Abstract: An optical transceiver with a built-in heat transfer structure is described. The heat transfer structure can connect one or more circuit regions of the optical transceiver to a heat sink while bypassing circuit regions that may impede the transfer of heat from the one or more circuit regions. The heat transfer structure may directly contact the one or more circuit regions, and the heat sink and may include an opening to avoid contact with the circuit regions to be bypassed.

Abstract: Opto-electronic packages and methods for making opto-electronic packages are disclosed, including a method comprising forming an opto-electronic circuit on a first surface of a substrate of a lower package assembly, the first surface of the substrate having a first bonding pattern configured to provide a hermetic seal, the first bonding pattern extending around the opto-electronic circuit; positioning a bottom of a ring frame onto the first bonding pattern so as to surround the opto-electronic circuit with the ring frame; hermetically sealing a bottom of the ring frame to the first bonding pattern of the first surface of the substrate of the lower package assembly subsequent to the formation of the opto-electronic circuit on the first surface of the substrate; and hermetically sealing a top of the ring frame to form a hermetically sealed opto-electronic package.

Abstract: An optical transceiver having a locking assembly that prevents undesirable movement of the optical transceiver when engaged with another device is described. The locking assembly includes a slide with a projection, lift, and weighted stops. In a first configuration, the slide and weighted stops can sustain contact between a thermal interface material of the optical transceiver and the other device while locking the optical transceiver to prevent movement. In a second configuration mode, the locking assembly disengages the thermal interface material from the other device and unlocks the weighted stops to permit disconnection from the other device.

Abstract: Opto-electronic packages and methods for making opto-electronic packages are disclosed, including a method comprising forming an opto-electronic circuit on a first surface of a substrate of a lower package assembly, the first surface of the substrate having a first bonding pattern configured to provide a hermetic seal, the first bonding pattern extending around the opto-electronic circuit; positioning a bottom of a ring frame onto the first bonding pattern so as to surround the opto-electronic circuit with the ring frame; hermetically sealing a bottom of the ring frame to the first bonding pattern of the first surface of the substrate of the lower package assembly subsequent to the formation of the opto-electronic circuit on the first surface of the substrate; and hermetically sealing a top of the ring frame to form a hermetically sealed opto-electronic package.

Abstract: An optical transceiver having a locking assembly that prevents undesirable movement of the optical transceiver when engaged with another device is described. The locking assembly includes a slide with a projection, lift, and weighted stops. In a first configuration, the slide and weighted stops can sustain contact between a thermal interface material of the optical transceiver and the other device while locking the optical transceiver to prevent movement. In a second configuration mode, the locking assembly disengages the thermal interface material from the other device and unlocks the weighted stops to permit disconnection from the other device.

Abstract: An optical transceiver with a built-in heat transfer structure is described. The heat transfer structure can connect one or more circuit regions of the optical transceiver to a heat sink while bypassing circuit regions that may impede the transfer of heat from the one or more circuit regions. The heat transfer structure may directly contact the one or more circuit regions, and the heat sink and may include an opening to avoid contact with the circuit regions to be bypassed.

Abstract: Systems and devices for providing heat relief to an optical transceiver device are disclosed. The optical transceiver device includes a heat transfer structure that includes a heat slug connected to a high heat generating circuit in the optical transceiver device. The heat slug has a structure that allows heat to flow anisotropically from one surface of the heat slug that contacts the heat generating circuit to a second surface of the heat slug that is thermally coupled to a heat transfer device such as a heat sink. The perimeter of the heat slug is enclosed by an insulation frame. The insulation frame is configured to thermally isolate the heat slug by reducing heat transfer from the heat slug to other components of the optical transceiver device.

Abstract: Standard solderless connectors extend from a molded package body supporting at least one high power LED. The package includes a relatively large metal slug extending completely through the package. The LED is mounted over the top surface of the metal slug with an electrically insulating ceramic submount in-between the LED and metal slug. Electrodes on the submount are connected to the package connectors. Solderless clamping means, such as screw openings, are provided on the package for firmly clamping the package on a thermally conductive mounting board. The slug in the package thermally contacts the board to sink heat away from the LED. Fiducial structures (e,g., holes) in the package precisely position the package on corresponding fiducial structures on the board. Other packages are described that do not use a molded body.

Abstract: Standard solderless connectors extend from a molded package body supporting at least one high power LED. The package includes a relatively large metal slug extending completely through the package. The LED is mounted over the top surface of the metal slug with an electrically insulating ceramic submount in-between the LED and metal slug. Electrodes on the submount are connected to the package connectors. Solderless clamping means, such as screw openings, are provided on the package for firmly clamping the package on a thermally conductive mounting board. The slug in the package thermally contacts the board to sink heat away from the LED. Fiducial structures (e,g., holes) in the package precisely position the package on corresponding fiducial structures on the board. Other packages are described that do not use a molded body.