Patents by Inventor Frank Staals
Frank Staals has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240012337Abstract: A method for determining a metric of a feature on a substrate obtained by a semiconductor manufacturing process involving a lithographic process, the method including: obtaining an image of at least part of the substrate, wherein the image includes at least the feature; determining a contour of the feature from the image; determining a plurality of segments of the contour; determining respective weights for each of the plurality of segments; determining, for each of the segments, an image-related metric; and determining the metric of the feature in dependence on the weights and the calculated image-related metric of each of the segments.Type: ApplicationFiled: August 3, 2023Publication date: January 11, 2024Applicant: ASML NETHERLANDS B.V.Inventors: Wim Tjibbo TEL, Mark John MASLOW, Koenraad VAN INGEN SCHENAU, Patrick WARNAAR, Abraham SLACHTER, Roy ANUNCIADO, Simon Hendrik Celine VAN GORP, Frank STAALS, Marinus JOCHEMSEN
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Publication number: 20240004299Abstract: A method involving determining a contribution that one or more process apparatuses make to a characteristic of a substrate after the substrate has been processed according to a patterning process by the one or more process apparatuses by removing from values of the characteristic of the substrate a contribution of a lithography apparatus to the characteristic and a contribution of one or more pre-lithography process apparatuses to the characteristic.Type: ApplicationFiled: August 11, 2023Publication date: January 4, 2024Applicant: ASML NETHERLANDS B.V.Inventors: Wim Tjibbo TEL, Mark John MASLOW, Frank STAALS, Paul Christiaan HINNEN
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Publication number: 20230305407Abstract: Disclosed is a method for focus measurement of a lithographic process. The method comprises receiving a substrate on which a metrology pattern has been printed with a lithographic apparatus with an illumination pupil, illuminating the metrology pattern with a metrology tool to measure a signal based on radiation scattered by the metrology pattern, and determining or monitoring a focus of the lithographic process based on the measured signal. Position of at least part of the metrology pattern is focus dependent. At least part of the metrology pattern has been printed by the lithography apparatus with an angular asymmetric illumination pupil.Type: ApplicationFiled: July 6, 2021Publication date: September 28, 2023Applicant: ASML Netherlands B.V.Inventors: Fei LIU, Jin LIAN, Zhuangxiong HUANG, Laurentius Cornelius DE WINTER, Frank STAALS
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Patent number: 11768442Abstract: A method including: obtaining an image of at least part of a substrate, wherein the image includes at least one feature of a device being manufactured in a layer on the substrate; obtaining a layout of features associated with a previous layer adjacent to the layer on the substrate; calculating one or more image-related metrics in dependence on: 1) a contour determined from the image including the at least one feature and 2) the layout; and determining one or more control parameters of a lithographic apparatus and/or one or more further processes in a manufacturing process of the device in dependence on the one or more image-related metrics, wherein at least one of the control parameters is determined to modify the geometry of the contour in order to improve the one or more image-related metrics.Type: GrantFiled: October 25, 2022Date of Patent: September 26, 2023Assignee: ASML NETHERLANDS B.V.Inventors: Wim Tjibbo Tel, Mark John Maslow, Koenraad Van Ingen Schenau, Patrick Warnaar, Abraham Slachter, Roy Anunciado, Simon Hendrik Celine Van Gorp, Frank Staals, Marinus Jochemsen
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Patent number: 11733610Abstract: A method involving determining a contribution that one or more process apparatuses make to a characteristic of a substrate after the substrate has been processed according to a patterning process by the one or more process apparatuses by removing from values of the characteristic of the substrate a contribution of a lithography apparatus to the characteristic and a contribution of one or more pre-lithography process apparatuses to the characteristic.Type: GrantFiled: December 20, 2019Date of Patent: August 22, 2023Assignee: ASML NETHERLANDS B.V.Inventors: Wim Tjibbo Tel, Mark John Maslow, Frank Staals, Paul Christiaan Hinnen
