Abstract: The invention relates to a heat sink (1) for an electronic or electrical component, including: a base element (2) including a first main surface (2a) suitable for receiving the electronic component in close thermal contact; a plurality of elongate fins (3) projecting outwards from the second main surface (2b) of the base element (2), opposite the first surface (2a), and arranged around the entire periphery of the case element with enough space between fins to allow air circulation, characterized in that said space can be obtained by cutting a star-shaped geometrical shape matching said base element and said fins in a thin plate; and folding the fins relative to the plane of the base element.

Abstract: The invention relates to a heat sink (1) for an electronic or electrical component, including: a base element (2) including a first main surface (2a) suitable for receiving the electronic component in close thermal contact; a plurality of elongate fins (3) projecting outwards from the second main surface (2b) of the base element (2), opposite the first surface (2a), and arranged around the entire periphery of the case element with enough space between fins to allow air circulation, characterised in that said space can be obtained by cutting a star-shaped geometrical shape matching said base element and said fins in a thin plate; and folding the fins relative to the plane of the base element.