Patents by Inventor Franz Kummer

Franz Kummer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process and apparatus for producting oxidic nanocrystals
    Publication number: 20020051740
    Abstract: The present invention relates to a process for producing oxidic nanocrystals, the process comprising the following steps:
    Type: Application
    Filed: November 6, 2001
    Publication date: May 2, 2002
    Inventors: Armin Konrad, Torsten Fries, Alfred Gahn, Franz Kummer
  • Boron oxide coated phosphor and method of making same
    Patent number: 5985175
    Abstract: A method for forming a continuous, conformal non-particulate coating of boron oxide on individual phosphor particles is provided. The method involves reacting a boron-containing precursor with an oxidizing gas in a fluidized bed of phosphor particles. The boron oxide coated phosphor exhibits an increased quantum efficiency under ultraviolet (UV) and vacuum ultraviolet (VUV) excitation.
    Type: Grant
    Filed: August 19, 1998
    Date of Patent: November 16, 1999
    Assignee: Osram Sylvania Inc.
    Inventors: Chen-Wen Fan, Dale E. Benjamin, Franz Kummer, Charles F. Chenot, Richard G. W. Gingerich
  • Method of making metallic support carrier for semiconductor elements
    Patent number: 4065851
    Abstract: To improve the bonding layer for connecting wires to semiconductor chips with contact fingers, or contact strips, on a substrate carrier, the bonding layer is formed as spongy, microporous structure, applied to discrete positions of the contact strips by screen printing, and secured to the metallic connecting strip by a diffusion zone. Preferably, the bonding layer comprises a metal of gold, palladium, silver, aluminum and copper, or an alloy of at least two of these metals, or a base alloy of one of these metals, for example gold applied as a gold paste having an average grain size of less than 5 micro-meters, the layer being between 2 to 30 micrometers thick, preferably 3 to 10 micrometers. The metal is part of a paste of the metal in an evaporative organic carrier. After screen printing, the carrier is eliminated by heating; subsequent heating converts the metal to a spongy microporous structure bonded to the substrate carrier by a diffusion zone.
    Type: Grant
    Filed: November 3, 1976
    Date of Patent: January 3, 1978
    Assignee: W. C. Heraeus GmbH
    Inventors: Franz Kummer, Gerhard Mai, Rolf Ruthardt, Horst Thiede
  • Metallic support carrier for semiconductor elements
    Patent number: 4027326
    Abstract: To improve the bonding layer for connecting wires to semiconductor chips with contact fingers, or contact strips, on the carrier, the bonding layer is formed as spongy, microporous structure, applied to discrete positions of the contact strips by screen printing, and secured to the metallic connecting strip by a diffusion zone. Preferably, the bonding layer comprises a metal of gold, palladium, silver, aluminum and copper, or an alloy of at least two of these metals, or a base alloy of one of those metals, for example gold applied as a gold paste having an average grain size of less than 5 micrometers, the layer being between 2 to 30 micrometers thick, preferably 3 to 10 micrometers.
    Type: Grant
    Filed: March 20, 1975
    Date of Patent: May 31, 1977
    Assignee: W. C. Heraeus GmbH
    Inventors: Franz Kummer, Gerhard Mai, Rolf Ruthardt, Horst Thiede