Abstract: A package which comprises a carrier, a transducer mounted on the carrier and configured for converting between a package-external property and an electric signal, a package housing at least partially housing at least one of the carrier and the transducer, and a sealing which forms at least part of the package housing for sealing between the package and a package-external body.

Abstract: A package which comprises a carrier, a transducer mounted on the carrier and configured for converting between a package-external property and an electric signal, a package housing at least partially housing at least one of the carrier and the transducer, and a sealing which forms at least part of the package housing for sealing between the package and a package-external body.

Abstract: A method of manufacturing a molded chip package is provided which comprises arranging an electronic chip on a supporting structure; forming an isolation layer at least on portions of the electronic chip; and molding an encapsulation which covers the electronic chip and the supporting structure at least partially by using a molding material comprising a matrix material and a conductive filler material.

Abstract: According to various embodiments, a method of processing a substrate may include: forming a plurality of trenches into a substrate between two chip structures in the substrate, the trenches defining at least one pillar between the two chip structures and a sidewall on each of said two chip structures; disposing an auxiliary carrier on the substrate to hold the chip structures and the at least one pillar; at least partially filling the trenches with encapsulation material to cover the at least one pillar and the sidewalls, thereby at least partially encapsulating the chip structures; removing a portion of the encapsulation material to expose at least a portion of the at least one pillar; and at least partially removing the at least one pillar.

Abstract: A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to the die paddles. A molding compound covers the unit lead frames, including the semiconductor dies. Prior to testing or other processing of the lead frame strip, a gap is etched into a region of the leads which are shared by adjacent ones of the unit lead frames. The gap extends at least mostly through the shared leads. A partial cut is made in the molding compound around the periphery of the unit lead frames prior to the subsequent processing, including below the gap in the shared leads, to electrically isolate the leads of the unit lead frames.

Abstract: According to various embodiments, a method of processing a substrate may include: forming a plurality of trenches into a substrate between two chip structures in the substrate, the trenches defining at least one pillar between the two chip structures and a sidewall on each of said two chip structures; disposing an auxiliary carrier on the substrate to hold the chip structures and the at least one pillar; at least partially filling the trenches with encapsulation material to cover the at least one pillar and the sidewalls, thereby at least partially encapsulating the chip structures; removing a portion of the encapsulation material to expose at least a portion of the at least one pillar; and at least partially removing the at least one pillar.

Abstract: A method of manufacturing a molded chip package is provided which comprises arranging an electronic chip on a supporting structure; forming an isolation layer at least on portions of the electronic chip; and molding an encapsulation which covers the electronic chip and the supporting structure at least partially by using a molding material comprising a matrix material and a conductive filler material.

Abstract: A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to the die paddles. A molding compound covers the unit lead frames, including the semiconductor dies. Prior to testing or other processing of the lead frame strip, a gap is etched into a region of the leads which are shared by adjacent ones of the unit lead frames. The gap extends at least mostly through the shared leads. A partial cut is made in the molding compound around the periphery of the unit lead frames prior to the subsequent processing, including below the gap in the shared leads, to electrically isolate the leads of the unit lead frames.