Patents by Inventor Frank Stepniak
Frank Stepniak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230326897Abstract: Die backside metallization methods and apparatus are disclosed. In one aspect, a method of forming a die involves providing a backside metallization layer on the die prior to attaching the die to a chip carrier. Various possible attaching techniques such as a backside solder, transient liquid phase bonding, or solid state diffusion bonding may be used. The resulting apparatus may have a relatively thin bond layer that has a relatively uniform thickness. The thin bond layer having an essentially constant thickness provides good thermal properties while being resistant to delamination from thermal cycling.Type: ApplicationFiled: April 11, 2022Publication date: October 12, 2023Inventors: Daniel Richter, Frank Stepniak
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Patent number: 10104764Abstract: A system-in-a-package (SIP) has a semiconductor chip embedded in a dielectric substrate. An inductor is on a top surface of a substrate and is connected to the semiconductor chip. A thin film capacitor may be placed between the inductor and the dielectric substrate. A second thin film capacitor may be placed on the top surface of the semiconductor chip, or be embedded in the dielectric substrate with a thermal pad on a bottom surface of the substrate which is connected to the second thin film capacitor to facilitate heat dissipation.Type: GrantFiled: March 18, 2014Date of Patent: October 16, 2018Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Frank Stepniak, Anton Winkler
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Patent number: 9899339Abstract: A method of making an electronic device having a discrete device mounted on a surface of an electronic die with both the discrete device and the die connected by heat cured conductive ink and covered with cured encapsulant including placing the discrete device on the die; and keeping the temperature of each of the discrete device and the die below about 200° C. Also disclosed is a method of electrically attaching a discrete device to a substrate that includes placing the device on the substrate, applying conductive ink that connects at least one terminal on the device to at least one contact on the substrate and curing the conductive ink. Also disclosed is an IC package with a discrete electrical device having electrical terminals; an electrical substrate having contact pads on a surface thereof; and cured conductive ink connecting at least one of the electrical terminals with at least one of the contact pads.Type: GrantFiled: November 5, 2012Date of Patent: February 20, 2018Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri
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Patent number: 9852979Abstract: An electronic system comprising an electronic body (301) with terminal pads (310) and at least one capacitor embedded in the electronic body. The capacitor including an insulating and adhesive first polymeric film (302) covering the body surface except the terminal pads; a sheet (320) of high-density capacitive elements, the first capacitor terminal being a metal foil (321) attached to film (302), the second terminal a conductive polymeric compound (324), and the insulator a dielectric skin (323). Sheet (320) has sets of via holes: the first set holes reaching metal foil 321), the second set holes reaching the terminals (310), and the third set holes reaching the conductive polymeric compound (324). An insulating second polymeric film (303) lining the sidewalls of the holes and planarizing the sheet surface; and metal (432) filling the via holes between the polymeric sidewalls and forming conductive traces and attachment pads on the system surface.Type: GrantFiled: October 31, 2016Date of Patent: December 26, 2017Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Matthew D. Romig, Frank Stepniak, Saumya Gandhi
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Publication number: 20170047283Abstract: An electronic system comprising an electronic body (301) with terminal pads (310) and at least one capacitor embedded in the electronic body. The capacitor including an insulating and adhesive first polymeric film (302) covering the body surface except the terminal pads; a sheet (320) of high-density capacitive elements, the first capacitor terminal being a metal foil (321) attached to film (302), the second terminal a conductive polymeric compound (324), and the insulator a dielectric skin (323). Sheet (320) has sets of via holes: the first set holes reaching metal foil 321), the second set holes reaching the terminals (310), and the third set holes reaching the conductive polymeric compound (324). An insulating second polymeric film (303) lining the sidewalls of the holes and planarizing the sheet surface; and metal (432) filling the via holes between the polymeric sidewalls and forming conductive traces and attachment pads on the system surface.Type: ApplicationFiled: October 31, 2016Publication date: February 16, 2017Inventors: Matthew D. Romig, Frank Stepniak, Saumya Gandhi
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Patent number: 9572261Abstract: An electronic system comprising an electronic body (301) with terminal pads (310) and at least one capacitor embedded in the electronic body. The capacitor including an insulating and adhesive first polymeric film (302) covering the body surface except the terminal pads; a sheet (320) of high-density capacitive elements, the first capacitor terminal being a metal foil (321) attached to film (302), the second terminal a conductive polymeric compound (324), and the insulator a dielectric skin (323). Sheet (320) has sets of via holes: the first set holes reaching metal foil 321), the second set holes reaching the terminals (310), and the third set holes reaching the conductive polymeric compound (324). An insulating second polymeric film (303) lining the sidewalls of the holes and planarizing the sheet surface; and metal (432) filling the via holes between the polymeric sidewalls and forming conductive traces and attachment pads on the system surface.Type: GrantFiled: March 25, 2015Date of Patent: February 14, 2017Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Matthew D. Romig, Frank Stepniak, Saumya Gandhi
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Publication number: 20160286654Abstract: An electronic system comprising an electronic body (301) with terminal pads (310) and at least one capacitor embedded in the electronic body. The capacitor including an insulating and adhesive first polymeric film (302) covering the body surface except the terminal pads; a sheet (320) of high-density capacitive elements, the first capacitor terminal being a metal foil (321) attached to film (302), the second terminal a conductive polymeric compound (324), and the insulator a dielectric skin (323). Sheet (320) has sets of via holes: the first set holes reaching metal foil 321), the second set holes reaching the terminals (310), and the third set holes reaching the conductive polymeric compound (324). An insulating second polymeric film (303) lining the sidewalls of the holes and planarizing the sheet surface; and metal (432) filling the via holes between the polymeric sidewalls and forming conductive traces and attachment pads on the system surface.Type: ApplicationFiled: March 25, 2015Publication date: September 29, 2016Inventors: Matthew D. Romig, Frank Stepniak, Saumya Gandhi
