Abstract: A microcell having a plurality of antennas attached to an upper portion thereof is arranged to move along an interior of a guyed latticework tower. As the microcell is being raised, the antennas are in a stowed position within the confines of the tower structure. When the microcell reaches the top of the tower, the antennas are deployed by deploying mechanisms which utilize the vertical upward motion of the microcell to produce outwardly directed movement of the antennas to a deployed position. In the deployed position, the spacing between the antennas is greater than the distance between adjacent stanchions of the tower structure. The deploying motion is accomplished without additional driving motors, but is instead produced by the upward movement of the microcell driven by a winch and cable arrangement.

Abstract: A multi-layer printed wiring board includes multiple dielectric cores and conductive layers. The conductive layers include a first layer having a first thickness and a first set of line widths, and a second layer having a second thickness and a second set of line widths. The first thickness is greater than the second thickness. A heat pipe is attached to the printed willing board rather than to an integrated circuit with surface mounting, connection by through holes or with tabs.

Abstract: An apparatus for mounting a component having a housing, the housing including a backplate. The apparatus includes a pair of mounting tabs disposed on the backplate. Each mounting tab includes a support member attached to the backplate and a flange member attached to the support member. The mounting tabs are arranged so that the flange members are disposed towards each other. The apparatus also includes a bracket that includes a baseplate defining a plane and a mounting pad disposed on the baseplate in the plane. The mounting pad includes a central area, attached to the baseplate, and a finger attached to the central area. The finger projects in the plane and is articulable in the plane. The mounting pad may be disposed in a region between the support members of the mounting tabs and between the flange members of the mounting tabs and the baseplate.

Abstract: An apparatus for mounting a component having a housing, the housing including a backplate. The apparatus includes a pair of mounting tabs disposed on the backplate. Each mounting tab includes a support member attached to the baseplate and a flange member attached to the support member. The mounting tabs are arranged so that the flange members are disposed towards each other. The apparatus also includes a bracket including a baseplate defining a plane and a mounting pad disposed on the baseplate in the plane. The mounting pad includes an attachment area, attached to the baseplate, and a finger attached to the central area, the finger projecting in the plane and articulable in the plane. The mounting pad may be disposed in a region between the support members of the mounting pads and between the flange members of the mounting pads and the baseplate.

Abstract: A housing encloses a multi-layer printed wiring board. A set of mounting heat sinks is fitted through the housing and contacts the multi-layer printed wiring board. The set of mounting heat sinks dissipates heat from the printed wiring board and is used to mount the printed wiring board to a wall.

Abstract: An apparatus and method are provided for removing heat generated by the operation of electronic devices to allow for a more densely packed arrangement of the electronic devices on a parent board. The apparatus comprises a metallic housing that encloses a flexible backplane with a pair of rigid supports mounted on its bottom surface and at least one electrical device connected to the top surface of the backplane that is supported by the rigid supports. The flexible backplane is folded and positioned within the housing such that the rigid supports face inwardly with respect to the housing and the electronic devices face outwardly with respect to the housing. A biasing member is positioned between the rigid supports for biasing the electronic devices against the housing. The flexible backplane is a flexible circuit board that supports a PC card array and the loading device is a cylindrical elastomeric compressor.

Abstract: An apparatus for cooling and warming pole-mounted electronics includes a hollow pole having an upper portion capable of supporting the electronics and a lower portion supported by the ground. An air duct is disposed within the hollow pole such that the hollow pole and the air duct are substantially concentrically aligned about a central longitudinal axis, creating an annular air conduit between the air duct and the hollow pole. A circulating fan is fastened in the lower portion of the hollow pole above ground level. In cooling operation, warm air is drawn downward from the electronics through the air duct, cooled below ground level, and returned via the annular air conduit. The shape of the hollow pole is selected such that at a particular orientation of the sun, the ratio of the shaded surface to the illuminated surface is greater than one.

Abstract: A method and apparatus maintain the operating temperature of an electronic device within an acceptable operating range for a wide range of ambient temperatures. The apparatus includes a heat sink and a temperature dependent loading device which brings the heat sink into thermal contact with the electronic device when the ambient temperature exceeds a threshold level.

Abstract: An apparatus for cooling an array of PC cards includes a chassis defining a chamber having air holes. A heat sink is mounted to the chassis within the chamber and has a finned surface for transferring heat to the surrounding environment, a finless surface on a side opposite the finned surface, and heat pipes fully enclosed within the heat sink, facilitating conductive heat transfer between the finned and finless surfaces. A backplane mounted to the chassis has at least one connector mechanically and electrically connectable to at least one PC card so that a surface of the at least one PC card is in close proximity to and substantially parallel to the finless surface of the heat sink thus facilitating heat transfer between the at least one PC card and the heat sink.