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Patent number: 11733615Abstract: Disclosed is a method for selecting a structure for focus monitoring. The method comprises: simulating a Bossung response with focus of a focus dependent parameter, for one or more different structures; and selecting a structure for focus monitoring in a manufacturing process based on the results of said simulating step. The simulating step may be performed using a computational lithography simulation.Type: GrantFiled: December 5, 2019Date of Patent: August 22, 2023Assignee: ASML Netherlands B.V.Inventors: Frank Staals, Christoph Rene Konrad Cebulla Hennerkes
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Publication number: 20230161264Abstract: A method for determining a wavefront parameter of a patterning process. The method includes obtaining a reference performance (e.g., a contour, EPE, CD) of a reference apparatus (e.g., a scanner), a lens model for a patterning apparatus configured to convert a wavefront parameter of a wavefront to actuator movement, and a lens fingerprint of a tuning apparatus (e.g., a to-be-matched scanner). Further, the method involves determining the wavefront parameter (e.g., a wavefront parameter such as tilt, offset, etc.) based on the lens fingerprint of the tuning apparatus, the lens model, and a cost function, wherein the cost function is a difference between the reference performance and a tuning apparatus performance.Type: ApplicationFiled: December 28, 2022Publication date: May 25, 2023Applicant: ASML NETHERLANDS B.V.Inventors: Duan-Fu Stephen HSU, Christoph Rene Konrad Cebulla Hennerkes, Rafael C. Howell, Zhan Shi, Xiaoyang Jason Li, Frank Staals
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Publication number: 20230058839Abstract: A method for determining a metric of a feature on a substrate obtained by a semiconductor manufacturing process involving a lithographic process, the method including: obtaining an image of at least part of the substrate, wherein the image includes at least the feature; determining a contour of the feature from the image; determining a plurality of segments of the contour; determining respective weights for each of the plurality of segments; determining, for each of the segments, an image-related metric; and determining the metric of the feature in dependence on the weights and the calculated image-related metric of each of the segments.Type: ApplicationFiled: October 25, 2022Publication date: February 23, 2023Applicant: ASML NETHERLANDS B.V.Inventors: Wim Tjibbo TEL, Mark John MASLOW, Koenraad VAN INGEN SCHENAU, Patrick WARNAAR, Abraham SLACHTER, Roy ANUNCIADO, Simon Hendrick Celine VAN GRORP, Frank STAALS, Marinus JOCHEMSEN
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Patent number: 11586114Abstract: A method for determining a wavefront parameter of a patterning process. The method includes obtaining a reference performance (e.g., a contour, EPE, CD) of a reference apparatus (e.g., a scanner), a lens model for a patterning apparatus configured to convert a wavefront parameter of a wavefront to actuator movement, and a lens fingerprint of a tuning apparatus (e.g., a to-be-matched scanner). Further, the method involves determining the wavefront parameter (e.g., a wavefront parameter such as tilt, offset, etc.) based on the lens fingerprint of the tuning apparatus, the lens model, and a cost function, wherein the cost function is a difference between the reference performance and a tuning apparatus performance.Type: GrantFiled: June 21, 2019Date of Patent: February 21, 2023Assignee: ASML Netherlands B.V.Inventors: Duan-Fu Stephen Hsu, Christoph Rene Konrad Cebulla Hennerkes, Rafael C. Howell, Zhan Shi, Xiaoyang Jason Li, Frank Staals
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Publication number: 20230042759Abstract: A method including: computing a value of a first variable of a pattern of, or for, a substrate processed by a patterning process by combining a fingerprint of the first variable on the substrate and a certain value of the first variable; and determining a value of a second variable of the pattern based at least in part on the computed value of the first variable.Type: ApplicationFiled: October 18, 2022Publication date: February 9, 2023Applicant: ASML NETHERLANDS B.V.Inventors: Wim Tjibbo Tel, Frank Staals, Mark John Maslow, Roy Anunciado, Marinus Jochemsen, Hugo Augustinus Joseph Cramer, Thomas Theeuwes, Paul Christiaan Hinnen
