Patents by Inventor Frank Wetzl

Frank Wetzl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LAYERED COMPOSITE OF A SUBSTRATE FILM AND OF A LAYER ASSEMBLY COMPRISING A SINTERABLE LAYER MADE OF AT LEAST ONE METAL POWDER AND A SOLDER LAYER
    Publication number: 20140234649
    Abstract: The invention relates to a layered composite (10), in particular for connecting electronic components as joining partners, comprising at least one substrate film (11) and a layer assembly (12) applied to the substrate film. The layer assembly comprises at least one sinterable layer (13), which is applied to the substrate film (11) and which contains at least one metal powder, and a solder layer (14) applied to the sinterable layer (13). The invention further relates to a method for forming a layered composite, to a circuit assembly containing a layered composite (10) according to the invention, and to the use of a layered composite (10) in a joining method for electronic components.
    Type: Application
    Filed: September 21, 2012
    Publication date: August 21, 2014
    Inventors: Thomas Kalich, Frank Wetzl, Bernd Hohenberger, Rainer Holz, Christiane Frueh, Andreas Fix, Michael Guyenot, Andrea Feiock, Martin Rittner, Michael Guenther