Abstract: In various aspects, the disclosure relates to a method of forming a molded article comprising: combining, to form a blend, a polymer base resin and a thermally conductive filler, wherein the thermally conductive filler comprises a platelet filler having a thickness between 100 nm and 10 microns; feeding the blend to a mold cavity of a suitable molding apparatus, wherein the mold cavity has a mold portion that may be retracted in a through-plane direction; foaming the blend to allow a pressure drop; and retracting the mold portion in the through-plane direction to provide the molded article.

Abstract: A polymer foam composition includes: from about 5 wt. % to about 84 wt. % of a polymer base resin; from about 15 wt. % to about 70 wt. % of a thermally conductive filler having an aspect ratio greater than 1:1; from about 0.01 to about 5 wt. % of a nanostructured fluoropolymer; and from about 0.01 wt. % to about 2 wt. % of a foaming agent. The polymer foam composition is formed from a core-back process and exhibits a thermal conductivity of at least 1.5 W/mK when tested in accordance with ISO 22007-2. Articles including the polymer foam composition are further described; in one aspect the article is a heat exchanger. Methods of forming the polymer foam composition are also described.

Abstract: The disclosure concerns polymer compositions including a graphene and optional filler. The polymer compositions exhibited improved dielectric strength. The polymer compositions may comprise from about 5 wt. % to about 99 wt. % of a polymer base resin; from about 0 wt. % to about 40 wt. % of a filler; and from about 0.01 wt. % to about 10 wt. % of a graphene, wherein the graphene has a surface area of greater than 20 m2/g. The combined weight percent value of all components does not exceed about 100 wt. %, and all weight percent values are based on the total weight of the composition. The polymer composition exhibits a dielectric strength that is at least 1.1 times greater than a substantially similar composition in the absence of the graphene when tested in accordance with ISO 60243-1.

Abstract: This disclosure describes micro, sub-micro, and nano-cellular polymer foams formed from a polymer composition that includes a polymer and functionalized carbon nanotubes, and systems and methods of formation thereof. The microcellular polymer foam has an average pore size within a range of 1 micron to 100 microns, the sub-microcellular polymer foam has an average pore size within a range of 0.5 microns to 1 micron, and the nano-cellular polymer foam has an average pore size within a range of 10 nanometers to 500 nanometers. In other aspects, this disclosure describes micro, sub-micro, and nano-cellular polymer foams formed from a polymer composition that includes a polymer and non-functionalized carbon nanotubes.

Abstract: This disclosure describes a polymer composition that includes a polymer and functionalized carbon nanotubes, and systems and method of formation thereof. The polymer composition includes functionalized carbon nanotubes and one or more polymers. Parts formed from the polymer composition have improved sloughing properties as compared to parts formed from compositions including conventional carbon nanotubes. Additionally, parts formed herein have lower liquid particle count values as compared to parts formed from compositions including conventional carbon nanotubes.

Abstract: This disclosure describes a polymer composition that includes a polymer, crystalline cellulose, and functionalized carbon nanotubes, and systems and method of formation thereof. The polymer composition includes functionalized carbon nanotubes, crystalline cellulose, and one or more polymers.

Abstract: Disclosed herein are methods and compositions of thermally conductive polymers with improved flame retardancy. The resulting compositions can be used in the manufacture of articles while still retaining the advantageous physical properties of thermally conductive polymers with improved flame retardancy. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

Abstract: Disclosed herein are compositions comprising a. from 35 to 80 vol % of a thermoplastic polymer; b. from 5 to 45 vol % of a thermally insulative filler with an intrinsic thermal conductivity less than or equal to 10 W/mK; and c. from 5 to 15 vol % of a thermally conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK, wherein the composition is characterized by: i. a thermal conductivity of at least 1.0 W/mK; ii. a thermal conductivity of at least 7 times the total filler volume fraction times the thermal conductivity of the pure thermoplastic polymer; and iii. a volume resistivity of at least 107 Ohm·cm. Also disclosed are articles and methods of use therefor.

Abstract: Disclosed herein are compositions comprising a. from 35 to 80 vol % of a thermoplastic polymer; b. from 5 to 45 vol % of a low thermally conductive, electrically insulative filler with an intrinsic thermal conductivity of from 10 to 30 W/mK; c. from 5 to 15 vol % of a high thermally conductive, electrically insulative filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK; and d. from 5 to 15 vol % of a high thermally conductive, electrically conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK, wherein the composition is characterized by: i. a thermal conductivity of at least 1.0 W/mK; and ii. a volume resistivity of at least 107 Ohm.cm. Also disclosed are articles and methods of use therefor.

Abstract: Disclosed herein are compositions comprising a. from 35 to 80 vol % of a thermoplastic polymer; b. from 5 to 45 vol % of a low thermally conductive, electrically insulative filler with an intrinsic thermal conductivity of from 10 to 30 W/mK; c. from 5 to 15 vol % of a high thermally conductive, electrically insulative filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK; and d. from 5 to 15 vol % of a high thermally conductive, electrically conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK, wherein the composition is characterized by: i. a thermal conductivity of at least 1.0 W/mK; and ii. a volume resistivity of at least 107 Ohm.cm. Also disclosed are articles and methods of use therefor.

Abstract: Disclosed herein are compositions comprising a. from 35 to 80 vol % of a thermoplastic polymer; b. from 5 to 45 vol % of a thermally insulative filler with an intrinsic thermal conductivity less than or equal to 10 W/mK; and c. from 5 to 15 vol % of a thermally conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK, wherein the composition is characterized by: i. a thermal conductivity of at least 1.0 W/mK; ii. a thermal conductivity of at least 7 times the total filler volume fraction times the thermal conductivity of the pure thermoplastic polymer; and iii. a volume resistivity of at least 107 Ohm.cm. Also disclosed are articles and methods of use therefor.

Abstract: A thermally regulating heater and a heated seat made using these heaters wherein the resulting heated seat provides enhanced temperature control without the need of any temperature control system. The heaters include the use of a polymeric positive temperature coefficient composition that operates at lower trip temperatures than previous polymeric positive temperature coefficient compositions. The polymeric positive temperature coefficient composition have a trip temperature below the heat deflection temperature of the composition such that the polymeric positive temperature coefficient composition heats the heated seat to a temperature closer to the comfort level of an individual using the heated seat. Since the polymeric positive temperature coefficient composition uses plastic materials, the polymeric positive temperature coefficient composition can be formed into different shapes as needed using a molding process, such as injection molding.

Abstract: In the process of the invention, a composition is made by mixing a plurality of microcapsules containing at least an additive such as lubricants, oils, fragrances, colorants, etc., with a dispersing polymeric material to form a first blend, and compounding the first blend into a base containing at least a polymeric material at a temperature of less than 370° C., whereas the resulting composition is substantially free of segregated microcapsules and heat degraded shell.

Abstract: A thermoplastic glass filled resin composition having improved heat distortion properties consisting essentially of a resin blend consisting essentially of an alkylene aryl polyester, a core-shell ASA (acrylate-styrene-acrylonitrile interpolymer) and an effective amount of talc, polyesteramide, or dicarboxcylic acid salt for enhancing the heat distortion properties of the resin.