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Publication number: 20230021079Abstract: A method for controlling a lithographic apparatus, and associated apparatuses. The method is configured to provide product structures to a substrate in a lithographic process and includes determining optimization data. The optimization data includes measured and/or simulated data of at least one performance parameter associated with the product structures and/or their arrangement which are to be applied to the substrate in the lithographic process. Substrate specific metrology data as measured and/or modelled before the providing of product structures to the substrate is determined, the substrate specific metrology data including metrology data relating to a characteristic of the substrate to which the structures are being applied and/or the state of the lithographic apparatus at the time that the structures are applied to the substrate.Type: ApplicationFiled: September 27, 2022Publication date: January 19, 2023Applicant: ASML NETHERLANDS B.V.Inventor: Frank STAALS
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Patent number: 11520239Abstract: A method including: computing a value of a first variable of a pattern of, or for, a substrate processed by a patterning process by combining a fingerprint of the first variable on the substrate and a certain value of the first variable; and determining a value of a second variable of the pattern based at least in part on the computed value of the first variable.Type: GrantFiled: February 17, 2017Date of Patent: December 6, 2022Assignee: ASML Netherlands B.V.Inventors: Wim Tjibbo Tel, Frank Staals, Mark John Maslow, Roy Anunciado, Marinus Jochemsen, Hugo Augustinus Joseph Cramer, Thomas Theeuwes, Paul Christiaan Hinnen
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Patent number: 11513442Abstract: A method for determining a metric of a feature on a substrate obtained by a semiconductor manufacturing process involving a lithographic process, the method including: obtaining an image of at least part of the substrate, wherein the image includes at least the feature; determining a contour of the feature from the image; determining a plurality of segments of the contour; determining respective weights for each of the plurality of segments; determining, for each of the segments, an image-related metric; and determining the metric of the feature in dependence on the weights and the calculated image-related metric of each of the segments.Type: GrantFiled: August 22, 2018Date of Patent: November 29, 2022Assignee: ASML Netherlands B.V.Inventors: Wim Tjibbo Tel, Mark John Maslow, Koenraad Van Ingen Schenau, Patrick Warnaar, Abraham Slachter, Roy Anunciado, Simon Hendrik Celine Van Gorp, Frank Staals, Marinus Jochemsen
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Publication number: 20220357672Abstract: A method of inferring a value for a first processing parameter of a lithographic process, the first processing parameter being subject to a coupled dependency of a second processing parameter. The method includes determining a first metric and a second metric from measurement data, each of the first metric and second metric being dependent on both the first processing parameter and second processing parameter The first metric shows a stronger dependence to the first processing parameter than the second processing parameter and the second metric shows a stronger dependence to the second processing parameter than the first processing parameter. The value for the first processing parameter is inferred from the first and second metrics.Type: ApplicationFiled: September 7, 2020Publication date: November 10, 2022Applicant: ASML NETHERLANDS B.V.Inventor: Frank STAALS
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Patent number: 11487209Abstract: A method for controlling a lithographic apparatus, and associated apparatuses. The method is configured to provide product structures to a substrate in a lithographic process and includes determining optimization data. The optimization data includes measured and/or simulated data of at least one performance parameter associated with the product structures and/or their arrangement which are to be applied to the substrate in the lithographic process. Substrate specific metrology data as measured and/or modeled before the providing of product structures to the substrate is determined, the substrate specific metrology data including metrology data relating to a characteristic of the substrate to which the structures are being applied and/or the state of the lithographic apparatus at the time that the structures are applied to the substrate.Type: GrantFiled: November 15, 2018Date of Patent: November 1, 2022Assignee: ASML Netherlands B.V.Inventor: Frank Staals
