Abstract: Method for correcting a height value, measured using a height sensor, of a spring-damper unit of a motor vehicle, wherein the measured height value is corrected by a correction value that is dependent on an acceleration value if the motor vehicle is accelerated in a longitudinal and/or lateral direction, the correction value being adjusted while the motor vehicle is moving.

Abstract: The disclosure relates to a method for training a classifier to determine a handheld machine tool device state, comprising the following steps:—providing a handheld machine tool; —providing at least one sensor; —operating the handheld machine tool continuously; —terminating the continuous operation, in particular in the event of damage occurring; —capturing sensor data during the continuous operation; —extracting features on the basis of the sensor data; —ascertaining at least two handheld machine tool device states on the basis of the extracted features.

Abstract: A semiconductor die includes: a SiC substrate; power and current sense transistors integrated in the substrate such that the current sense transistor mirrors current flow in the main power transistor; a gate terminal electrically connected to gate electrodes of both transistors; a drain terminal electrically connected to a drain region in the substrate and which is common to both transistors; a source terminal electrically connected to source regions of the power transistor; a dual mode sense terminal; and a doped resistor region in the substrate between the transistors. The dual mode sense terminal is electrically connected to source regions of the current sense transistor. The doped resistor region has an opposite conductivity type as the source regions of both transistors and is configured as a temperature sense resistor that electrically connects the source terminal to the dual mode sense terminal.

Abstract: A method of calculation a vehicle load comprising calculating a first vehicle load value based at least on air pressures in air springs and height data of suspension of a vehicle axle, determining a second vehicle load value based on a change of track width of the vehicle axle, and calculating the vehicle load based on the first vehicle load value and the second vehicle load value.

Abstract: A method for changing a ride height position of a motor vehicle comprises measuring a respective relative distance of a vehicle superstructure from corresponding wheels, with spring travel sensors and transmitting a respective spring travel signal to an electronic open-loop and closed-loop control device of the motor vehicle. The spring travel signals pass through a frequency filtering in the electronic open-loop and closed-loop control device The frequency filtering initially comprising a bandpass filtering which splits the spring travel signal into a signal component excited by the wheel and a signal component excited by the vehicle superstructure. The signal component excited by the vehicle superstructure is filtered out, the frequency filtering then comprising an absolute value conversion of the bandpass-filtered spring travel signal and subsequently a low-pass filtering.

Abstract: A semiconductor die includes: a SiC substrate; power and current sense transistors integrated in the substrate such that the current sense transistor mirrors current flow in the main power transistor; a gate terminal electrically connected to gate electrodes of both transistors; a drain terminal electrically connected to a drain region in the substrate and which is common to both transistors; a source terminal electrically connected to source and body regions of the power transistor; a dual mode sense terminal; and a doped resistor region in the substrate between the transistors. The dual mode sense terminal is electrically connected to source and body regions of the current sense transistor. The doped resistor region has a same conductivity type as the body regions of both transistors and is configured as a temperature sense resistor that electrically connects the source terminal to the dual mode sense terminal.

Abstract: Described herein is a power semiconductor device and corresponding method of production. The semiconductor device includes: a power device region formed in a semiconductor substrate and including first trenches and second trenches extending lengthwise in parallel with one another with semiconductor mesas between adjacent ones of the trenches, each first trench including a gate electrode at a first potential and each second trench including a field plate at a second potential; and a current sense region formed in the semiconductor substrate. A subset of the first trenches, a subset of the second trenches and a subset of the semiconductor mesas are common to both the current sense region and the power device region. The second trenches are interrupted along opposite first and second sides of the current sense region such that the field plates are interrupted between the power device region and the current sense region.

Abstract: A semiconductor die includes: a SiC substrate; power and current sense transistors integrated in the substrate such that the current sense transistor mirrors current flow in the main power transistor; a gate terminal electrically connected to gate electrodes of both transistors; a drain terminal electrically connected to a drain region in the substrate and which is common to both transistors; a source terminal electrically connected to source and body regions of the power transistor; a dual mode sense terminal; and a doped resistor region in the substrate between the transistors. The dual mode sense terminal is electrically connected to source and body regions of the current sense transistor. The doped resistor region has a same conductivity type as the body regions of both transistors and is configured as a temperature sense resistor that electrically connects the source terminal to the dual mode sense terminal.

