Abstract: An embodiment relates to an integrated circuit comprising measurement means for detection of a current change, wherein said measurement means comprise at least one coil.

Abstract: An example of a power converter is disclosed. At least one converter module provides an alternating output voltage. The converter module is coupled to an output terminal by a conductor path. A current sensor is placed within a magnetic field generated by a current through the conductor path. The current sensor includes at least one magneto-resistive sensing element to provide a sensor signal in response to the magnetic field. A signal generator causes a magnetic self-test field at the magneto-resistive sensing element. A readout circuit receives a first sensor signal of the magneto-resistive sensing element before the magnetic self-test field is applied and a second sensor signal of the magneto-resistive sensing element after the magnetic self-test field is applied. An evaluation circuit determines information indicating a safe operation of the current sensor based on an evaluation of the first sensor signal and the second sensor signal.

Abstract: Sensor devices and corresponding methods are provided where a quantity is measured and monitored over time. The quantity may be related to a lifetime of the sensor device.

Abstract: A sensor arrangement is provided. The sensor arrangement may include at least one sensor element having a first side and a second side opposite the first side and configured for sensing a magnetic field; and an electrically conductive line, wherein a first portion of the electrically conductive line may be arranged on the first side of the at least one sensor element and a second portion of the electrically conductive line may be arranged on the second side of the at least one sensor element in such a way that if a current is flowing through the electrically conductive line, the current has a first direction in the first portion and a second direction opposite the first direction in the second portion, such that a first magnetic field formed by the current in the first portion and a second magnetic field formed by the current in the second portion may at least partly add constructively at a sensing portion of the at least one sensor element.

Abstract: A magnetic sensor may comprise a first linear output sensing element configured to sense a first component of an external magnetic field associated with a first axis. The first linear output sensing element may provide a first output voltage corresponding to the first component of the external magnetic field. The magnetic sensor may also comprise a second linear output sending component configured to sense a second component of the external magnetic field associated with a second axis. The second axis may be substantially orthogonal to the first axis. The second linear output sensing element may provide a second output voltage corresponding to the second component of the external magnetic field. The first output voltage and the second output voltage may be provided to determine an angle, associated with the external magnetic field, corresponding to a plane including the first axis and the second axis.

Abstract: An embodiment relates to an integrated circuit comprising at least two electrical connections and at least one coil arranged adjacent to at least one of the electrical connection, wherein the at least one coil each comprises at least one winding and wherein the at least one coil is arranged on or in the integrated circuit.

Abstract: An example of a device comprises a signal generator to generate a signal causing a magnetic self test field for a magneto-resistive sensing element. A signal input is configures to receive a first sensor signal at a first time instant before the magnetic self test field is applied and a second sensor signal at a second time instant after the magnetic self test field is applied. An evaluation circuit is configured to determine information indicating a safe operation based on an evaluation of the first sensor signal and the second sensor signal.

Abstract: An apparatus for in-situ calibration of a photoacoustic sensor is provided. The apparatus includes a light emitter to emit light along a transmission path to a gas and an acoustic sensor element configured to detect an acoustic signal emitted from the gas based on the received light. Furthermore, the apparatus includes a sensing unit configured to detect the light transmitted along the transmission path and to provide an output signal, and a calibration unit to receive the output signal from the sensing unit and to provide a calibration information based on the output signal received from the sensing unit.

Abstract: A magnetic angle sensor including a first Wheatstone bridge circuit having a plurality of first magnetoresistive elements; and a second Wheatstone bridge circuit having a plurality of second magnetoresistive elements, wherein the plurality of second magnetoresistive elements have diversity with respect to the plurality of first magnetoresistive elements.

Abstract: A magnetic sensor may comprise a first linear output sensing element configured to sense a first component of an external magnetic field associated with a first axis. The first linear output sensing element may provide a first output voltage corresponding to the first component of the external magnetic field. The magnetic sensor may also comprise a second linear output sending component configured to sense a second component of the external magnetic field associated with a second axis. The second axis may be substantially orthogonal to the first axis. The second linear output sensing element may provide a second output voltage corresponding to the second component of the external magnetic field. The first output voltage and the second output voltage may be provided to determine an angle, associated with the external magnetic field, corresponding to a plane including the first axis and the second axis.

Abstract: A semiconductor package includes a semiconductor die attached to a substrate and a magnetic field sensor included as part of the same semiconductor package as the semiconductor die and positioned in close proximity to a current pathway of the semiconductor die so that the magnetic field sensor can sense a magnetic field produced by current flowing in the current pathway. The magnetic field sensor includes a first magnetic field sensing component galvanically isolated from the current pathway and positioned so that a magnetic field produced by current flowing in the current pathway impinges on the first magnetic field sensing component in a first direction. The magnetic field sensor also includes a second magnetic field sensing component galvanically isolated from the current pathway and positioned so that the magnetic field impinges on the second magnetic field sensing component in a second direction different than the first direction.

