Abstract: A self-energized programmable timer valve is provided in embodiments of this invention that can be used in watering and other systems, such as lawn watering systems and agricultural watering systems. The invention provides one or more components that serve the functions of a clock, a valve and an energizer (e.g., turbine) (i.e., a clock function, a valve function, and an energizing and/or turbine function) to control the flow of media (e.g., water) through the valve.

Abstract: A self-energized programmable timer valve is provided in embodiments of this invention that can be used in watering and other systems, such as lawn watering systems and agricultural watering systems. The invention provides one or more components that serve the functions of a clock, a valve and an energizer (e.g., turbine) (i.e., a clock function, a valve function, and an energizing and/or turbine function) to control the flow of media (e.g., water) through the valve.

Abstract: The present random access PCR reactor for biological analysis, comprises of a number of PCR reactors held on a platform, and one optical system to be shared by all of the PCR reactors on the platform. The optical system is held on a traverse mechanism to move it over any one of the PCR reactors that are ready to be imaged. Other PCR reactors on the platform can be accesses and replaced. The optical system has a lightpipe and a lightguide that distributes a uniform light over all the samples held on the reactor. The lightguide of the present optical system has a set of light reflecting structures that are strategically located to uniformly reflect an incoming light towards all the samples held in the PCR reactor that is being tested.

Abstract: A device chip manufacturing method includes attaching a wafer to the first surface of a semiconductor ingot, separating the semiconductor ingot into a subject part and a remaining part after attachment, the subject part being attached to the wafer to form a laminated wafer having a front side as an exposed surface of the subject part and a back side as an exposed surface of the wafer, setting a plurality of crossing division lines on the front side of the laminated wafer to thereby define a plurality of separate regions after separation, and next forming a plurality of devices in the respective separate regions, and then dividing the laminated wafer along the division lines after forming the devices, thereby forming the plural device chips including the respective devices.

Abstract: A configurable storage and display frame includes a plurality of frame panels and a plurality of connecting joints. Each of the connecting joints include a base having a plurality of receiving slots and a securing member. The securing member includes a plurality of securing arms and a plurality of securing slots formed on the securing arms respectively. Connecting members of two of the frame panels are arranged to be securely received in the securing slots respectively, wherein the securing member is arranged to detachably attach on the base in such a manner that the securing arms are received in the receiving slots respectively so as to securely restrict a lateral movement between the securing member and the base for providing a joint of the connecting members of two of the corresponding frame panels.

Abstract: A configurable storage and display frame includes a plurality of frame panels and a plurality of connecting joints. Each of the connecting joints include a base having a plurality of receiving slots and a securing member. The securing member includes a plurality of securing arms and a plurality of securing slots formed on the securing arms respectively. Connecting members of two of the frame panels are arranged to be securely received in the securing slots respectively, wherein the securing member is arranged to detachably attach on the base in such a manner that the securing arms are received in the receiving slots respectively so as to securely restrict a lateral movement between the securing member and the base for providing a joint of the connecting members of two of the corresponding frame panels.

Abstract: A self-energized programmable timer valve is provided in embodiments of this invention that can be used in watering and other systems, such as lawn watering systems and agricultural watering systems. The invention provides one or more components that serve the functions of a clock, a valve and an energizer (e.g., turbine) (i.e., a clock function, a valve function, and an energizing and/or turbine function) to control the flow of media (e.g., water) through the valve.

Abstract: A method for manufacturing a wiring board that has a rewiring layer on a surface thereof includes forming an insulating layer on a core substrate, forming a groove, in which a wiring layer of a circuit pattern is to be provided, on the insulating layer, forming a metal seed layer on an exposed face of the insulating layer on which the groove is formed, electrodepositing metal, which is to form the wiring layer, by plating to fill the groove with the metal to form a metal layer on the seed layer, machining the metal layer by a cutting tool to remove the metal layer up to a position not reaching the top of the insulating layer, and performing etching or a CMP process to expose the top of the insulating layer thereby to form the wiring layer in the groove and flatten an exposed face of the wiring layer.

Abstract: A device chip manufacturing method includes an attaching a wafer to the first surface of a semiconductor ingot, separating the semiconductor ingot into a subject part and a remaining part after attachment, the subject part being attached to the wafer to form a laminated wafer having a front side as an exposed surface of the subject part and a back side as an exposed surface of the wafer, setting a plurality of crossing division lines on the front side of the laminated wafer to thereby define a plurality of separate regions after separation, and next forming a plurality of devices in the respective separate regions, and then dividing the laminated wafer along the division lines after forming the devices, thereby forming the plural device chips including the respective devices.

Abstract: A semiconductor wafer processing method includes a step of forming a laser processed groove on the front side of a semiconductor wafer along each division line, a step of forming a mask layer on a protective layer except in an area above a metal electrode formed in each device on the front side of the wafer, a first etching step of etching the protective layer by using the mask layer to expose each metal electrode, a second etching step of etching the inner surface of each laser processed groove by using the mask layer used in the first etching step, thereby expanding each laser processed groove, and a dividing step of dividing the wafer along each laser processed groove expanded in the second etching step.

Abstract: A semiconductor wafer processing method includes a step of forming a laser processed groove on the front side of a semiconductor wafer along each division line, a step of forming a mask layer on a protective layer except in an area above a metal electrode formed in each device on the front side of the wafer, a first etching step of etching the protective layer by using the mask layer to expose each metal electrode, a second etching step of etching the inner surface of each laser processed groove by using the mask layer used in the first etching step, thereby expanding each laser processed groove, and a dividing step of dividing the wafer along each laser processed groove expanded in the second etching step.

