Abstract: A gas blending and compressing system includes a blender having a blending chamber configured to blend two or more separate gases into a blended gas, a compressor configured to compress the blended gas to a selected pressure, and a control system configured to sense operational parameters of the blender and the compressor, to sense one or more properties of the blended gas and to control the operation of the blender and the compressor to maintain the quality of the blended gas. A method for blending and compressing two or more gases includes the steps of: blending the separate gases into a blended gas using the blender; compressing the blended gas using the compressor; and matching a constant flow through the compressor to a selected minimum flow dependent on nominal operating parameters of the compressor. Alternate embodiment systems and methods blend separate gases at high pressure without using a compressor.

Abstract: Splitting circuitry receives external telecommunications lines and splits them into corresponding primary and secondary lines for implementing an N:l sparing arrangement in an associated telecommunications system. Sparing circuitry receives the secondary lines and includes selection circuitry and a sparing bus, where the selection circuitry selectively connects a desired group of secondary lines to the sparing bus in response to a selection control signal. Preferably, the telecommunications system routes communications traffic between subscriber equipment connected via the external telecommunications lines and a larger communications network using N primary line interfaces coupled with the primary lines. When desired, the telecommunications system controls the sparing circuitry such that secondary lines corresponding to a group of primary lines associated with a given primary line interface connect to the spare line interface.

Abstract: A pin connection arrangement spanning a series of slots on a backplane 1 printed circuit board. The arrangement allows replaceable printed circuit board assemblies to be paired or mated while further allowing the printed circuit board assemblies to vary incrementally in width. The printed circuit board assemblies can be one slot wide 10a, 10b, two slots wide, 12a, 12b, three slots wide, 14a, 14b, on up to ‘n’ slots wide while being paired to a mate for sparing purposes. Backplane 1 provides a direct connection between paired printed circuit boards. The arrangement(s) allow expansion of printed circuit board area and volume while supporting paired applications that require only a single slot for a backplane connection per printed circuit board. Backplane 1 can be used for different width printed circuit board assemblies.