Patents by Inventor Frank VON HORSTEN

Frank VON HORSTEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTIC COPPER PLATING
    Publication number: 20210262105
    Abstract: The present invention relates to a composition comprising one or a mixture of two or more quinoline-polyethylene glycol containing compound, each quinoline-polyethylene glycol containing compound comprising: one to three quinoline group and one or more polyethylene glycol group, wherein, in each said quinoline-polyethylene glycol containing compound, one to three of said one to three quinoline group is connected via one or more oxygen atom of said one or more polyethylene glycol group via carbon 6 or carbon 8 of said one to three quinoline group.
    Type: Application
    Filed: May 10, 2021
    Publication date: August 26, 2021
    Inventors: Kun SI, Ralf SCHMIDT, Onas BOLTON, Josef GAIDA, Frank VON HORSTEN, Dirk ROHDE, Himendra JHA, Jens PALM, Olivier MANN, Angela LLAVONA-SERRANO
  • Acidic aqueous composition for electrolytic copper plating
    Patent number: 11035051
    Abstract: The present invention relates to an acidic aqueous composition (plating bath) for electrolytic copper plating (electrolytic deposition of copper), the composition comprising (i) copper (II) ions, (ii) one or more than one compound of Formula (Ia) (iii) one, two, three or more than three further compounds, which are different from the compound of Formula (Ia), with the definitions given below, the use of the acidic aqueous composition according to the invention for electrolytic copper plating, the use of the compound of Formula (Ia) in an acidic aqueous composition for electrolytic metal plating, a method of electrolytic copper plating using the acidic aqueous composition according to the invention, and specific compounds derived from Formula (Ia) for an acidic aqueous composition for electrolytic metal plating.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: June 15, 2021
    Assignee: Atotech Deutschland GmbH
    Inventors: Kun Si, Ralf Schmidt, Onas Bolton, Josef Gaida, Frank Von Horsten, Dirk Rohde, Himendra Jha, Jens Palm, Olivier Mann, Angela Llavona-Serrano
  • ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTIC COPPER PLATING
    Publication number: 20190203369
    Abstract: The present invention relates to an acidic aqueous composition (plating bath) for electrolytic copper plating (electrolytic deposition of copper), the composition comprising (i) copper (II) ions, (ii) one or more than one compound of Formula (Ia) (iii) one, two, three or more than three further compounds, which are different from the compound of Formula (Ia), with the definitions given below, the use of the acidic aqueous composition according to the invention for electrolytic copper plating, the use of the compound of Formula (Ia) in an acidic aqueous composition for electrolytic metal plating, a method of electrolytic copper plating using the acidic aqueous composition according to the invention, and specific compounds derived from Formula (Ia) for an acidic aqueous composition for electrolytic metal plating.
    Type: Application
    Filed: August 10, 2017
    Publication date: July 4, 2019
    Inventors: Kun SI, Ralf SCHMIDT, Onas BOLTON, Josef GAIDA, Frank VON HORSTEN, Dirk ROHDE, Himendra JHA, Jens PALM, Olivier MANN, Angela LLAVONA-SERRANO