Abstract: A multiplex filter has at least n filter chambers which are surrounded by a housing and/or at least one insert positioned in the housing. A metal dividing device is constructed in each of the n filter chambers, dividing each filter chamber into m resonator chambers, wherein m?2. The resonator chambers are coupled perpendicular to the H fields and/or parallel to the central axis or with a component essentially perpendicular to the H fields and/or parallel to the central axis. A common connection is guided into the first filter chamber via a first opening in the housing, and is coupled in the same to the m resonators of the m resonator chambers. As a result of the fact that the coupling is established perpendicular to the H field, the resonator can have a very compact construction.

Abstract: A high-frequency filter consists of a housing, which includes resonators, each of which has at least one dielectric. The n resonators are arranged along a central axis. The n resonators are isolated from one another by at least n?1 isolation devices. The n?1 isolation devices have coupling openings, through which a coupling is established at a right angle to or with one component predominantly at a right angle to the H field. A first signal line terminal is inserted into the first resonator chamber through a first opening in the housing and is in contact with the respective dielectric there. In addition or alternatively, a second signal line terminal is inserted into the nth resonator chamber through a second opening in the housing and is in contact with the respective dielectric there.

Abstract: A processing system includes a processing apparatus having functional units including a holding unit that holds a workpiece by a holding surface, a processing unit that processes the workpiece held by the holding unit, and a feed unit that moves the holding unit and the processing unit relatively. The processing system further includes a detecting unit that is provided for part or all of the functional units and detects any of vibration, current, voltage, load, speed, torque, pressure, temperature, flow rate, change in a taken image, and the thickness of the workpiece, and a data accumulating unit that accumulates information included in a signal output from the detecting unit as data.

Abstract: Disclosed herein is a workpiece processing method including a mask preparing step of preparing a mask that covers devices on a front surface of a workpiece and exposes streets, a plasma etching step of repeating an operation of supplying plasmatized SF6 through the mask to the workpiece accompanied by a holding member disposed on a back surface thereof, to form grooves, then supplying plasmatized C4F8 to the workpiece through the mask to deposit a coating on the workpiece, and thereafter supplying plasmatized SF6 to the workpiece through the mask to remove the coating present at bottoms of the grooves, thereby etching the groove bottoms, and a foreign matter removing step of cleaning the workpiece with a cleaning liquid, after the plasma etching step is conducted, to remove the coating produced in the plasma etching step.

Abstract: The present disclosure provides systems and methods for an active implantable medical device (AIMD). The AIMD includes a processor, a first magnetic field sensor communicatively coupled to the processor and configured to detect magnetic fields generated by a handheld magnet, and at least one second magnetic field sensor communicatively coupled to the processor and configured to detect magnetic fields generated by a magnetic resonance imaging (MRI) scanner. The processor is configured to sample the first magnetic field sensor and the at least one second magnetic field sensor to detect the presence of the MRI scanner, and automatically initiate an MRI mode for the AIMD based on the detection.

Abstract: A method for manufacturing a wiring board that has a rewiring layer on a surface thereof includes forming an insulating layer on a core substrate, forming a groove, in which a wiring layer of a circuit pattern is to be provided, on the insulating layer, forming a metal seed layer on an exposed face of the insulating layer on which the groove is formed, electrodepositing metal, which is to form the wiring layer, by plating to fill the groove with the metal to form a metal layer on the seed layer, machining the metal layer by a cutting tool to remove the metal layer up to a position not reaching the top of the insulating layer, and performing etching or a CMP process to expose the top of the insulating layer thereby to form the wiring layer in the groove and flatten an exposed face of the wiring layer.

Abstract: LED dies are partially singulated while on an unthinned depth growth substrate. Slots are made through the streets separating the LED dies, but not through the growth substrate, leaving the now separated LED dies on the growth substrate. A secondary support is attached to the LED dies on the opposite surface from the growth substrate, and the growth substrate is thinned or removed, leaving the LED dies on the secondary support. Because the LED dies are separated while on the unthinned growth substrate, the likelihood of distortion before slicing is virtually eliminated, and the width of the streets between the LED dies may be correspondingly reduced.

Abstract: A method for processing a workpiece including: a supporting plate preparing step of preparing a supporting plate having, on a top surface side of the supporting plate, a recessed portion configured to house a projecting portion provided in a device region of the workpiece; a positioning step of mounting the workpiece on the supporting plate such that the recessed portion of the supporting plate and the device region of the workpiece correspond to each other; a bonding step of forming a welded region in which the workpiece is welded to the supporting plate by irradiating a peripheral surplus region of the workpiece mounted on the supporting plate with a laser beam, whereby the workpiece is fixed on the supporting plate; and a processing step of processing the workpiece after performing the bonding step.

Abstract: There is provided a processing system including a processing apparatus having functional units including a holding unit that holds a workpiece by a holding surface, a processing unit that processes the workpiece held by the holding unit, and a feed unit that moves the holding unit and the processing unit relatively. The processing system further includes a detecting unit that is provided for part or all of the functional units and detects any of vibration, current, voltage, load, speed, torque, pressure, temperature, flow rate, change in a taken image, and the thickness of the workpiece, and a data accumulating unit that accumulates information included in a signal output from the detecting unit as data.