Abstract: Various embodiments herein disclose a device, comprising one or more fluid interfacing components and a cartridge holder, wherein the one or more fluid interfacing components are fixed while the cartridge holder moves along a linear guide. Also disclosed herein are methods of using the device to analyze a sample containing particles, and methods of diagnosing a disease in a subject by using the device.

Abstract: Various embodiments herein disclose a device, comprising one or more fluid interfacing components and a cartridge holder, wherein the one or more fluid interfacing components are fixed while the cartridge holder moves along a linear guide. Also disclosed herein are methods of using the device to analyze a sample containing particles, and methods of diagnosing a disease in a subject by using the device.

Abstract: Various embodiments herein disclose a device, comprising one or more fluid interfacing components and a cartridge holder, wherein the one or more fluid interfacing components are fixed while the cartridge holder moves along a linear guide. Also disclosed herein are methods of using the device to analyze a sample containing particles, and methods of diagnosing a disease in a subject by using the device.

Abstract: Various embodiments disclosed herein comprise a microfluidic cartridge, comprising a molded polymer bonded to a flat surface, wherein the molded polymer comprises one or more openings for connecting to fluidic volumes. Also provided are methods of preparing a microfluidic cartridge, comprising placing a patterned micro-fabricated chip into a mold and filling the mold with a material in liquid or other shape-conforming form. Further disclosed herein are methods of analyzing a particle sample by using the microfluidic sample.

Abstract: An optical apparatus comprises: a semiconductor substrate; a semiconductor optical device integrally formed on the substrate and having a device end face; and a low-index planar optical waveguide integrally formed on the semiconductor substrate at the device end face. The waveguide is end-coupled at its proximal end to the optical device through the device end face and is arranged so as to comprise a waveguide mode converter. The waveguide is arranged at its distal end to transmit or receive an optical signal through its distal end to or from another low-index optical waveguide end-coupled with the integrally-formed waveguide and assembled with the integrally-formed waveguide, optical device, or substrate. The optical apparatus can further comprise a discrete low-index optical waveguide assembled with the integrally-formed waveguide, optical device, or substrate so as to be end-coupled with the integrally-formed waveguide at its distal end.

Abstract: An optical apparatus comprises a semiconductor optical device waveguide formed on a semiconductor substrate, and an integrated end-coupled waveguide formed on the semiconductor substrate. The integrated waveguide may comprise materials differing from those of the device waveguide and the substrate. Spatially selective material processing may be employed for first forming the optical device waveguide on the substrate, and for subsequently depositing and forming the integrated end-coupled waveguide on the substrate. Spatially selective material processing enables accurate spatial mode matching and transverse alignment of the waveguides, and multiple device waveguides and corresponding integrated end-coupled waveguides may be fabricated concurrently on a common substrate on a wafer scale.

Abstract: A method for bonding first and second components to one another comprises: forming a plurality of bonding area projections on a bonding area of a first component; depositing bonding metal on the bonding area of the first component or a corresponding bonding area of a second component; positioning the first and second components with the deposited bonding metal between their respective bonding areas and in contact therewith; and urging the first and second components toward one another, thereby pressing the deposited bonding metal therebetween. The plurality of bonding area projections protrude into the deposited bonding metal after the bonding metal is pressed between the first and second components. The first and second components are bonded to one another by each adhering to bonding metal. An apparatus comprises first and second components bonded according to the disclosed method.

Abstract: A device and method for increasing input/output from a die by making electrically conductive microvias connecting the integrated circuit with a backside of the die. The backside electrically conductive microvias connect an integrated circuit in the die to pads on the backside of the die. A superstrate is situated on top of the die and connects to the microvias using controlled collapse chip connections (C4) with a thermal interface material (TIM) surrounding the electrical connections. A superstrate lead system electrically connects the backside pads to wirebonds that connect with either the substrate or directly to the motherboard. Heat dissipates from the die via the TIM to the superstrate to a heat sink situated on top of the superstate.

Abstract: A device and method for increasing input/output from a die by making electrically conductive microvias connecting the integrated circuit with a backside of the die. The backside electrically conductive microvias connect an integrated circuit in the die to pads on the backside of the die. A superstrate is situated on top of the die and connects to the microvias using controlled collapse chip connections (C4) with a thermal interface material (TIM) surrounding the electrical connections. A superstrate lead system electrically connects the backside pads to wirebonds that connect with either the substrate or directly to the motherboard. Heat dissipates from the die via the TIM to the superstrate to a heat sink situated on top of the superstate.