Patents by Inventor Frank Stroili

Frank Stroili has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060071845
    Abstract: What is provided is a receiver-on-a-chip comprising a monolithic integrated circuit that reduces the receiver to a cigarette-pack-sized assembly mountable directly at an antenna element, with a much-increased operational bandwidth and instantaneous bandwidth, increased dynamic range and with a two-order-of-magnitude decrease in size and weight. Moreover, because of the elimination of all of the I/O drivers and attendant circuitry, power consumption is reduced by two-thirds, whereas the mean time before failure is increased to 10,000 hours due to the robustness of the monolithic integrated circuit and use of fiber optics.
    Type: Application
    Filed: January 20, 2005
    Publication date: April 6, 2006
    Inventors: Frank Stroili, James Huggett
  • Patent number: 7017140
    Abstract: A multi-level framework that allows an application to be developed independent of the chip or board, and any dependency is built in as part of the framework of the field programmable device (FPD). A shell configuration called a ‘wrapper’ has a standard look, feel and form factor that provides the interface between the high density language (HDL) application and a standardized and board independent HDL shell, thus isolating the HDL core. A second wrapper is a board specific HDL shell that interacts with the standardized shell. Any application that has the same look, feel and form factor has a common interface that allows various system boards to communicate, providing a mechanism for creating a HDL application component independent of the hardware. An outer shell binds the system to some board and talks to the application program interface (API) layer and the code layer to the outside world, such as the operating system.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: March 21, 2006
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Kazem Haji-Aghajani, Christopher L. Hayes, Peter Simonson, Frank Stroili, Matthew Thiele, Robert P. Boland
  • Publication number: 20040045015
    Abstract: A multi-level framework that allows an application to be developed independent of the chip or board, and any dependency is built in as part of the framework of the field programmable device (FPD). A shell configuration called a ‘wrapper’ has a standard look, feel and form factor that provides the interface between the high density language (HDL) application and a standardized and board independent HDL shell, thus isolating the HDL core. A second wrapper is a board specific HDL shell that interacts with the standardized shell. Any application that has the same look, feel and form factor has a common interface that allows various system boards to communicate, providing a mechanism for creating a HDL application component independent of the hardware. An outer shell binds the system to some board and talks to the application program interface (API) layer and the code layer to the outside world, such as the operating system.
    Type: Application
    Filed: November 25, 2002
    Publication date: March 4, 2004
    Inventors: Kazem Haji-Aghajani, Christopher L. Hayes, Peter Simonson, Frank Stroili, Matthew Thiele, Robert P. Boland