
  • INTEGRATED CIRCUIT PACKAGE INCLUDING EMBEDDED THIN-FILM BATTERY
    Publication number: 20140315334
    Abstract: An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.
    Type: Application
    Filed: July 1, 2014
    Publication date: October 23, 2014
    Inventors: Michael J. Hundt, Haibin Du, Krishnan Kelappan, Frank Sigmund
  • Integrated circuit package including embedded thin-film battery
    Patent number: 8766435
    Abstract: An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: July 1, 2014
    Assignee: STMicroelectronics, Inc.
    Inventors: Michael J. Hundt, Haibin Du, Krishnan Kelappan, Frank Sigmund
  • Integrated circuit package including embedded thin-film battery
    Publication number: 20060001137
    Abstract: An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.
    Type: Application
    Filed: June 30, 2004
    Publication date: January 5, 2006
    Applicant: STMicroelectronics, Inc.
    Inventors: Michael Hundt, Haibin Du, Krishnan Kelappan, Frank Sigmund
  • SRAM cell with p-channel pull-up sources connected to bit lines
    Patent number: 6011711
    Abstract: A static random access memory cell comprising a storage latch having a first upper power supply voltage connection to a first bit line, a second upper power supply voltage connection to a second bit line, and a connection to a lower power supply voltage. A first access circuit connects the storage latch to the first bit line and a second access circuit connects the storage latch to the second bit line, wherein the storage latch is accessed utilizing the first access circuit and the second access circuit.
    Type: Grant
    Filed: December 31, 1996
    Date of Patent: January 4, 2000
    Assignee: STMicroelectronics, Inc.
    Inventors: Robert Louis Hodges, Frank Sigmund
  • Detachable module/ball grid array package
    Patent number: 5666272
    Abstract: A system for packaging integrated circuit components including a ball grid array substrate with a plurality of solder balls coupled to the substrate. A semiconductor device is mounted on the substrate and electrically coupled to the solder balls. One or more terminals are coupled to the substrate and electrically coupled to said semiconductor device. A detachable module contains auxiliary component, such as a data acquisition device, a wireless communications device, an output device or driving devices for a clock circuit. The module comprises a body portion for containing the component and one or more electrical connectors for mating with respective terminals to hold the module to the substrate and to electrically couple the component with the semiconductor device.
    Type: Grant
    Filed: June 3, 1996
    Date of Patent: September 9, 1997
    Assignee: SGS-Thomson Microelectronics, Inc.
    Inventors: Dale Thomas Moore, Frank Sigmund, Fred Chevreton