Abstract: Methods and apparatus are provided for the chemical mechanical planarization (CMP) of a surface of a work piece. In accordance with one embodiment of the invention the apparatus comprises a plurality of CMP systems, a plurality of load cups for loading unprocessed work pieces into and unloading processed work pieces from the plurality of CMP systems, a plurality of cleaning stations for cleaning processed work pieces unloaded from the CMP systems, and a single robot configured to transfer unprocessed work pieces to the plurality of load cups and to transfer processed work pieces from the load cups to the plurality of cleaning stations.

Abstract: Wafer polishing systems include a series of polish modules alongside a neighboring series of secondary modules. A conveyor travels along the series of polish modules and the series of secondary modules. When a polishing operation is completed, the wafers are transferred to a series of near-by storage modules. The polish modules include a pair of traveling wafer gantries, each of which delivers a wafer to a polishing surface, applying the necessary force to complete polishing of the wafer surface.