Patents by Inventor Frank W. Kulesza

Frank W. Kulesza has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming electrically conductive polymer interconnects on electrical substrates
    Patent number: 6138348
    Abstract: A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a first set of bond pads of the substrate. At least one electrically conductive polymer bump is then formed on each of a second set of the bond pads of the substrate. The circuit is formed by selectively forming an organic protective layer around the bond pads of a second substrate by laser ablation of an organic protective coating on the second substrate. The electrically conductive polymer bumps on the first and second portions of the bond pads of the first substrate are then contacted with the bond pads of the second substrate, thereby forming the electrical circuit.
    Type: Grant
    Filed: March 8, 1999
    Date of Patent: October 31, 2000
    Assignee: Polymer Flip Chip Corporation
    Inventors: Frank W. Kulesza, Richard H. Estes
  • Method of forming electrically conductive polymer interconnects on electrical substrates
    Patent number: 5918364
    Abstract: A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a first set of bond pads of the substrate. At least one electrically conductive polymer bump is then formed on each of a second set of the bond pads of the substrate. The circuit is formed by selectively forming an organic protective layer around the bond pads of a second substrate by laser ablation of an organic protective coating polymer bumps on the first and second portions of the bond pads of the first substrate are then contacted with the bond pads of the second substrate, thereby forming the electrical circuit.
    Type: Grant
    Filed: March 14, 1997
    Date of Patent: July 6, 1999
    Assignee: Polymer Flip Chip Corporation
    Inventors: Frank W. Kulesza, Richard H. Estes
  • Method for forming electrically conductive polymer interconnects on electrical substrates
    Patent number: 5879761
    Abstract: A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a first set of bond pads of the substrate. At least one electrically conductive polymer bump is then formed on each of a second set of the bond pads of the substrate. The circuit is formed by selectively forming an organic protective layer around the bond pads of a second substrate by laser ablation of an organic protective coating on the second substrate. The electrically conductive polymer bumps on the first and second portions of the bond pads of the first substrate are then contacted with the bond pads of the second substrate, thereby forming the electrical circuit.
    Type: Grant
    Filed: July 18, 1995
    Date of Patent: March 9, 1999
    Assignee: Polymer Flip Chip Corporation
    Inventors: Frank W. Kulesza, Richard H. Estes
  • Method of forming electrically conductive polymer interconnects on electrical substrates
    Patent number: 5611140
    Abstract: A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a first set of bond pads of the substrate. At least one electrically conductive polymer bump is then formed on each of a second set of the bond pads of the substrate. The circuit is formed by selectively forming an organic protective layer around the bond pads of a second substrate by laser ablation of an organic protective coating polymer bumps on the first and second portions of the bond pads of the first substrate are then contacted with the bond pads of the second substrate, thereby forming the electrical circuit.
    Type: Grant
    Filed: February 10, 1995
    Date of Patent: March 18, 1997
    Assignee: Epoxy Technology, Inc.
    Inventors: Frank W. Kulesza, Richard H. Estes
  • Flip chip technology using electrically conductive polymers and dielectrics
    Patent number: 5237130
    Abstract: A method is presented for interconnecting bond pads of a flip chip with bond pads of a substrate by an electrically conductive polymer. An organic protective layer is selectively formed over a surface of a flip chip to thereby leave exposed bond pads on the flip chip. Monomer is formed on the bond pads extending to a level beyond the organic protective layer to form bumps. The bumps are aligned with bond pads of a substrate and then contacted to those bond pads. The bumps can be polymerized either before or after contacting the bumps to the bond pads of the substrate to form electrically conductive interconnections between the bond pads of the flip chip and the bond pads of the substrate.
    Type: Grant
    Filed: December 19, 1991
    Date of Patent: August 17, 1993
    Assignee: Epoxy Technology, Inc.
    Inventors: Frank W. Kulesza, Richard H. Estes
  • Flip chip bonding method using electrically conductive polymer bumps
    Patent number: 5196371
    Abstract: A method is presented for interconnecting bond pads of a flip chip with bond pads of a substrate by an electrically conductive polymer. A first organic protective layer is selectively formed over a surface of a flip chip to thereby leave exposed bond pads on the flip chip. An electrically conductive polymerizable precursor is disposed on the bond pads extending to a level beyond the organic protective layer. The first and second layers are polymerized to form electrically conductive bumps. A second organic protective layer is then formed on the surface of the substrate around the substrate bond pads, leaving the substrate bond pads exposed. An electrically conductive adhesive is then disposed on the substrate bond pads. The bumps are aligned with bond pads of a substrate and then contacted to those bond pads. The adhesive is polymerized to form electrical interconnections between the flip chip bond pads and the substrate bond pads.
    Type: Grant
    Filed: August 16, 1991
    Date of Patent: March 23, 1993
    Assignee: Epoxy Technology, Inc.
    Inventors: Frank W. Kulesza, Richard H. Estes
  • Flip chip technology using electrically conductive polymers and dielectrics
    Patent number: 5074947
    Abstract: A method is presented for interconnecting bond pads of a flip chip with bond pads of a substrate by an electrically conductive polymer. An organic protective layer is selectively formed over a surface of a flip chip to thereby leave exposed bond pads on the flip chip. Electrically conductive polymerizable precursor is formed on the bond pads extending to a level beyond the organic protective layer to form bumps. The bumps are aligned with bond pads of a substrate and then contacted to those bond pads. The bumps can be polymerized either before or after contacting the bumps to the bond pads of the substrate to form electrically conductive interconnections between the bond pads of the flip chip and the bond pads of the substrate.
    Type: Grant
    Filed: December 18, 1989
    Date of Patent: December 24, 1991
    Assignee: Epoxy Technology, Inc.
    Inventors: Richard H. Estes, Frank W. Kulesza