Patents by Inventor Franz Laemer

Franz Laemer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensor with at least one micromechanical structure, and method for producing it
    Patent number: 7273764
    Abstract: The invention relates to a sensor with at least one silicon-based micromechanical structure, which is integrated with a sensor chamber of a foundation wafer, and with at least one covering that covers the foundation wafer in the region of the sensor chamber, and to a method for producing a sensor.
    Type: Grant
    Filed: January 3, 2005
    Date of Patent: September 25, 2007
    Assignee: Robert Bosch GmbH
    Inventors: Frank Reichenbach, Stefan Pinter, Frank Henning, Hans Artmann, Helmut Baumann, Franz Laemer, Michael Offenberg, Georg Bischopink
  • Sensor with at least one micromechanical structure, and method for producing it
    Publication number: 20050230708
    Abstract: The invention relates to a sensor with at least one silicon-based micromechanical structure, which is integrated with a sensor chamber of a foundation wafer, and with at least one covering that covers the foundation wafer in the region of the sensor chamber, and to a method for producing a sensor.
    Type: Application
    Filed: January 3, 2005
    Publication date: October 20, 2005
    Inventors: Frank Reichenbach, Stefan Pinter, Frank Henning, Hans Artmann, Helmut Baumann, Franz Laemer, Michael Offenberg, Georg Bischopink
  • Sensor with at least one micromechanical structure and method for production thereof
    Patent number: 6936902
    Abstract: A sensor has a foundation wafer having a sensor chamber, at least one silicon-based micromechanical structure integrated with the sensor chamber of the foundation wafer, at least one covering that covers the foundation wafer in a region of the sensor chamber, the covering including a first layer which is a deposition layer and is permeable to an etching medium and reaction products, and a hermetically sealing second layer which is a sealing layer and located above the first layer, the deposition layer which is the first layer being permeable in a region of the sensor chamber to the etching medium and a reaction product, the deposition layer for being permeable having structures selected from the group consisting of etching openings, porous regions, and both.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: August 30, 2005
    Assignee: Robert Bosch GmbH
    Inventors: Frank Reichenbach, Stefan Pinter, Frank Henning, Hans Artmann, Helmut Baumann, Franz Laemer, Michael Offenberg, Georg Bischopink
  • Sensor with at least one micromechanical structure and method for production thereof
    Publication number: 20040065932
    Abstract: The invention relates to a sensor with at least one silicon-based micromechanical structure, which is integrated with a sensor chamber of a foundation wafer, and with at least one covering that covers the foundation wafer in the region of the sensor chamber, and to a method for producing a sensor.
    Type: Application
    Filed: October 3, 2002
    Publication date: April 8, 2004
    Inventors: Frank Reichenbach, Stefan Pinter, Frank Henning, Hans Artmann, Helmut Baumann, Franz Laemer, Michael Offenberg, Georg Bischopink