Patents by Inventor Fransiscus H. C. Benning

Fransiscus H. C. Benning has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for selective soldering
    Patent number: 6655574
    Abstract: The invention relates to a soldering apparatus, including a vessel for containing and heating molten solder, transporting means for transporting objects for soldering to the vessel and removing said objects, at least one tube extending substantially vertically above the soldering vessel, pump means for feeding molten solder to the underside of the tube, and moving means for moving into at least the vicinity of each other the underside of the printed circuit board for soldering and the upper side of the tube, wherein an outflow opening is arranged in each of the tubes at some distance from the upper side of said tubes. By arranging the outflow opening at some distance from the upper side of the tube the outflowing solder flow will no longer contact the printed circuit board and the components present thereon thus allowing more freedom in the design of the printed circuit board and the placing of the components thereon.
    Type: Grant
    Filed: April 10, 2002
    Date of Patent: December 2, 2003
    Assignee: Vitronics Soltec B.V.
    Inventors: Gerrit Schouten, Fransiscus H. C. Benning, Lambertus P. C. Willemen
  • Apparatus for selective soldering
    Publication number: 20020162879
    Abstract: The invention relates to a soldering apparatus, including a vessel for containing and heating molten solder, transporting means for transporting objects for soldering to the vessel and removing said objects, at least one tube extending substantially vertically above the soldering vessel, pump means for feeding molten solder to the underside of the tube, and moving means for moving into at least the vicinity of each other the underside of the printed circuit board for soldering and the upper side of the tube, wherein an outflow opening is arranged in each of the tubes at some distance from the upper side of said tubes. By arranging the outflow opening at some distance from the upper side of the tube the outflowing solder flow will no longer contact the printed circuit board and the components present thereon thus allowing more freedom in the design of the printed circuit board and the placing of the components thereon.
    Type: Application
    Filed: April 10, 2002
    Publication date: November 7, 2002
    Applicant: Vitronics Soltec B.V.
    Inventors: Gerrit Schouten, Fransiscus H.C. Benning, Lambertus P.C. Willemen