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Publication number: 20220342319Abstract: A method, system and program for determining a fingerprint of a parameter. The method includes determining a contribution from a device out of a plurality of devices to a fingerprint of a parameter. The method includes obtaining parameter data and usage data, wherein the parameter data is based on measurements for multiple substrates having been processed by the plurality of devices, and the usage data indicates which of the devices out of the plurality of the devices were used in the processing of each substrate; and determining the contribution using the usage data and parameter data.Type: ApplicationFiled: July 1, 2022Publication date: October 27, 2022Applicant: ASML NETHERLANDS B.V.Inventors: Davit Harutyunyan, Fei Jia, Frank Staals, Fuming Wang, Hugo Thomas Looijestijn, Cornelis Johannes Rijnierse, Maxim Pisarenco, Roy Werkman, Thomas Theeuwes, Tom Van Hemert, Vahid Bastani, Jochem Wildenberg, Everhardus Cornelis Mos, Erik Johannes Maria Wallerbos
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Patent number: 11480884Abstract: A method for improving the yield of a lithographic process, the method including: determining a parameter fingerprint of a performance parameter across a substrate, the parameter fingerprint including information relating to uncertainty in the performance parameter; determining a process window fingerprint of the performance parameter across the substrate, the process window being associated with an allowable range of the performance parameter; and determining a probability metric associated with the probability of the performance parameter being outside an allowable range. Optionally a correction to the lithographic process is determined based on the probability metric.Type: GrantFiled: July 23, 2020Date of Patent: October 25, 2022Assignee: ASML Netherlands B.V.Inventors: Everhardus Cornelis Mos, Jochem Sebastiaan Wildenberg, Erik Johannes Maria Wallerbos, Maurits Van Der Schaar, Frank Staals, Franciscus Hendricus Arnoldus Elich
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Patent number: 11422476Abstract: A method for monitoring a lithographic process, and associated lithographic apparatus. The method includes obtaining height variation data relating to a substrate supported by a substrate support and fitting a regression through the height variation data, the regression approximating the shape of the substrate; residual data between the height variation data and the regression is determined; and variation of the residual data is monitored over time. The residual data may be deconvolved based on known features of the substrate support.Type: GrantFiled: October 2, 2020Date of Patent: August 23, 2022Assignee: ASML Netherlands B.V.Inventors: Emil Peter Schmitt-Weaver, Kaustuve Bhattacharyya, Wim Tjibbo Tel, Frank Staals, Leon Martin Levasier
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Patent number: 11385554Abstract: Disclosed is a method of determining a characteristic of interest, in particular focus, relating to a structure on a substrate formed by a lithographic process, and an associated patterning device and lithographic system. The method comprises forming a modified substrate feature on the substrate using a corresponding modified reticle feature on a patterning device, the modified substrate feature being formed for a primary function other than metrology, more specifically for providing a support for a vertically integrated structure. The modified reticle feature is such that said modified substrate feature is formed with a geometry dependent on the characteristic of interest during formation. The modified substrate feature can be measured to determine said characteristic of interest.Type: GrantFiled: June 28, 2019Date of Patent: July 12, 2022Assignee: ASML Netherlands B.V.Inventors: Miguel Garcia Granda, Steven Erik Steen, Eric Jos Anton Brouwer, Bart Peter Bert Segers, Pierre-Yves Jerome Yvan Guittet, Frank Staals, Paulus Jacobus Maria Van Adrichem
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Patent number: 11378891Abstract: A method, system and program for determining a fingerprint of a parameter. The method includes determining a contribution from a device out of a plurality of devices to a fingerprint of a parameter. The method includes obtaining parameter data and usage data, wherein the parameter data is based on measurements for multiple substrates having been processed by the plurality of devices, and the usage data indicates which of the devices out of the plurality of the devices were used in the processing of each substrate; and determining the contribution using the usage data and parameter data.Type: GrantFiled: September 17, 2020Date of Patent: July 5, 2022Assignee: ASML Netherlands B.V.Inventors: Davit Harutyunyan, Fei Jia, Frank Staals, Fuming Wang, Hugo Thomas Looijestijn, Cornelis Johannes Rijnierse, Maxim Pisarenco, Roy Werkman, Thomas Theeuwes, Tom Van Hemert, Vahid Bastani, Jochem Sebastiaan Wildenberg, Everhardus Cornelis Mos, Erik Johannes Maria Wallerbos