Abstract: A high lead solder exhibiting improved wettability to metal substrates, an advantageously controlled melting range, and excellent thermal fatigue properties. It comprises about 98-100% lead and a minor amount, typically about 0.0005-0.1 wt %, based on the total weight of the solder composition, of an alkali metal selected from the group consisting of Na, K, and Li. Additional embodiments additionally comprise an amount of a grain-size controlling additive, e.g., 0.001-0.5 wt % (based on the total weight of all the components in the solder composition) selected from the group consisting of Ce, Ba, La, Pr, Nd, Sm, Eu, Gd, Th, Dy, Ho, Er, Tm, Yb, Y, Lu, Sc, Mg, Na, Se, Te, oxides thereof and mixtures thereof, in amount effective to control the Pb grain size; and 0-1 wt % of an element selected from the group consisting of Sn, In, Bi, Sb, Ag, Au, and Ga, and mixtures thereof.

Abstract: Aluminum based alloy primarily for use in aircraft and aerospace components consists essentially of the composition: 2.60 to 3.30 weight percent copper, 0.0 to 0.50 weight percent manganese, 1.30 to 1.65 weight percent lithium, 0.0 to 1.8 percent magnesium, and from 0.0 to 1.5 weight percent of grain refinement elements selected from the group consisting of zirconium, and chromium. Up to about 0.5 wt. % zinc and up to about 1.5 wt. % titanium may also be present. Minor impurities may also be present. These alloys exhibit an improved combination of characteristics including low density, high strength, high corrosion resistance and good fracture toughness.

Abstract: Novel Al-Li-Zr alloys of the formula Al.sub.bal Li.sub.b Zr.sub.c wherein "b" is about 1.9 through about 4.5 weight percent and "c" is about 0.70 through about 4.0 weight percent are disclosed. These alloys can be formed by mixing Al alloy, Li alloy and Zr alloy, heating to high temperatures and rapidly cooling, followed by heat treatment.