Abstract: In an example, a transistor device is provided. The transistor device includes a plurality of transistor cells each including a gate electrode and each at least partially integrated in a semiconductor body that includes a wide bandgap semiconductor material. The transistor device includes a gate pad arranged on top of the semiconductor body, and a plurality of gate runners each arranged on top of the semiconductor body and each connected to gate electrodes of at least some of the plurality of transistor cells. Each gate runner of the plurality of gate runners has a longitudinal direction, and at least one of the gate runners includes at least a section in which a resistivity per area increases in the longitudinal direction as a distance to the gate pad along the gate runner increases.

Abstract: A method of calculation a vehicle load comprising a first vehicle load value based at least on air pressures in air springs and height data of suspension of a vehicle axle, determining a second vehicle load value based on a change of track width of the vehicle axle, and calculating the vehicle load based on the first vehicle load value and the second vehicle load value.

Abstract: An integrated circuit comprises a power switch comprising a current path and a current sense node; and a temperature sense circuit internally coupled between the current path and the current sense node.

Abstract: Described herein is a power semiconductor device and corresponding method of production. The semiconductor device includes: a power device region formed in a semiconductor substrate and including first trenches and second trenches extending lengthwise in parallel with one another with semiconductor mesas between adjacent ones of the trenches, each first trench including a gate electrode at a first potential and each second trench including a field plate at a second potential; and a current sense region formed in the semiconductor substrate. A subset of the first trenches, a subset of the second trenches and a subset of the semiconductor mesas are common to both the current sense region and the power device region. The second trenches are interrupted along opposite first and second sides of the current sense region such that the field plates are interrupted between the power device region and the current sense region.

Abstract: A semiconductor device is described in which a conductive channel is present along an active gate trench of the device when a gate potential is at an on-voltage, whereas no conductive channel is present along an inactive trench of the device for the same gate potential condition.

Abstract: In an example, a transistor device is provided. The transistor device includes a plurality of transistor cells each including a gate electrode and each at least partially integrated in a semiconductor body that includes a wide bandgap semiconductor material. The transistor device includes a gate pad arranged on top of the semiconductor body, and a plurality of gate runners each arranged on top of the semiconductor body and each connected to gate electrodes of at least some of the plurality of transistor cells. Each gate runner of the plurality of gate runners has a longitudinal direction, and at least one of the gate runners includes at least a section in which a resistivity per area increases in the longitudinal direction as a distance to the gate pad along the gate runner increases.

Abstract: A semiconductor device is described in which a conductive channel is present along an active gate trench of the device when a gate potential is at an on-voltage, whereas no conductive channel is present along an inactive trench of the device for the same gate potential condition.

Abstract: A semiconductor die includes a single power transistor or power diode, a temperature sense diode formed close enough to the single power transistor or power diode to measure an accurate temperature. The temperature sense diode comprises first and second diodes or strings of diodes. A separate integrated circuit is operable to measure first and second voltage drops of both the first and second diodes or strings of diodes using same magnitude currents, and estimate the temperature of the single power transistor or power diode based on the difference between the first and second forward voltage drop measurements. An overall pn junction area of the first diode or string of first diodes is different from an overall pn junction area of the second diode or string of second diodes.

Abstract: A semiconductor device is described in which a conductive channel is present along an active gate trench of the device when a gate potential is at an on-voltage, whereas no conductive channel is present along an inactive gate trench of the device for the same gate potential condition.

Abstract: A transistor device includes a semiconductor mesa region between first and second trenches in a semiconductor body, a body region of a first conductivity type and a source region of a second conductivity type in the semiconductor mesa region, a drift region of the second conductivity type in the semiconductor body, and a gate electrode adjacent the body region in the first trench, and dielectrically insulated from the body region by a gate dielectric. The body region separates the source region from the drift region and extends to the surface of the semiconductor mesa region adjacent the source region. The body region comprises a surface region which adjoins the surface of the semiconductor mesa region and the first trench. The surface region has a higher doping concentration than a section of the body region that separates the source region from the drift region.

Abstract: A power semiconductor device includes a semiconductor body coupled to first and second load terminals and including a drift region with dopants of a first conductivity type. An active region has at least one power cell extending at least partially into the semiconductor body, is electrically connected with the first load terminal and includes a part of the drift region. Each power cell includes a section of the drift region and is configured to conduct a load current between the terminals and to block a blocking voltage applied between the terminals. A chip edge laterally terminates the semiconductor body. A non-active termination structure arranged in between the chip edge and active region includes an ohmic layer. The ohmic layer is arranged above a surface of the semiconductor body, forms an ohmic connection between electrical potentials of the first and second load terminals, and is laterally structured along the ohmic connection.