Patents by Inventor Franz Kleinbichler

Franz Kleinbichler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of processing a semiconductor device and chip package
    Patent number: 9614045
    Abstract: In various embodiments, a method of processing a semiconductor device may include providing a semiconductor device comprising a contact pad and a polymer layer; and subjecting at least a part of the contact pad and the polymer layer to a plasma comprising ammonia.
    Type: Grant
    Filed: September 17, 2014
    Date of Patent: April 4, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Srinivasa Reddy Yeduru, Joachim Hirschler, Harald Wiedenhofer, Franz Kleinbichler
  • METHOD OF PROCESSING A SEMICONDUCTOR DEVICE AND CHIP PACKAGE
    Publication number: 20160079087
    Abstract: In various embodiments, a method of processing a semiconductor device may include providing a semiconductor device comprising a contact pad and a polymer layer; and subjecting at least a part of the contact pad and the polymer layer to a plasma comprising ammonia.
    Type: Application
    Filed: September 17, 2014
    Publication date: March 17, 2016
    Inventors: SRINIVASA REDDY YEDURU, JOACHIM HIRSCHLER, HARALD WIEDENHOFER, FRANZ KLEINBICHLER
  • Method of processing a contact pad
    Patent number: 8603910
    Abstract: In various embodiments, a method of processing a contact pad may include providing a contact pad, a topmost layer of the contact pad containing aluminum or an aluminum alloy, at least part of the topmost layer of the contact pad being exposed; subjecting the contact pad to a thermally activated atmosphere containing water or reactive components of water.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: December 10, 2013
    Assignee: Infineon Technologies AG
    Inventors: Marco Koitz, Guenter Zieger, Christian Krenn, Franz Kleinbichler, Guenther Zoth, Karl Mayer
  • METHOD OF PROCESSING A CONTACT PAD
    Publication number: 20130180945
    Abstract: In various embodiments, a method of processing a contact pad may include providing a contact pad, a topmost layer of the contact pad containing aluminum or an aluminum alloy, at least part of the topmost layer of the contact pad being exposed; subjecting the contact pad to a thermally activated atmosphere containing water or reactive components of water.
    Type: Application
    Filed: January 13, 2012
    Publication date: July 18, 2013
    Applicant: Infineon Technologies AG
    Inventors: Marco Koitz, Guenter Zieger, Christian Krenn, Franz Kleinbichler, Guenther Zoth, Karl Mayer