Abstract: Aspects of the invention are associated with the discovery of processes for converting methane (CH 4), present in a methane-containing feed that may be obtained from a variety of sources such as natural gas, to higher hydrocarbons (e.g., C2+ hydrocarbons) such as C2 hydrocarbons (e.g., ethane, ethylene, and acetylene) and aromatic hydrocarbons (e.g., benzene, one or more C1- or C2-substituted benzenes, and/or one or more fused ring aromatic hydrocarbons). Representative processes involve direct, non-oxidative methane conversion (NOMC), such that the need for an oxidant to form CO as an intermediate may advantageously be avoided. This reduces overall complexity and the tendency to promote unwanted side reactions that reduce hydrocarbon yields and lead to CO2 production.

Abstract: A method of operating a memory device that includes the steps of receiving a read command and a target address in a non-volatile memory (NVM) array, in which the NVM array is divided into a plurality of blocks based on row and column addresses, performing a read operation on NVM cells in the target address and coupling an output of each NVM cell read to a sensing circuit, generating a local reference voltage based on a base reference voltage and an adjustment reference voltage corresponding to the target address of the NVM cells being read and a block that the NVM cells belong thereto, and offsetting the base reference voltage with the adjustment reference voltage, and coupling the local reference voltage to the sensing circuit. Other embodiments are also described.

Abstract: A ceramic feedthrough assembly has a feedthrough interface sleeve brazed to a ceramic feedthrough body and a housing interface sleeve brazed to the feedthrough interface sleeve. The housing interface sleeve is configured to be integrated within an electronic device and welded to a metal housing to form a hermetically sealed electronic device. The ceramic feedthrough has at least one embedded electrical conductor extending from a first location on the ceramic feedthrough body to a second location on the ceramic feedthrough body. The feedthrough interface sleeve is positioned around the ceramic feedthrough body between the first location and the second location and brazed to the wrap-around metallization. When the metal housing is welded to the housing interface sleeve, the ceramic feedthrough assembly facilitates connection to an electronic circuit hermetically sealed in the electronic device with the metal housing.

Abstract: Package deflection and mechanical stress of microelectronic packaging is minimized in a two step manufacturing process. In a first step, a ceramic insulator is high-temperature bonded between a wraparound lead layer and a buffer layer of a same material as the lead layer to provide a symmetrically balanced three-layer structure. In a second step, the three-layer structure is high temperature bonded, using a lower melt point braze, to a heat spreader. This package configuration minimizes package deflection, and thereby improves thermal dissipation and reliability of the package.

Abstract: A semiconductor packaging structure is disclosed. The semiconductor packaging structure includes a heat spreader, a set of at least two leads, and a ceramic insulator. The heat spreader has a thermal conductivity greater than 300 W/m*K. The ceramic insulator has a mean flexural strength that is greater than 500 MPa and so better able to withstand the thermal expansion mismatch between it and the heat spreader. The heat spreader, the set of at least two leads, and the ceramic insulator may also be part of a semiconductor package along with at least one semiconductor device, a wire bond, and a ceramic lid.

Abstract: Package deflection and mechanical stress of microelectronic packaging is minimized in a two step manufacturing process. In a first step, a ceramic insulator is high-temperature bonded between a wraparound lead layer and a buffer layer of a same material as the lead layer to provide a symmetrically balanced three-layer structure. In a second step, the three-layer structure is high temperature bonded, using a lower melt point braze, to a heat spreader. This package configuration minimizes package deflection, and thereby improves thermal dissipation and reliability of the package.

Abstract: An electronics packaging system includes an insulator that electrically insulates a heat sink from electrical leads. An interface between the insulator and the heat sink includes a stress reliever constructed such that a stiffness of the interface is greater than the stiffness of the interface without the stress reliever.

Abstract: An electronics packaging system includes an insulator that electrically insulates a heat sink from electrical leads. An interface between the insulator and the heat sink includes a stress reliever constructed such that a stiffness of the interface is greater than the stiffness of the interface without the stress reliever.

