Patents by Inventor Franklin G. Monzon

Franklin G. Monzon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7817882
    Abstract: An optical apparatus comprises: a semiconductor substrate; a semiconductor optical device integrally formed on the substrate and having an off-normal device end face; and a low-index planar optical waveguide integrally formed on the semiconductor substrate at the device end face. The device and waveguide are non-collinear, and the waveguide is end-coupled at its proximal end to the optical device by refraction at the device end face. The apparatus further includes a reflective coating between the waveguide and substrate, an etched end face curved in the horizontal dimension, or an etched end face with a lower portion that protrudes beneath a proximal portion of the waveguide.
    Type: Grant
    Filed: August 15, 2009
    Date of Patent: October 19, 2010
    Assignee: HOYA Corporation USA
    Inventors: Henry A. Blauvlet, David W. Vernooy, Joel S. Paslaski, Charles I. Grosjean, Hao Lee, Franklin G. Monzon, Katrina H. Nguyen
  • Publication number: 20090304326
    Abstract: An optical apparatus comprises: a semiconductor substrate; a semiconductor optical device integrally formed on the substrate and having an off-normal device end face; and a low-index planar optical waveguide integrally formed on the semiconductor substrate at the device end face. The device and waveguide are non-collinear, and the waveguide is end-coupled at its proximal end to the optical device by refraction at the device end face. The apparatus further includes a reflective coating between the waveguide and substrate, an etched end face curved in the horizontal dimension, or an etched end face with a lower portion that protrudes beneath a proximal portion of the waveguide.
    Type: Application
    Filed: August 15, 2009
    Publication date: December 10, 2009
    Applicant: HOYA Corporation USA
    Inventors: Henry A. Blauvelt, David W. Vemooy, Joel S. Paslaski, Charles I. Grosjean, Hao Lee, Franklin G. Monzon, Katrina H. Nguyen
  • Patent number: 7599585
    Abstract: An optical apparatus comprises: a semiconductor substrate; a semiconductor optical device integrally formed on the substrate and having a device end face; and a low-index planar optical waveguide integrally formed on the semiconductor substrate at the device end face. The waveguide is end-coupled at its proximal end to the optical device through the device end face and is arranged so as to comprise a waveguide mode converter. The waveguide is arranged at its distal end to transmit or receive an optical signal through its distal end to or from another low-index optical waveguide end-coupled with the integrally-formed waveguide and assembled with the integrally-formed waveguide, optical device, or substrate. The optical apparatus can further comprise a discrete low-index optical waveguide assembled with the integrally-formed waveguide, optical device, or substrate so as to be end-coupled with the integrally-formed waveguide at its distal end.
    Type: Grant
    Filed: June 19, 2007
    Date of Patent: October 6, 2009
    Assignee: HOYA Corporation USA
    Inventors: Henry A. Blauvelt, David W. Vernooy, Joel S. Paslaski, Charles I. Grosjean, Hao Lee, Franklin G. Monzon, Katrina H. Nguyen
  • Patent number: 7233713
    Abstract: An optical apparatus comprises a semiconductor optical device waveguide formed on a semiconductor substrate, and an integrated end-coupled waveguide formed on the semiconductor substrate. The integrated waveguide may comprise materials differing from those of the device waveguide and the substrate. Spatially selective material processing may be employed for first forming the optical device waveguide on the substrate, and for subsequently depositing and forming the integrated end-coupled waveguide on the substrate. Spatially selective material processing enables accurate spatial mode matching and transverse alignment of the waveguides, and multiple device waveguides and corresponding integrated end-coupled waveguides may be fabricated concurrently on a common substrate on a wafer scale.
    Type: Grant
    Filed: January 9, 2006
    Date of Patent: June 19, 2007
    Assignee: Xponent Photonics Inc.
    Inventors: Henry A. Blauvelt, David W. Vernooy, Joel S. Paslaski, Charles I. Grosjean, Hao Lee, Franklin G. Monzon, Katrina H. Nguyen
  • Patent number: 6985646
    Abstract: An optical apparatus comprises a semiconductor optical device waveguide formed on a semiconductor substrate, and an integrated end-coupled waveguide formed on the semiconductor substrate. The integrated waveguide may comprise materials differing from those of the device waveguide and the substrate. Spatially selective material processing may be employed for first forming the optical device waveguide on the substrate, and for subsequently depositing and forming the integrated end-coupled waveguide on the substrate. Spatially selective material processing enables accurate spatial mode matching and transverse alignment of the waveguides, and multiple device waveguides and corresponding integrated end-coupled waveguides may be fabricated concurrently on a common substrate on a wafer scale.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: January 10, 2006
    Assignee: Xponent Photonics Inc
    Inventors: Henry A. Blauvelt, David W. Vernooy, Joel S. Paslaski, Charles I. Grosjean, Hao Lee, Franklin G. Monzon, Katrina H. Nguyen
  • Patent number: 6877318
    Abstract: An electrical energy-generating heat sink system is described herein that provides a convenient and economical method for continuously recharging an energy storage device in electronic devices.
