Abstract: A sound test device for testing a DUT in particular a MEMS microphone, comprises a sound chamber a socket unit and a sound generator unit, wherein the sound generator unit includes a speaker comprising a speaker membrane, an opening, and a reference microphone comprising a microphone membrane wherein the opening is adapted to receive a DUT opening of the DUT and wherein the microphone membrane and the opening are arranged to opposing each other, and the socket unit includes the at least one contact element being adapted to contact to a contact terminal of the DUT, and wherein the sound chamber is limited by the speaker membrane, the microphone membrane, and the opening.

Abstract: An apparatus for testing electronic devices, having a test head coupled to at least one immovably mounted test socket, a positioning device for positioning the electronic device in testing position and a lead-backer attached to the positioning device for supporting the electronic device and pressing it against the test socket. A supply port for supplying a temperature control medium to a temperature control system of the said lead-backer is immovably mounted beside the said test socket, the said temperature control system of the said lead-backer and the said supply port communicate with each other when the electronic device is in testing position, whereby the said temperature control medium flows from the said supply port to the said temperature control system of the said lead-backer.

Abstract: An apparatus for testing electronic devices, having a test head coupled to at least one immovably mounted test socket, a positioning device for positioning the electronic device in testing position and a lead-backer attached to the positioning device for supporting the electronic device and pressing it against the test socket. A supply port for supplying a temperature control medium to a temperature control system of the said lead-backer is immovably mounted beside the said test socket, the said temperature control system of the said lead-backer and the said supply port communicate with each other when the electronic device is in testing position, whereby the said temperature control medium flows from the said supply port to the said temperature control system of the said lead-backer.

Abstract: A plunger for holding and moving electrical components in particular IC's to and from a contacting device connected to a test bed, comprises a head piece with a fluid distribution chamber through which temperature-controlled fluid flows. A suction head is arranged such that the temperature-controlled fluid flows around the suction head and is diverted along the suction head to the component.

Abstract: A handler for electronic components, in particular IC's, for controlling the temperature of the components and supplying and removing said components to and from a test device has circulating units that can be moved along a circulating track. Each unit has at least one retaining unit for retaining a component. In addition, the circulating units have temperature-control chambers containing components that are retained by the retaining units, so that the temperature of the components can be controlled during transport from the charging station to the test station.

Abstract: A handler for electronic components, in particular IC's, for controlling the temperature of the components and supplying and removing said components to and from a test device has circulating units that can be moved along a circulating track. Each unit has at least one retaining unit for retaining a component. In addition, the circulating units have temperature-control chambers containing components that are retained by the retaining units, so that the temperature of the components can be controlled during transport from the charging station to the test station.

Abstract: A plunger for holding and moving electrical components in particular IC's to and from a contacting device connected to a test bed, comprises a head piece with a fluid distribution chamber through which temperature-controlled fluid flows. A suction head is arranged such that the temperature-controlled fluid flows around the suction head and is diverted along the suction head to the component.

Abstract: The invention relates to a tempering chamber for tempering electronic components, in particular, IC's, with a circulating device (15) with a number of carrier elements (18) running in a circle and two support devices arranged on opposite sides of the carrier elements (18) are provided within a housing (14), wherein the carrier elements (18) are mounted on said support elements such that the alignment of the carrier elements (18) is unaltered on circulation.