Abstract: A method for producing an illuminant is specified, in which a positioning device (3) holds an optoelectronic semiconductor component (1) inside a tolerance range (4) on the upper side of a connection carrier (2) during the mechanical fixation and electrical connecting of the optoelectronic semiconductor component (1) to the connection carrier (2).

Abstract: In at least one embodiment, an optoelectronic lighting module includes a circuit board, which an opening passes right through. The circuit board includes fastening devices for mechanically fastening the lighting module to an external heat sink. A carrier of the lighting module is mounted in the opening. At least one optoelectronic semiconductor chip is located on a carrier top and is connected electrically to the circuit board via the carrier. The circuit board is moreover connected firmly mechanically with the carrier. The circuit board is additionally designed to exert a mechanical force on the carrier and to press the carrier against the external heat sink. The carrier is designed to rest with a carrier bottom flat against the external heat sink.

Abstract: An optoelectronic component may include a carrier element having a heat sink, at least one semiconductor chip for emitting electromagnetic radiation which is mounted and electrically contact-connected on the carrier element, a radiation-transmissive cover disposed downstream of the at least one semiconductor chip, a converter layer applied on the radiation-transmissive cover and spaced apart from the at least one semiconductor chip, a frame composed of thermally conductive material, which frame extends around the at least one semiconductor chip and is in direct contact with the converter layer, and at least one connecting element for thermally connecting the frame to the heat sink.

Abstract: An optoelectronic lighting device includes a lighting module with an optoelectronic semiconductor chip. A connection carrier has a first main surface and a second main surface facing away from the first main surface. The lighting module is arranged on the first main surface of the connection carrier, and the connection carrier adheres to a heat sink on account of a magnetic attraction.

Abstract: An LED module has an electrically insulating main body, a base surface and a mounting surface located opposite the base surface. A number of electrical connection contacts are arranged at the mounting surface. The connection contacts do not adjoin the base surface. A heat sink is arranged in the main body. The heat sink extends from the mounting surface as far as the base surface. Furthermore, the LED module has a number of LED chips, each having an electrically insulating carrier substrate at a chip underside and two chip contacts at a chip top side. The LED chips are arranged with the electrically insulating carrier substrate on the heat sink.

Abstract: An optoelectronic module comprising: at least one light-emitting diode chip arranged on a carrier, and a mounting attachment fastened to the carrier and at least partly covering the light-emitting diode chip, and having a structured top which allows positioning of an optical element.

Abstract: An optoelectronic semiconductor body comprises a semiconductor layer sequence which is subdivided into at least two electrically isolated subsegments. The semiconductor layer sequence has an active layer in each subarea. Furthermore, at least three electrical contact pads are provided. A first line level makes contact with a first of the at least two subsegments and with the first contact pad. A second line level makes contact with the second of the at least two subsegments and with a second contact pad. A third line level connects the two subsegments to one another and makes contact with the third contact pad. Furthermore, the line levels are each arranged opposite a first main face, wherein the first main face is intended to emit electromagnetic radiation that is produced.

Abstract: An optical level sensor (1) includes: mounting means (11) mounting the sensor (1) to a ceiling of the tank (9); a sensor tube (12, 12.1) provided with support and guidance elements (4) extending with at least three radially distributed positions inside the tank (9) and which collect support and guide optical fibers (3, 3.3, 3.4) to different heights of the tank (9), with each optical fiber (3) having a number of input sides (3.3) and a number of turns forming sensor heads between two input sides (3.3), for a different level (19); the corresponding support and guidance element (4) bending the fiber (3, 3.3, 3.4) in turns forming sensor heads of a small radius r around at least one corresponding guideway (4.3).

Abstract: In at least one embodiment of the optoelectronic lighting module the lighting module has a cooling body, a printed circuit board, and a substrate. One or more optoelectronic semiconductor chips is/are arranged on a substrate upper face. The semiconductor chips are electrically connected to the substrate. At least one retaining device lies directly or indirectly on the substrate upper face and presses a substrate lower face against a cooling body upper face. The substrate is electrically connected to the printed circuit board. The retaining device is electrically insulated from the at least one semiconductor chip.

Abstract: In at least one embodiment, an optoelectronic lighting module includes a circuit board, which an opening passes right through. The circuit board includes fastening devices for mechanically fastening the lighting module to an external heat sink. A carrier of the lighting module is mounted in the opening. At least one optoelectronic semiconductor chip is located on a carrier top and is connected electrically to the circuit board via the carrier. The circuit board is moreover connected firmly mechanically with the carrier. The circuit board is additionally designed to exert a mechanical force on the carrier and to press the carrier against the external heat sink. The carrier is designed to rest with a carrier bottom flat against the external heat sink.

