Abstract: In one embodiment, a method comprises initiating shutdown of network traffic of a line card while the line card is coupled to a connector chassis and exchanging network traffic, the initiating shutdown in response to actuation of a magnetic switch associated with the line card, the magnetic switch being actuated in response to movement of actuating structure that unlocks the line card for removal from the connector chassis; and completing the shutdown of network traffic in the line card prior to permitting complete removal of the line card from the connector chassis.

Abstract: An electrical resistor structure overlies a substrate and comprises a composite resistor having a first resistor of relatively low resistance and a second resistor of relatively high resistance overlying the first resistor. First and second electrodes make contact with the composite resistor at spaced locations, and a bond pad overlies the second resistor at a position between the electrodes. A metallized fiber is soldered a to a metal bond pad by providing a stacked resistor structure beneath the bond pad, disposing a solder preform over the bond pad, disposing the metallized fiber over the bond pad, and flowing a current through the stacked resistor structure. The stacked resistor structure, when subjected to a current flowing generally along a first axis, is characterized by a temperature profile that has first and second peaks on either side of the bond pad.

Abstract: The present invention relates to the analog external cavity lasers (ECLs) including designs, materials, methods of manufacturing and methods of use for such ECLs and packages for such ECLs. Numerous criteria are presented that lead to improved cost/performance for ECLs and for systems incorporating such ECLs.

Abstract: An electrical resistor structure overlies a substrate and comprises a composite resistor having a first resistor of relatively low resistance and a second resistor of relatively high resistance overlying the first resistor. First and second electrodes make contact with the composite resistor at spaced locations, and a bond pad overlies the second resistor at a position between the electrodes. A metallized fiber is soldered a to a metal bond pad by providing a stacked resistor structure beneath the bond pad, disposing a solder preform over the bond pad, disposing the metallized fiber over the bond pad, and flowing a current through the stacked resistor structure. The stacked resistor structure, when subjected to a current flowing generally along a first axis, is characterized by a temperature profile that has first and second peaks on either side of the bond pad.

Abstract: An electrical resistor structure overlies a substrate and comprises a composite resistor having a first resistor of relatively low resistance and a second resistor of relatively high resistance overlying the first resistor. First and second electrodes make contact with the composite resistor at spaced locations, and a bond pad overlies the second resistor at a position between the electrodes. A metallized fiber is soldered a to a metal bond pad by providing a stacked resistor structure beneath the bond pad, disposing a solder preform over the bond pad, disposing the metallized fiber over the bond pad, and flowing a current through the stacked resistor structure. The stacked resistor structure, when subjected to a current flowing generally along a first axis, is characterized by a temperature profile that has first and second peaks on either side of the bond pad.

Abstract: A substrate structure useful for photonics modules comprises a high-thermal-conductivity (e.g., greater than 20 W/m°K) substrate body with a low-thermal-conductivity (e.g., less than 5 W/m°K) dielectric layer overlying at least a portion of the substrate body. Patterned metal layers for electrical circuit connections can be located on the dielectric layer, on the substrate body (under the dielectric layer, on regions of exposed substrate body, or both), or on both. Where the laser is driven at high frequencies (e.g., 2.5 Gbits/sec), the dielectric layer material and thickness can be chosen to provide desired RF behavior. For example, the electrodes and dielectric layer can be configured to provide a transmission line with the desired impedance. Further, where it is desired to solder a component to the substrate, a heater resistor can be formed on the dielectric layer, thereby facilitating soldering the component.

Abstract: The present invention relates to the analog external cavity lasers (ECLs) including designs, materials, methods of manufacturing and methods of use for such ECLs and packages for such ECLS. Numerous criteria are presented that lead to improved cost/performance for ECLs and for systems incorporating such ECLs.

Abstract: An ECLD assembly includes a thermally stabilized substrate, a laser device fixedly mounted in relation to the substrate, and a waveguide with a grating region having a grating formed therein. The waveguide is positioned to receive light emitted by the laser device and is attached to a top surface of the substrate. The ECLD's output wavelength is stabilized by one or more of the following: (1) mounting the waveguide so that its outer surface is less than 60 ?m, and preferably less than about 30 ?m from the top surface of the substrate; (2) placing a thermal cover (e.g.