    Type: Grant
    Filed: June 9, 2003
    Date of Patent: April 12, 2005
    Assignee: Intel Corporation
    Inventors: Pooya Tadayon, Franklin G. Monzon, Prateek Dujari
  • Publication number: 20040165812
    Abstract: An optical apparatus comprises a semiconductor optical device waveguide formed on a semiconductor substrate, and an integrated end-coupled waveguide formed on the semiconductor substrate. The integrated waveguide may comprise materials differing from those of the device waveguide and the substrate. Spatially selective material processing may be employed for first forming the optical device waveguide on the substrate, and for subsequently depositing and forming the integrated end-coupled waveguide on the substrate. Spatially selective material processing enables accurate spatial mode matching and transverse alignment of the waveguides, and multiple device waveguides and corresponding integrated end-coupled waveguides may be fabricated concurrently on a common substrate on a wafer scale.
    Type: Application
    Filed: January 16, 2004
    Publication date: August 26, 2004
    Inventors: Henry A. Blauvelt, David W. Vernooy, Joel S. Paslaski, Charles I. Grosjean, Hao Lee, Franklin G. Monzon, Katrina H. Nguyen
  • Publication number: 20030192314
    Abstract: An electrical energy-generating heat sink system is described herein that provides a convenient and economical method for continuously recharging an energy storage device in electronic devices.
    Type: Application
    Filed: June 9, 2003
    Publication date: October 16, 2003
    Applicant: Intel Corporation
    Inventors: Poova Tadayon, Franklin G. Monzon, Prateek Dujari
  • Patent number: 6593731
    Abstract: A displacement transducer in which relative displacement between a magnet and a Hall junction is sensed. Magnetic flux from the magnet is linked to the Hall junction in a direction perpendicular to the flow of current through the Hall junction. Relative displacement between the magnet and the Hall junction causes a change in the magnetic flux linked to the Hall junction which in turn causes a change in transverse voltage across the Hall junction. A signal representative of this voltage change is output from the transducer. The transducer may be part of a NEMS or MEMS.
    Type: Grant
    Filed: July 7, 2000
    Date of Patent: July 15, 2003
    Assignee: California Institute of Technology
    Inventors: Michael L. Roukes, Franklin G. Monzon, Michael J. Murphy
  • Patent number: 6574963
    Abstract: An electrical energy-generating heat sink system is described herein that provides a convenient and economical method for continuously recharging an energy storage device in electronic devices.
    Type: Grant
    Filed: November 16, 2001
    Date of Patent: June 10, 2003
    Assignee: Intel Corporation
    Inventors: Pooya Tadayon, Franklin G. Monzon, Prateek Dujari
  • Publication number: 20030093995
    Abstract: An electrical energy-generating heat sink system is described herein that provides a convenient and economical method for continuously recharging an energy storage device in electronic devices.
    Type: Application
    Filed: November 16, 2001
    Publication date: May 22, 2003
    Applicant: Intel Corporation
    Inventors: Pooya Tadayon, Franklin G. Monzon, Prateek Dujari
  • Publication number: 20030080938
    Abstract: A wireless peripheral for a processor-based device may include a plurality of operators or control buttons that are operated to indicate commands. Those commands may be forwarded over a wireless link in the form of electrical signals to the processor-based device. Operation of the controls or operators may be converted into electrical energy which may be utilized to power the wireless peripheral.
    Type: Application
    Filed: October 25, 2001
    Publication date: May 1, 2003
    Inventors: Bin Lian, Franklin G. Monzon, Prateek Dujari
  • Patent number: 6521516
    Abstract: A method and apparatus comprising using buried microchannels to cool specific areas of a substrate over which high heat generating elements of integrated circuits, circuits or devices are processed is disclosed. In one embodiment of the method and apparatus comprise running a cooling fluid thorough a buried microchannel under a heat generating element to locally cool the substrate.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: February 18, 2003
    Assignee: Intel Corporation
    Inventors: Franklin G. Monzon, Prateek Dujari, Bin Lian
  • Publication number: 20030003698
    Abstract: A method and apparatus comprising using buried microchannels to cool specific areas of a substrate over which high heat generating elements of integrated circuits, circuits or devices are processed is disclosed. In one embodiment of the method and apparatus comprise running a cooling fluid thorough a buried microchannel under a heat generating element to locally cool the substrate.
    Type: Application
    Filed: June 29, 2001
    Publication date: January 2, 2003
    Inventors: Franklin G. Monzon, Prateek Dujari, Bin Lian