Abstract: A power semiconductor package includes a substrate having a plurality of metal leads, a power semiconductor die attached to a first one of the leads and a magnetic field sensor integrated in the same power semiconductor package as the power semiconductor die and positioned in close proximity to a current pathway of the power semiconductor die. The magnetic field sensor is operable to generate a signal in response to a magnetic field produced by current flowing in the current pathway, the magnitude of the signal being proportional to the amount of current flowing in the current pathway.

Abstract: A power semiconductor package includes a substrate having a plurality of metal leads, a power semiconductor die attached to a first one of the leads and a magnetic field sensor integrated in the same power semiconductor package as the power semiconductor die and positioned in close proximity to a current pathway of the power semiconductor die. The magnetic field sensor is operable to generate a signal in response to a magnetic field produced by current flowing in the current pathway, the magnitude of the signal being proportional to the amount of current flowing in the current pathway.

Abstract: A semiconductor package includes a semiconductor die attached to a substrate and a magnetic field sensor included as part of the same semiconductor package as the semiconductor die and positioned in close proximity to a current pathway of the semiconductor die so that the magnetic field sensor can sense a magnetic field produced by current flowing in the current pathway. The magnetic field sensor includes a first magnetic field sensing component galvanically isolated from the current pathway and positioned so that a magnetic field produced by current flowing in the current pathway impinges on the first magnetic field sensing component in a first direction. The magnetic field sensor also includes a second magnetic field sensing component galvanically isolated from the current pathway and positioned so that the magnetic field impinges on the second magnetic field sensing component in a second direction different than the first direction.

Abstract: An interconnect module includes a metal clip having a first end section, a second end section and a middle section extending between the first and the second end sections. The first end section is configured for external attachment to a bare semiconductor die or packaged semiconductor die attached to a carrier or to a metal region of the carrier. The second end section is configured for external attachment to a different metal region of the carrier or to a different semiconductor die or packaged semiconductor die attached to the carrier. The module further includes a magnetic field sensor secured to the metal clip. The magnetic field sensor is operable to sense a magnetic field produced by current flowing through the metal clip. The interconnect module can be used to form a direct electrical connection between components and/or metal regions of a carrier to which the module is attached.

Abstract: An example of a device comprises a signal generator to generate a signal causing a magnetic self test field for a magneto-resistive sensing element. A signal input is configures to receive a first sensor signal at a first time instant before the magnetic self test field is applied and a second sensor signal at a second time instant after the magnetic self test field is applied. An evaluation circuit is configured to determine information indicating a safe operation based on an evaluation of the first sensor signal and the second sensor signal.

Abstract: A photo-acoustic gas sensor includes a light emitter unit having a light emitter configured to emit a beam of light pulses with a predetermined repetition frequency and a wavelength corresponding to an absorption band of a gas to be sensed, and a detector unit having a microphone. The light emitter unit is arranged so that the beam of light pulses traverses an area configured to accommodate the gas. The detector unit is arranged so that the microphone can receive a signal oscillating with the repetition frequency.

Abstract: Shown is a gas sensor including a sensor element, a measurement chamber and an emitter element. The sensor element has a MEMS membrane which is arranged in a first substrate region. Furthermore, the measurement chamber is embodied to receive a measurement gas.

Abstract: A sensor arrangement is provided. The sensor arrangement may include at least one sensor element having a first side and a second side opposite the first side and configured for sensing a magnetic field; and an electrically conductive line, wherein a first portion of the electrically conductive line may be arranged on the first side of the at least one sensor element and a second portion of the electrically conductive line may be arranged on the second side of the at least one sensor element in such a way that if a current is flowing through the electrically conductive line, the current has a first direction in the first portion and a second direction opposite the first direction in the second portion, such that a first magnetic field formed by the current in the first portion and a second magnetic field formed by the current in the second portion may at least partly add constructively at a sensing portion of the at least one sensor element.

Abstract: A sensor comprises a matrix switch that includes a number of switching elements configured in a matrix configuration. The sensor comprises one or more sensor elements configured in a sensor matrix configuration. A controller operates to dynamically select one or more signal routes via the switching elements to communicate data from one or more sensor elements of the sensor matrix. The matrix switch can operate to dynamically route multiple signal routes between sensor elements of the sensor to another component based on a set of criteria.