Abstract: An apparatus for enhancing the performance of an IC package and media interface. Adding a fissure to a Flip-Chip type package improves the crosstalk performance of the package for both high and low frequencies. The wall of the fissure can be implemented with a heat spreader layer and can be connected to any AC ground such as VSS or VDD package planes. The fissures can also accommodate the ingress of an optical fiber, which allows for a direct interface with the transceivers. The direct optical fiber interface permits the removal of solder balls for high speed signal traces, with their respective vias. On-chip integrated LEDs or other similar light source transceivers can drive the high speed signal media. Selective deposition of low dielectric material can also improve the frequency response of high speed signal package traces.

Abstract: An apparatus for enhancing the performance of an IC package and media interface. Adding a fissure to a Flip-Chip type package improves the crosstalk performance of the package for both high and low frequencies. The wall of the fissure can be implemented with a heat spreader layer and can be connected to any AC ground such as VSS or VDD package planes. The fissures can also accommodate the ingress of an optical fiber, which allows for a direct interface with the transceivers. The direct optical fiber interface permits the removal of solder balls for high speed signal traces, with their respective vias. On-chip integrated LEDs or other similar light source transceivers can drive the high speed signal media. Selective deposition of low dielectric material can also improve the frequency response of high speed signal package traces.

Abstract: A method for enhancing the performance of an IC package and media interface. Adding a fissure to a Flip-Chip type package improves the crosstalk performance of the package for both high and low frequencies. The wall of the fissure can be implemented with a heat spreader layer and can be connected to any AC ground such as VSS or VDD package planes. The fissures can also accommodate the ingress of an optical fiber, which allows for a direct interface with the transceivers. The direct optical fiber interface permits the removal of solder balls for high speed signal traces, with their respective vias. On-chip integrated LEDs or other similar light source transceivers can drive the high speed signal media. Selective deposition of low dielectric material can also improve the frequency response of high speed signal package traces.

Abstract: A method for enhancing the performance of an IC package and media interface. Adding a fissure to a Flip-Chip type package improves the crosstalk performance of the package for both high and low frequencies. The wall of the fissure can be implemented with a heat spreader layer and can be connected to any AC ground such as VSS or VDD package planes. The fissures can also accommodate the ingress of an optical fiber, which allows for a direct interface with the transceivers. The direct optical fiber interface permits the removal of solder balls for high speed signal traces, with their respective vias. On-chip integrated LEDs or other similar light source transceivers can drive the high speed signal media. Selective deposition of low dielectric material can also improve the frequency response of high speed signal package traces.

Abstract: Disclosed is a method of analyzing an integrated-circuit system that is accurate for high frequency analysis and can predict problems at high frequencies that do not occur when the circuit is used at lower frequencies.

Abstract: An embedded memory on an integrated circuit chip is capable of being isolated from other on chip and off chip circuitry during power failure modes on the integrated circuit chip. The embedded memory preferably has its own external power supply. When power on chip fails or falls below a threshold level, input to and output from the embedded memory is prohibited by CMOS isolation cells. The CMOS isolation cells are controlled by enable signals and the power level of other power supplies within the integrated circuit.

Abstract: Disclosed is an analysis methodology and equivalent RLC circuits that accurately model the effects of packaging circuitry, bond wire circuitry and other sources of cross talk within an integrated-circuit signal transmission system.

Abstract: Disclosed is a method of analyzing an integrated-circuit system that is accurate for high frequency analysis and can predict problems at high frequencies that do not occur when the circuit is used at lower frequencies.

Abstract: An embedded memory on an integrated circuit chip is capable of being isolated from other on chip and off chip circuitry during power failure modes on the integrated circuit chip. The embedded memory preferably has its own external power supply. When power on chip fails or falls below a threshold level, input to and output from the embedded memory is prohibited by CMOS isolation cells. The CMOS isolation cells are controlled by enable signals and the power level of other power supplies within the integrated circuit.