Abstract: An arrangement having at least two light-emitting semiconductor components (101, 111) arranged adjacent to one another has envelopes (102, 112) at least partly surrounding the at least two light-emitting semiconductor components in each case. The envelopes contain a converter substance, which partly or completely converts the wavelength range of the radiation emitted by the semiconductor components. At least one optical damping element (103) is arranged between the at least two light-emitting semiconductor components, which optically isolates the respective envelopes of the semiconductor components in order to reduce a coupling-in from at least one envelope (102) into at least one other of the envelopes (112), or from at least one semiconductor component (101) into the envelope (112) of at least one of the other semiconductor components (111).

Abstract: The invention relates to a semiconductor laser device comprising a laser bar (2), a flexible conductor support (10), a supporting body (3) of a metal or a metal alloy and a heat sink (4), which is arranged between the supporting body (3) and the laser bar (2), the laser bar (2) being electrically contacted by the flexible conductor support (10) and the supporting body (3) having a thickness of at least 2 mm. The invention further relates to a method for producing the above-described semiconductor laser device, wherein a synchronous soldering process is used to solder the laser bar (2) to the heat sink (4) by means of a hard solder layer (30) and the heat sink (4) to the supporting body (3) by means of a further hard solder layer (31).

Abstract: An optically pumped semiconductor apparatus having a surface-emitting semiconductor body (1) which has a radiation passage area (1a) which faces away from a mounting plane of the semiconductor body (1), and an optical element (7) which is suitable for directing pump radiation (17) onto the radiation passage area (1a) of the semiconductor body (1).

Abstract: A method for fabricating an optically pumped semiconductor apparatus, having the following steps: provision of a connection carrier assembly (50) comprising a plurality of connection carriers (14) which are permanently connected to one another mechanically, arrangement of a surface-emitting semiconductor body (1) on a connection carrier (14) in the connection carrier assembly (50), and separation of the connection carrier assembly (50) into individual semiconductor apparatuses.

Abstract: An aspherical planoconvex lens (20), containing a material with a refractive index of at least 3.0, in which the height (h) of the convex region (21) is a maximum of one fifth of the thickness (1) of the lens (20). Also disclosed is a laser assembly incorporating such a lens and a method for the manufacture of such a laser assembly.

Abstract: A method for producing a multiplicity of semiconductor lasers (100) comprising the steps of providing a carrier wafer (30), producing an assembly (70) by applying a multiplicity of semiconductor laser chips (4) to a top side (31) of the carrier wafer (30), and singulating the assembly (70) to form a multiplicity of semiconductor lasers (100). Each semiconductor laser (100) comprises a mounting block (3) and at least one semiconductor laser chip (4). Each mounting block (3) has a mounting area (13) which runs substantially perpendicular to a top side (12) of the mounting block (3), on which top side the semiconductor laser chip (4) is arranged. The mounting area (13) is produced during the singulation of the assembly.

Abstract: An arrangement having at least two light-emitting semiconductor components (101, 111) arranged adjacent to one another has envelopes (102, 112) at least partly surrounding the at least two light-emitting semiconductor components in each case. The envelopes contain a converter substance, which partly or completely converts the wavelength range of the radiation emitted by the semiconductor components. At least one optical damping element (103) is arranged between the at least two light-emitting semiconductor components, which optically isolates the respective envelopes of the semiconductor components in order to reduce a coupling-in from at least one envelope (102) into at least one other of the envelopes (112), or from at least one semiconductor component (101) into the envelope (112) of at least one of the other semiconductor components (111).

Abstract: The invention is directed to a tilt sensor comprising at least one body movable along a predefined path and an optoelectronic unit for determining the position of said body, said tilt sensor being surface-mountable. The invention is further directed to a tilt sensor assembly.

Abstract: An optoelectronic module comprising: at least one light-emitting diode chip arranged on a carrier, and a mounting attachment fastened to the carrier and at least partly covering the light-emitting diode chip, and having a structured top which allows positioning of an optical element.

Abstract: An aspherical planoconvex lens (20), containing a material with a refractive index of at least 3.0, in which the height (h) of the convex region (21) is a maximum of one fifth of the thickness (l) of the lens (20). Also disclosed is a laser assembly incorporating such a lens and a method for the manufacture of such a laser assembly.