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Patent number: 9321631Abstract: A method for fabricating a micro-electro-mechanical system (MEMS) provides a semiconductor chip having a cavity with a radiation sensor MEMS. The opening of the cavity at the chip surface is covered by a plate transmissive to the radiation sensed by the MEMS. A patterned metal film is placed across the plate surface remote from the cavity.Type: GrantFiled: September 19, 2014Date of Patent: April 26, 2016Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Christopher Daniel Manack, Frank Stepniak, Sreenivasan K. Koduri
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Publication number: 20150271913Abstract: A system-in-a-package (SIP) has a semiconductor chip embedded in a dielectric substrate. An inductor is on a top surface of a substrate and is connected to the semiconductor chip. A thin film capacitor may be placed between the inductor and the dielectric substrate. A second thin film capacitor may be placed on the top surface of the semiconductor chip, or be embedded in the dielectric substrate with a thermal pad on a bottom surface of the substrate which is connected to the second thin film capacitor to facilitate heat dissipation.Type: ApplicationFiled: March 18, 2014Publication date: September 24, 2015Applicants: Texas Instruments Deutschland GmbH, Texas Instruments IncorporatedInventors: FRANK STEPNIAK, ANTON WINKLER
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Patent number: 9111845Abstract: An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.Type: GrantFiled: August 26, 2014Date of Patent: August 18, 2015Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri
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Publication number: 20150061103Abstract: A method of making an electrical assembly includes making a laminate substrate, embedding a plurality of integrated circuit dies in the laminate substrate, forming a plurality of through-holes in the laminate substrate and adding conductive material to the through-holes, and making at least one saw cut extending through the laminate substrate and through the plurality of through-holes and the conductive material therein to form at least one laminate block with a cut face and a plurality of sectioned through-holes.Type: ApplicationFiled: August 28, 2013Publication date: March 5, 2015Applicants: Texas Instruments Deutschland GMBH, Texas Instruments IncorporatedInventors: Christopher Daniel Manack, Frank Stepniak, Anton Winkler
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Patent number: 8945986Abstract: One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.Type: GrantFiled: January 14, 2014Date of Patent: February 3, 2015Assignee: Texas Instruments IncorporatedInventors: Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri
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Publication number: 20150004739Abstract: A method for fabricating a micro-electro-mechanical system (MEMS) provides a semiconductor chip having a cavity with a radiation sensor MEMS. The opening of the cavity at the chip surface is covered by a plate transmissive to the radiation sensed by the MEMS. A patterned metal film is placed across the plate surface remote from the cavity.Type: ApplicationFiled: September 19, 2014Publication date: January 1, 2015Inventors: Christopher Daniel Manack, Frank Stepniak, Sreenivasan K. Koduri
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Publication number: 20140361402Abstract: An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.Type: ApplicationFiled: August 26, 2014Publication date: December 11, 2014Inventors: Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri
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Patent number: 8866237Abstract: An embedded micro-electro-mechanical system (MEMS) (100) comprising a semiconductor chip (101) embedded in an insulating board (120), the chip having a cavity (102) including a radiation sensor MEMS (105), the opening (104) of the cavity at the chip surface covered by a plate (110) transmissive to the radiation (150) sensed by the MEMS. The plate surface remote from the cavity having a bare central area, to be exposed to the radiation sensed by the MEMS in the cavity, and a peripheral area covered by a metal film (111) touching the plate surface and a layer (112) of adhesive stacked on the metal film.Type: GrantFiled: February 27, 2012Date of Patent: October 21, 2014Assignee: Texas Instruments IncorporatedInventors: Christopher D. Manack, Frank Stepniak, Sreenivasan K. Koduri
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Patent number: 8847349Abstract: An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.Type: GrantFiled: December 21, 2012Date of Patent: September 30, 2014Assignee: Texas Instruments IncorporatedInventors: Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Screenivasan K. Koduri
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Patent number: 8816513Abstract: One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.Type: GrantFiled: August 22, 2012Date of Patent: August 26, 2014Assignee: Texas Instruments IncorporatedInventors: Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri
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Publication number: 20140175599Abstract: An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.Type: ApplicationFiled: December 21, 2012Publication date: June 26, 2014Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri
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Publication number: 20140124939Abstract: A method of making an electronic device having a discrete device mounted on a surface of an electronic die with both the discrete device and the die connected by heat cured conductive ink and covered with cured encapsulant including placing the discrete device on the die; and keeping the temperature of each of the discrete device and the die below about 200° C. Also disclosed is a method of electrically attaching a discrete device to a substrate that includes placing the device on the substrate, applying conductive ink that connects at least one terminal on the device to at least one contact on the substrate and curing the conductive ink. Also disclosed is an IC package with a discrete electrical device having electrical terminals; an electrical substrate having contact pads on a surface thereof; and cured conductive ink connecting at least one of the electrical terminals with at least one of the contact pads.Type: ApplicationFiled: November 5, 2012Publication date: May 8, 2014Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri
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Publication number: 20140127856Abstract: One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.Type: ApplicationFiled: January 14, 2014Publication date: May 8, 2014Applicant: Texas Instruments IncorporatedInventors: Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri