Patents by Inventor Frans Setiabudi

Frans Setiabudi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9074049
    Abstract: A thermosetting composition comprising (a) at least one phosphorous-free dihydrobenzoxazine component; (b) at least a quaternary ammonium salt and (c) optionally a compound comprising at least an epoxy group is disclosed. Cured products made from these compositions have valuable chemical, physical and mechanical properties.
    Type: Grant
    Filed: September 23, 2010
    Date of Patent: July 7, 2015
    Assignee: Huntsman International LLC
    Inventor: Frans Setiabudi
  • Patent number: 8852382
    Abstract: A thermosetting composition comprising (a) 97 to 40 percent by weight of at least one bis(dihydrobenzoxazine) prepared by the reaction of an unsubstituted or substituted bisphenol with at least one unsubstituted position ortho to each hydroxyl group, formaldehyde and a primary amine; and (b) 3 to 60 percent by weight of at least one bisphenol, wherein the percent by weight refer to the total amount of components (a) and (b), with the proviso that (a) and (b) add up to 100 percent by weight; and (c) optionally other components. Cured products made from these compositions have valuable chemical, physical and mechanical properties.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: October 7, 2014
    Assignee: Huntsman International LLC
    Inventor: Frans Setiabudi
  • Publication number: 20120237753
    Abstract: A thermosetting composition comprising (a) at least one phosphorous-free dihydrobenzoxazine component; (b) at least a quaternary ammonium salt and (c) optionally a compound comprising at least an epoxy group is disclosed. Cured products made from these compositions have valuable chemical, physical and mechanical properties.
    Type: Application
    Filed: September 23, 2010
    Publication date: September 20, 2012
    Applicant: Huntsman International LLC
    Inventor: Frans Setiabudi
  • Patent number: 8003750
    Abstract: A thermosetting composition comprising (a) 97.9 to 40 percent by weight of at least one bis(dihydrobenzoxazine) prepared by the reaction of an unsubstituted or substituted bisphenol with at least one unsubstituted position ortho to each hydroxyl group, formaldehyde and a primary amine; (b) 2 to 50 percent by weight of at least one organic polyamine; and (c) 0.1 to 10 percent by weight of at least one curing catalyst, selected from the group of carboxylic acids, sulfonic acids and phosphonic acids having at least two acid groups and no other reactive groups; wherein the percent by weight refer to the total amount of components (a), (b) and (c) in the composition, with the proviso that (a), (b) and (c) add up to 100 percent by weight; and (d) and optionally other components. Cured products of these compositions show valuable chemical, physical and mechanical properties.
    Type: Grant
    Filed: January 31, 2008
    Date of Patent: August 23, 2011
    Assignee: Huntsman International LLC
    Inventor: Frans Setiabudi
  • Publication number: 20110135944
    Abstract: A thermosetting composition comprising (a) (a) at least one phosphorous-free dihydrobenzoxazine component; (b) at least a sulfonium salt and (c) optionally a compound comprising at least an epoxy group is disclosed. Cured products made from these compositions have valuable chemical, physical and mechanical properties.
    Type: Application
    Filed: April 24, 2009
    Publication date: June 9, 2011
    Applicant: Huntsman International LLC
    Inventor: Frans Setiabudi
  • Publication number: 20100029891
    Abstract: A thermosetting composition comprising (a) 97.9 to 40 percent by weight of at least one bis(dihydrobenzoxazine) prepared by the reaction of an unsubstituted or substituted bisphenol with at least one unsubstituted position ortho to each hydroxyl group, formaldehyde and a primary amine; (b) 2 to 50 percent by weight of at least one organic polyamine; and (c) 0.1 to 10 percent by weight of at least one curing catalyst, selected from the group of carboxylic acids, sulfonic acids and phosphonic acids having at least two acid groups and no other reactive groups; wherein the percent by weight refer to the total amount of components (a), (b) and (c) in the composition, with the proviso that (a), (b) and (c) add up to 100 percent by weight; and (d) and optionally other components. Cured products of these compositions show valuable chemical, physical and mechanical properties.
    Type: Application
    Filed: January 31, 2008
    Publication date: February 4, 2010
    Applicant: HUNTSMAN INTERNATIONAL LLC
    Inventor: Frans Setiabudi
  • Publication number: 20100015343
    Abstract: A thermosetting composition comprising (a) 97 to 40 percent by weight of at least one bis(dihydrobenzoxazine) prepared by the reaction of an unsubstituted or substituted bisphenol with at least one unsubstituted position ortho to each hydroxyl group, formaldehyde and a primary amine; and (b) 3 to 60 percent by weight of at least one bisphenol, wherein the percent by weight refer to the total amount of components (a) and (b), with the proviso that (a) and (b) add up to 100 percent by weight; and (c) optionally other components. Cured products made from these compositions have valuable chemical, physical and mechanical properties.
    Type: Application
    Filed: January 30, 2008
    Publication date: January 21, 2010
    Applicant: Huntsman International LLC
    Inventor: Frans Setiabudi
  • Patent number: 7488785
    Abstract: Compositions containing (a) a liquid epoxy resin, (b) an aliphatic or cycloaliphatic primary monoamine and/or an aliphatic or cycloaliphatic disecondary diamine, (c) a latent curing agent for the epoxy resin (a) which does not react until temperatures above 70° C. (measured by means of DSC at a heating rate of 10° C./min), (d) a photopolymerizable compound and (e) a photoinitiator, the ratio of the number of equivalents of epoxy groups to that of polymerizable groups being 1:0.01 to 1:0.7, are suitable as impregnating resins.
    Type: Grant
    Filed: April 5, 2007
    Date of Patent: February 10, 2009
    Assignee: Huntsman Advanced Materials Americas Inc.
    Inventor: Frans Setiabudi
  • Patent number: 7442434
    Abstract: A solvent-free epoxy resin matrix composition comprising: (a) a liquid epoxy resin or a liquid mixture of epoxy resins, (b) a benzylidenamine compound, (c) an aliphatic or cycloaliphatic primary monoamine and/or disecondary diamine; and (d) a catalytically curing tertiary amine. The epoxy resin matrix composition is used as an impregnating resin to form impregnated fiber composite materials.
    Type: Grant
    Filed: April 5, 2004
    Date of Patent: October 28, 2008
    Assignee: Huntsman Advanced Materials Americas Inc.
    Inventors: Frans Setiabudi, Ulrich Weidmann, Philippe Michaud
  • Publication number: 20070184281
    Abstract: Compositions containing (a) a liquid epoxy resin, (b) an aliphatic or cycloaliphatic primary monoamine and/or an aliphatic or cycloaliphatic disecondary diamine, (c) a latent curing agent for the epoxy resin (a) which does not react until temperatures above 70° C. (measured by means of DSC at a heating rate of 1O° C./min), (d) a photopolymerizable compound and (e) a photoinitiator, the ratio of the number of equivalents of epoxy groups to that of polymerizable groups being 1:0.01 to 1:0.7, are suitable as impregnating resins.
    Type: Application
    Filed: April 5, 2007
    Publication date: August 9, 2007
    Applicant: Huntsman Advanced Materials Americas Inc.
    Inventor: Frans Setiabudi
  • Patent number: 7217771
    Abstract: Compositions containing: (a) a liquid epoxy resin; (b) an aliphatic or cycloaliphatic primary monoamine and/or an aliphatic or cycloaliphatic disecondary diamine; (c) a latent curing agent for the epoxy resin (a) which does not react until temperatures above 70° C. (measured by means of DSC at a heating rate of 10° C./min); (d) a photopolymerizable compound; and (e) a photoinitiator; the ratio of the number of equivalents of epoxy groups to that of photopolymerizable groups being 1:0.01 to 1:0.7, are suitable as impregnating resins.
    Type: Grant
    Filed: July 29, 2002
    Date of Patent: May 15, 2007
    Assignee: Huntsman Advanced Materials Americas Inc.
    Inventor: Frans Setiabudi
  • Publication number: 20060194062
    Abstract: A fibre composite impregnated with an epoxy resin matrix and comprising a benzylidenamine compound has advantageous properties.
    Type: Application
    Filed: April 5, 2004
    Publication date: August 31, 2006
    Applicant: Huntsman Advanced Materials America Inc.
    Inventors: Frans Setiabudi, Ulrich Weidmann, Philippe Michaud
  • Publication number: 20040234773
    Abstract: Compositions containing: (a) a liquid epoxy resin; (b) an aliphatic or cycloaliphatic primary monoamine and/or an aliphatic or cycloaliphatic disecondary diamine; (c) a latent curing agent for the epoxy resin (a) which does not react until temperatures above 70° C. (measured by means of DSC at a heating rate of 10° C./min); (d) a photopolymerizable compound; and (e) a photoinitiator; the ratio of the number of equivalents of epoxy groups to that of photopolymerizable groups being 1:0.01 to 1:0.7, are suitable as impregnating resins.
    Type: Application
    Filed: January 30, 2004
    Publication date: November 25, 2004
    Inventor: Frans Setiabudi
  • Patent number: 6686122
    Abstract: Process for the production of a resist coating, in which (a) a substrate is coated with a resist composition which comprises at least one component which absorbs radiation in the near infrared region with warming of the coating; and (b) the resist composition or a composition derived therefrom and obtained during the process is subjected at least once during the process to thermal treatment with the aid of radiation in the near infrared region.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: February 3, 2004
    Assignee: Vantico Inc.
    Inventor: Frans Setiabudi
  • Patent number: 6629358
    Abstract: The method of manufacturing a sheet stack for electromagnetic assemblies, consisting of ferromagnetic material, includes forming the sheet stack from raw magnetic steel sheets in a shaping tool without the use of spacers, if necessary with the help of positioning aids, and simultaneously introducing a hardenable mixture into the shaping tool in order to totally surround the sheet stack and to form an anti-corrosion layer and hardening or hardening out this casting compound according to the pressure-gelating method to connect the sheets together and to form the finished sheet stack in one single working step.
    Type: Grant
    Filed: March 8, 1999
    Date of Patent: October 7, 2003
    Assignees: Thyssen Transrapid System GmbH, Vantico Inc.
    Inventors: Frans Setiabudi, Michel Gehrig, Ulrich Massen, Roland Moser, Thomas Moser, Luitpold Miller, Wolfgang Hahn
  • Publication number: 20010001895
    Abstract: The invention relates to a method of manufacturing a sheet stack (8) consisting of ferromagnetic material, and/or an assembly including such a sheet stack (8) and at least one further component (12, 13, 14). According to the invention, the sheet stack (8) is assembled from raw magnetic steel sheets, and is positioned in a shaping tool. Thereafter, by means of introducing a mixture into the tool and hardening or hardening out of the mixture, the sheets are surrounded by the mixture and connected together to form the finished sheet stack (8) in a single working step. In order to manufacture the assembly, the sheet stack (8) can be connected in the same working step with the components (12,13,14), and the assembly as a whole can be provided with its final electrical, magnetic, mechanical and/or geometric properties (FIG. 2).
    Type: Application
    Filed: March 8, 1999
    Publication date: May 31, 2001
    Inventors: FRANS SETIABUDI, MICHEL GEHRIG, ULRICH MASSEN, ROLAND MOSER, THOMAS MOSER, LUITPOLD MILLER, WOLFGANG HAHN
  • Patent number: 6147026
    Abstract: A composition, comprising(a) a compound of formula I(R.sub.1 R.sub.2 R.sub.3 P).sub.x L.sub.y M.sup.2+ Z.sub.1.sup.- Z.sub.2.sup.- (I),whereinR.sub.1, R.sub.2 and R.sub.3 are each independently of one another H, C.sub.1 -C.sub.20 alkyl, C.sub.1 -C.sub.20 -alkoxy; C.sub.4 -C.sub.12 cycloalkyl which is unsubstituted or substituted by C.sub.1 -C.sub.6 alkyl, C.sub.1 -C.sub.6 haloalkyl or C.sub.1 -C.sub.6 alkoxy; C.sub.4 -C.sub.12 cycloalkoxy which is unsubstituted or substituted by C.sub.1 -C.sub.6 -alkyl, C.sub.1 -C.sub.6 haloalkyl or C.sub.1 -C.sub.6 alkoxy; C.sub.6 -C.sub.16 aryl which is unsubstituted or substituted by C.sub.1 -C.sub.6 alkyl, C.sub.1 -C.sub.6 haloalkyl or C.sub.1 -C.sub.6 alkoxy; C.sub.6 -C.sub.16 aryloxy which is unsubstituted or substituted by C.sub.1 -C.sub.6 alkyl, C.sub.1 -C.sub.6 haloalkyl or C.sub.1 -C.sub.6 alkoxy; C.sub.7 -C.sub.16 aralkyl which is unsubstituted or substituted by C.sub.1 -C.sub.6 alkyl, C.sub.1 -C.sub.6 haloalkyl or C.sub.1 -C.sub.6 alkoxy; or C.sub.7 -C.sub.
    Type: Grant
    Filed: November 14, 1997
    Date of Patent: November 14, 2000
    Assignee: Ciba Specialty Chemcials Corporation
    Inventors: Frans Setiabudi, Dean Tallak Behm
  • Patent number: 6111015
    Abstract: Curable suspensions of an epoxy resin formulation comprisinga) a storage-stable suspension of an epoxy resin and a toughener suspended therein which contains no groups that react with a curable epoxy resin system,b) dicyandiamide, a polycarboxylic acid, a polycarboxylic anhydride, a polyamine, a polyaminoamide, an amino group-containing adduct of an amine and a polyepoxide, a polyol or a catalytically curing hardener, and, as optional components,c) a curing catalyst, conventional fillers or reinforcing materials,are particularly suitable for use as casting resins, laminating resins or adhesives.
    Type: Grant
    Filed: February 21, 1995
    Date of Patent: August 29, 2000
    Assignee: Ciba Specialty Chemicals Corp.
    Inventors: Sameer H. Eldin, Robert Peter Peyer, Frans Setiabudi, Urs Gruber
  • Patent number: 6100323
    Abstract: A composition, comprising(a) a Diels-Alder-adduct of cyclopentadiene,(b) a catalyst for the ring-opening metathesis polymerisation, and(c) 2-95% by weight of a filler, based on the entire composition,the filler containing at least 0.5% by weight of a basic adsorbent, based on the entire composition,gives cured products having excellent mechanical and electrical properties and is particularly suitable as coating material for electrical and electronic components.
    Type: Grant
    Filed: March 6, 1997
    Date of Patent: August 8, 2000
    Assignee: Ciba Specialty Chemicals Corp.
    Inventors: Frans Setiabudi, Andreas Muhlebach, Yoshiaki Naganuma
  • Patent number: 6001909
    Abstract: A composition, comprising(a) at least one tight cycloolefin,(b) a catalyst for the ring-opening metathesis polymerisation,(c) a filler, and(d) a silane of formula I ##STR1## wherein R is a polyvalent organic group having 2 to 100 carbon atoms, where one or more than one carbon atom can be replaced by O, S, N or Si atoms and Y.sub.1, Y.sub.2 and Y.sub.3 are each independently of one another C.sub.1 -C.sub.20 alkyl, C.sub.5 -C.sub.20 aryl, C.sub.6 -C.sub.20 aralkyl, C.sub.5 -C.sub.12 cycloalkyl, C.sub.2 -C.sub.20 -alkoxyalkyl or C.sub.1 -C.sub.20 acyl, gives cured products having excellent mechanical and electrical properties and which is particularly suitable as encapsulating material for electrical and electronic components.
    Type: Grant
    Filed: October 28, 1996
    Date of Patent: December 14, 1999
    Assignee: Ciba Specialty Chemicals Corp.
    Inventor: Frans Setiabudi