Patents by Inventor Franz Reithner

Franz Reithner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9659798
    Abstract: A system produces devices that include a semiconductor part and a non-semiconductor part. A front end is configured to receive a semiconductor part and to process the semiconductor part. A back end is configured to receive the processed semiconductor part and to assemble the processed semiconductor part and a non-semiconductor part into a device. A transfer device is configured to automatically handle the semiconductor part in the front end and to automatically transfer the processed semiconductor part to the back end.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: May 23, 2017
    Assignee: Infineon Technologies AG
    Inventors: Oskar Neuhoff, Tobias Gamon, Norbert Martin Haueis, Dirk Pikorz, Michael Wolfgang Larisch, Franz Reithner
  • Publication number: 20120284977
    Abstract: A system produces devices that include a semiconductor part and a non-semiconductor part. A front end is configured to receive a semiconductor part and to process the semiconductor part. A back end is configured to receive the processed semiconductor part and to assemble the processed semiconductor part and a non-semiconductor part into a device. A transfer device is configured to automatically handle the semiconductor part in the front end and to automatically transfer the processed semiconductor part to the back end.
    Type: Application
    Filed: July 25, 2012
    Publication date: November 15, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Oskar Neuhoff, Tobias Gamon, Norbert Martin Haueis, Dirk Pikorz, Michael Wolfgang Larisch, Franz Reithner
  • Patent number: 8309465
    Abstract: A system produces devices that include a semiconductor part and a non-semiconductor part. A front end is configured to receive a semiconductor part and to process the semiconductor part. A back end is configured to receive the processed semiconductor part and to assemble the processed semiconductor part and a non-semiconductor part into a device. A transfer device is configured to automatically handle the semiconductor part in the front end and to automatically transfer the processed semiconductor part to the back end.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: November 13, 2012
    Assignee: Infineon Technologies AG
    Inventors: Oskar Neuhoff, Tobias Gamon, Norbert Martin Haueis, Dirk Pikorz, Michael Wolfgang Larisch, Franz Reithner
  • Publication number: 20120186052
    Abstract: A system produces devices that include a semiconductor part and a non-semiconductor part. A front end is configured to receive a semiconductor part and to process the semiconductor part. A back end is configured to receive the processed semiconductor part and to assemble the processed semiconductor part and a non-semiconductor part into a device. A transfer device is configured to automatically handle the semiconductor part in the front end and to automatically transfer the processed semiconductor part to the back end.
    Type: Application
    Filed: January 21, 2011
    Publication date: July 26, 2012
    Inventors: Oskar Neuhoff, Tobias Gamon, Norbert Martin Haueis, Dirk Pikorz, Michael Wolfgang Larisch, Franz Reithner