Abstract: A method for depositing an anti-adhesion layer onto a surface of micromechanical structures on a substrate. The material or precursor material to be deposited being delivered to the structures in a dissolution and transport medium. A supercritical CO2 fluid is present as the dissolution and transport medium. Deposition of the material or precursor material is brought about by a change in the physical state of the CO2 fluid or by a surface reaction between the surface and the precursor material. The method makes possible subsequent coating of the micromechanical structures in a cavity after encapsulation thereof, the material to be deposited being delivered via access channels or perforation holes.

Abstract: A micromechanical component having a substrate conductive in at least some regions; an elastically deflectable diaphragm, which is conductive in at least some regions, arches over a front side of the substrate, and is electrically insulated from the substrate, the diaphragm having an inner region (I; I?) and an edge region (RB; RB?); and a hollow space (H), which is provided between the substrate (1) and the diaphragm (M); the inner region (I; I?) having a cross-section that is modified in comparison with the edge region (RB; RB?), which means that the bending of the inner region (I; I?) is less than that in the case of an identical cross-section.

Abstract: A micromechanical component having a substrate conductive in at least some regions; an elastically deflectable diaphragm, which is conductive in at least some regions, arches over a front side of the substrate, and is electrically insulated from the substrate, the diaphragm having an inner region (I; I?) and an edge region (RB; RB?); and a hollow space (H), which is provided between the substrate (1) and the diaphragm (M); the inner region (I; I?) having a cross-section that is modified in comparison with the edge region (RB; RB?), which means that the bending of the inner region (I; I?) is less than that in the case of an identical cross-section.

Abstract: A biochip for electrical, e.g., capacitive, detection of biochemical molecules has an electrode array on a substrate, the electrodes of the electrode array being each connected through the substrate to an electrically conductive contact surface via an electrical conductor. The contact surfaces are situated on the side of the substrate facing away from the electrode array and form the outermost plane of the substrate on this side.