Abstract: A device for fastening an electronic module on a mounting rail and an electronic module fastened with the device on a mounting rail are provided. The device has a displaceable nose, encompassing a profile of the mounting rail together with a stationary nose provided on the back of a housing of the electronic module. The displaceable nose is configured as a clamping profile of a slide. By plugging in mechanical anchorings, the device is mounted in recesses of the housing on the back of the electronic module. The device has a spring mechanism provided to support the electronic module on the housing. A clamping force of the device on the mounting rail results from a force to the slide applied by the spring mechanism. An end of the slide opposite of the displaceable nose protrudes beyond the housing of the electronic module for the manual displacement of the displaceable nose.

Abstract: A device for fastening an electronic module on a mounting rail and an electronic module fastened with the device on a mounting rail are provided. The device has a displaceable nose, encompassing a profile of the mounting rail together with a stationary nose provided on the back of a housing of the electronic module. The displaceable nose is configured as a clamping profile of a slide. By plugging in mechanical anchorings, the device is mounted in recesses of the housing on the back of the electronic module. The device has a spring mechanism provided to support the electronic module on the housing. A clamping force of the device on the mounting rail results from a force to the slide applied by the spring mechanism. An end of the slide opposite of the displaceable nose protrudes beyond the housing of the electronic module for the manual displacement of the displaceable nose.

Abstract: A device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer has a vacuum chamber, a chuck for receiving a carrier wafer, a heating device for heating up the chuck and a vacuum-chamber cover with a vacuum-holding device, on which a product wafer can be arranged suspended above the carrier wafer. After the evacuation of the vacuum chamber, the active surface of the product wafer is dropped onto a double-sided adhesive film on the carrier wafer and is pressed into place by the rising pressure during air admission. The result is that the wafers are connected together.

Abstract: A device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer has a vacuum chamber, a chuck for receiving a carrier wafer, a heating device for heating up the chuck and a vacuum-chamber cover with a vacuum-holding device, on which a product wafer can be arranged suspended above the carrier wafer. After the evacuation of the vacuum chamber, the active surface of the product wafer is dropped onto a double-sided adhesive film on the carrier wafer and is pressed into place by the rising pressure during air admission. The result is that the wafers are connected together.

Abstract: A device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer has a vacuum chamber, a chuck for receiving a carrier wafer, a heating device for heating up the chuck and a vacuum-chamber cover with a vacuum-holding device, on which a product wafer can be arranged suspended above the carrier wafer. After the evacuation of the vacuum chamber, the active surface of the product wafer is dropped onto a double-sided adhesive film on the carrier wafer and is pressed into place by the rising pressure during air admission. The result is that the wafers are connected together.

Abstract: A housing may hold a control device equipped with heat-producing components. A die-cast housing includes a side wall, a rear wall, a bottom, a cover, a front strut, a cooling element and an air guide device, a cover plate and a front cover. The cooling ribs of the cooling element run parallel to the rear wall, end in the plane of the side wall, and are covered with a bulkhead plate. The bottom and the cover are each provided with perforations for removing heat from the front housing half and openings through which connection lines may be passed. The front strut serves as a lateral frame part for the removable cover plate that covers a lateral access opening of the housing, and for the front cover which can close off the front-side opening of the housing. This results in a housing for a control device in book size format, where the number of assembly parts, the assembly effort and the assembly time are significantly reduced.