Abstract: To improve the transmission properties of antennae manufactured with known methods, more specifically antennae for application in the UHF range, a method is proposed of producing pattern-forming metal structures on a carrier substrate. The method comprises the following method steps: providing the carrier substrate, forming the pattern on the carrier substrate with a composite material containing dispersed metal, bringing the carrier substrate into contact with halide ions, and thereafter depositing a metal layer onto the pattern formed by the composite material, producing thereby metal structures.

Abstract: The invention relates to a device and method for electrolytically treating flat work pieces (1), more especially for electrolytically treating electrically conductive structures S that are electrically insulated against each other on the surfaces of the work pieces. The method comprises conveying and processing the work pieces (1) on the conveying paths T?, T? in the device, said device comprising at least one assembly A located between tow conveying paths, said assembly including a first and a second rotatable contacting electrode (2, 8) with the contacting electrodes being associated each with one of the conveying paths, and first contacting electrodes (2) abutting against the work pieces being conveyed in a first conveying path T?, and being spaced from the second conveying path T? and second contacting electrodes (8) abutting against the work pieces being conveyed in the second conveying path T? and being spaced to the first conveying path T?.

Abstract: To improve the transmission properties of antennae manufactured with known methods, more specifically antennae for application in the UHF range, a method is proposed of producing pattern-forming metal structures on a carrier substrate. The method comprises the following method steps: providing the carrier substrate, forming the pattern on the carrier substrate with a composite material containing dispersed metal, bringing the carrier substrate into contact with halide ions, and thereafter depositing a metal layer onto the pattern formed by the composite material, producing thereby metal structures.

Abstract: The invention relates to a device and method for electrolytically treating flat work pieces (1), more especially for electrolytically treating electrically conductive structures S that are electrically insulated against each other on the surfaces of the work pieces. The method comprises conveying and processing the work pieces (1) on the conveying paths T?, T? in the device, said device comprising at least one assembly A located between tow conveying paths, said assembly including a first and a second rotatable contacting electrode (2, 8) with the contacting electrodes being associated each with one of the conveying paths, and first contacting electrodes (2) abutting against the work pieces being conveyed in a first conveying path T?, and being spaced from the second conveying path T? and second contacting electrodes (8) abutting against the work pieces being conveyed in the second conveying path T? and being spaced to the first conveying path T?.

Abstract: In order to permit continuous electrolytic treatment of small electrically conductive structures that are electrically insulated against each other on electrically insulating foil material, a device for electrolytically treating electrically conductive structures on surfaces of workpiece (1) that are electrically insulated against each other is provided, said device comprising: a) at least one arrangement, comprising at least one electrode (6) for contacting the work pieces (1) and at least one electrolysis region in a respective one of which at least one counter electrode (4) and the work pieces (1) are in contact with the processing liquid, b) the at least one contacting electrode (4) being disposed outside of the at least on electrolysis region and not being in contact with the processing liquid and c) the at least one contacting electrode (6) and that at least one electrolysis region being spaced so close together that small electrically conductive structures can electrolytically be treated.

Abstract: To form a conductive pattern on dielectric substrates, a method is proposed in which a) a substrate covered with a metal film is coated with a protective layer which is formed by treating the metal film with a solution which contains at least one compound containing nitrogen, b) the protective layer is stripped away by UV radiation at least partially in the regions which do not correspond to the conductive pattern to be formed, in such a way that the metal film is exposed, and c) the exposed metal film is then removed by etching. By means of this method, extremely fine conductive patterns can be manufactured in a reproducible manner on dielectric substrates.

Abstract: A process is described for producing inductively operating counting systems by forming a conducting structure on an electrically non-conducting substrate, comprising a step involving the application of a suitable catalyst for the currentless deposition of metals onto the electrically non-conducting substrate as well as conventional pretreatment and post-treatment steps.