Abstract: Nanoparticle inks which do not require further processing steps after application to a substrate in order to form a conductive or decorative pattern are described. The nanoparticle inks contain metal nanoparticles, one or more humectants, a dispersant and a solvent. Methods for forming the nanoparticle inks include a low energy mixing step and a high energy mixing step in order to form nanoparticle inks with the desired properties. Also described are cartridges comprising the nanoparticle inks which can be installed in standard printers.

Abstract: A method of making an EMI/RFI shielding jacket comprising the steps of providing a heat-shrinkable woven fabric, coating the heat-shrinkable fabric with a conductive slurry, and drying the conductive slurry.

Abstract: The present invention relates to a material for shielding electromagnetic interference (EMI) and radio frequency interference (RFI) between a, electrical conductor or bundle of conductors and the environment. The material comprises a heat-shrinkable woven fabric coated with a conductive material. Specifically, the material can be used as a jacket heat-shrinkable to fit with any sized wire, cable, data or signal line, antenna, or other electrical conductor. A method of making the material is also discussed. In the method, a heat-shrinkable woven fabric is coated with a conductive slurry. When the slurry is dried, a conductive material is deposited on the surface of the heat-shrinkable woven fabric.

Abstract: The present invention is to provide a flexible interconnector that contains a cable having an adhesive on one terminal end and a ZIF connector at the other terminal end. In a preferred embodiment, the cable is a flat ribbon cable. When used to connect two electrical subassemblies, one end of the connector is connected to connecting terminals on a first electrical subassembly via an adhesive, while the other end is connected to a second electrical subassembly via a ZIF connector.

Abstract: A conductive via filler for printed wiring boards capable of reducing copper oxides and thereby eliminating a cleaning step in printed wiring board construction, the conductive via filler consisting essentially of silver flake, a resin, a hardener, and a titanate coupling compound. The filler or paste may further include one or more of a flexibilizer, a solvent, and/or an accelerator. It is a feature of the invention that extensive pre-cleaning of copper substrates is obviated.

Abstract: The present invention relates to a material for shielding electromagnetic interference (EMI) and radio frequency interference (RFI) between a, electrical conductor or bundle of conductors and the environment. The material comprises a heat-shrinkable woven fabric coated with a conductive material. Specifically, the material can be used as a jacket heat-shrinkable to fit with any sized wire, cable, data or signal line, antenna, or other electrical conductor. A method of making the material is also discussed. In the method, a heat-shrinkable woven fabric is coated with a conductive slurry. When the slurry is dried, a conductive material is deposited on the surface of the heat-shrinkable woven fabric.

Abstract: A conductive via filler for printed wiring boards capable of reducing copper oxides and thereby eliminating a cleaning step in printed wiring board construction, the conductive via filler consisting essentially of silver flake, a resin, a hardener, and a titanate coupling compound. The filler or paste may further include one or more of a flexibilizer, a solvent, and/or an accelerator. It is a feature of the invention that extensive pre-cleaning of copper substrates is obviated.

Abstract: A conductive via filler for printed wiring boards capable of reducing copper oxides and thereby eliminating a cleaning step in printed wiring board construction, the conductive via filler consisting essentially of silver flake, a resin, a hardener, and a titanate coupling compound. The filler or paste may further include one or more of a flexibilizer, a solvent, and/or an accelerator. It is a feature of the invention that extensive pre-cleaning of copper substrates is obviated.

Abstract: A conductive plug is formed in drilled-through vias of a printed circuit board of a polymer ink composition by a method of flooding the vias of a printed circuit board having parchment paper attached to an underside while the printed circuit board is on a vacuum table to form a first layer of the conductive plug within the vias. A second layer of the conductive plug within the via is formed by placing a stencil over the circuit board and flooding the holes of the stencil in order to form a second layer of the conductive plug within the vias of the printed circuit board.

Abstract: This invention provides conductive compositions that are directly solderable and that can be bonded directly to substrates. The compositions are made of silver exclusively in the form of flake and a resin system, said resin system comprising phenolic resin, acrylic resin, polyurethane resin, vinyl chloride/vinyl acetate copolymer, epoxy resin and epoxy hardner. By making a mixture of such a complex vehicle system a composition is produced that displays outstanding solderability and adhesion. Also provided is a method of making these compositions.

Abstract: This invention discloses conductive compositions having improved solderability. These compositions contain metal and/or alloys thereof coated with saturated monocarboxylic acid which is dispersed in an organic polymeric matrix. Also disclosed is a method for preparing these conductive compositions. Another embodiment of the invention is a method of coating metal and/or alloys thereof with carboxylic acid.