Abstract: Methods for assembly of monolayers of nanoparticles using the Langmuir-Blodgett technique, as well as monolayers, assemblies, and devices are described. The surface properties of these monolayers are highly reproducible and well-defined as compared to other systems. These monolayers can readily be used for molecular detection in either an air-borne or a solution environment, and sensors using the monolayer could have significant implications in chemical and biological warfare detection, national and global security, as well as in medical detection applications.

Abstract: A two-layer nanotape that includes a nanoribbon substrate and an oxide that is epitaxially deposited on a flat surface of the nanoribbon substrate is described. The oxide is deposited on the substrate using a pulsed laser ablation deposition process. The nanoribbons can be made from materials such as SnO2, ZnO, MgO, Al2O3, Si, GaN, or CdS. Also, the sintered oxide target can be made from materials such as TiO2, transition metal doped TiO2 (e.g., CO0.05Ti0.95O2), BaTiO3, ZnO, transition metal doped ZnO (e.g., Mn0.1Zn0.9O and Ni0.1Zn0.9O), LaMnO3, BaTiO3, PbTiO3, YBa2Cu3Oz, or SrCu2O2 and other p-type oxides. Additionally, temperature sensitive nanoribbon/metal bilayers and their method of fabrication by thermal evaporation are described. Metals such as Cu, Au, Ti, Al, Pt, Ni and others can be deposited on top of the nanoribbon surface. Such devices bend significantly as a function of temperature and are suitable as, for example, thermally activated nanoscale actuators.

Abstract: A two-layer nanotape that includes a nanoribbon substrate and an oxide that is epitaxially deposited on a flat surface of the nanoribbon substrate is described. A method for making the nanotape that includes providing plural substrates and placing the substrates in a quartz tube is also described. The oxide is deposited on the substrate using a pulsed laser ablation deposition process. The nanoribbons can be made from materials such as SnO2, ZnO, MgO, Al2O3, Si, GaN, or CdS. Also, the sintered oxide target can be made from materials such as TiO2, transition metal doped TiO2 (e.g., CO0.05Ti0.95O2), BaTiO3, ZnO, transition metal doped ZnO (e.g., Mn0.1Zn0.9O and Ni0.1Zn0.9O), LaMnO3, BaTiO3, PbTiO3, YBa2Cu3Oz, or SrCu2O2 and other p-type oxides. Additionally, temperature sensitive nanoribbon/metal bilayers and their method of fabrication by thermal evaporation are described. Metals such as Cu, Au, Ti, Al, Pt, Ni and others can be deposited on top of the nanoribbon surface.

Abstract: Feedthrough apparatus has a metal housing with an opening therein and a base having a surface at the opening. A ceramic feedthrough extends through the opening in the housing and forms an interface therewith, and is brazed to the housing at the interface. The surface of the base extends at least to the feedthrough and has a cut-out area or opening therein adjacent the feedthrough in order to minimize the surface area contact at the interface between the ceramic feedthrough and the metal housing. The opening in the base may have edges which extend from sidewalls of the feedthrough under the feedthrough by small distances, in order to form a small ledge beneath the outer periphery of the feedthrough. Alternatively, the opening in the base may be approximately equal in size to the feedthrough so as to have edges which engage sidewalls of the feedthrough.

Abstract: Feedthrough apparatus has a metal housing with an opening therein and a base having a surface at the opening. A ceramic feedthrough extends through the opening in the housing and forms an interface therewith, and is brazed to the housing at the interface. The surface of the base extends at least to the feedthrough and has a cut-out area or opening therein adjacent the feedthrough in order to minimize the surface area contact at the interface between the ceramic feedthrough and the metal housing. The opening in the base may have edges which extend from sidewalls of the feedthrough under the feedthrough by small distances, in order to form a small ledge beneath the outer periphery of the feedthrough. Alternatively, the opening in the base may be approximately equal in size to the feedthrough so as to have edges which engage sidewalls of the feedthrough.