Abstract: A process is disclosed for use in the manufacture of layered printed circuit board assembly having first and second layers with electrically conductive patterns thereon. The assembly has at least one inner layer between the first and second layers for receiving and retaining a surface-mount device inserted through aligned holes in the layers. The device has an electrically conductive cap at each end for electrical connection to the conductive patterns. The inner layer physically retains the surface-mount device in place pending the electrical connection of the end caps to the conductive patterns, and by virtue of its being inherently compliant and yielding, provides for physically retaining the surface-mount device in place pending the electrical and mechanical connection of the electrically conductive end caps to the conductive patterns.

Abstract: An electrical device is disclosed which is small in size and easily assembled. The device employs a rotatable housing and a grooved geometrically programmed disc to locate a ball contact at a desired position on a substrate. The substrate may comprise a resistor, spaced contacts or other conductive surface, and the movable ball contact may change circuit conditions incrementally when compared with the degree of movement of the drive for the ball. The ball has two points of contact with the grooved disc reducing noise and wear. The grooved disc is readily replaceable for changing the operating characteristics of the device.