Patents by Inventor Franz HOELZLWIMMER

Franz HOELZLWIMMER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for the vapour phase etching of a semiconductor wafer for trace metal analysis
    Patent number: 10861704
    Abstract: The surface layer of a semiconductor wafer lying on a rotatable plate within an etching chamber is etched by a process whereby homogeneous etching of the surface is obtained by introducing an etching gas into the etching chamber in such a way that the flow of the etching gas is not directed directly to the wafer but is allowed first to distribute within the etching chamber before coming into contact with the surface of the semiconductor wafer to be etched.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: December 8, 2020
    Assignee: SILTRONIC AG
    Inventor: Franz Hoelzlwimmer
  • METHOD FOR THE VAPOUR PHASE ETCHING OF A SEMICONDUCTOR WAFER FOR TRACE METAL ANALYSIS
    Publication number: 20190051534
    Abstract: The surface layer of a semiconductor wafer lying on a rotatable plate within an etching chamber is etched by a process whereby homogeneous etching of the surface is obtained by introducing an etching gas into the etching chamber in such a way that the flow of the etching gas is not directed directly to the wafer but is allowed first to distribute within the etching chamber before coming into contact with the surface of the semiconductor wafer to be etched.
    Type: Application
    Filed: March 23, 2017
    Publication date: February 14, 2019
    Applicant: SILTRONIC AG
    Inventor: Franz HOELZLWIMMER